公开(公告)号：US20140210068A1

公开(公告)日：2014-07-31

申请号：US13754149

申请日：2013-01-30

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Gerald K. Bartley ,  Charles L. Johnson ,  John E. Kelly, III ,  Joseph Kuczynski ,  David R. Motschman ,  Arvind K. Sinha ,  Kevin A. Splittstoesser ,  Timothy A. Tofil

IPC: H01L21/50 ,  H01L23/00

CPC classification number: H01L23/00 ,  H01L21/4882 ,  H01L23/36 ,  H01L23/373 ,  H01L23/42 ,  H01L23/4275 ,  H01L23/481 ,  H01L25/0657 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The chip stack of semiconductor chips with enhanced cooling apparatus includes a first chip with circuitry on a first side and a second chip electrically and mechanically coupled to the first chip by a grid of connectors. The apparatus further includes a thermal interface material pad between the first chip and the second chip, wherein the thermal interface material pad includes nanofibers aligned parallel to mating surfaces of the first chip and the second chip, and a heat removal device thermally connected to the thermal interface material pad.

Abstract translation: 具有增强的冷却装置的半导体芯片的芯片堆叠包括具有第一侧上的电路的第一芯片和通过连接器格栅电和机械地耦合到第一芯片的第二芯片。 该装置还包括在第一芯片和第二芯片之间的热界面材料焊盘，其中热界面材料焊盘包括平行于第一芯片和第二芯片的配合表面排列的纳米纤维，以及热连接到热 界面材料垫。

公开(公告)号：US09245813B2

公开(公告)日：2016-01-26

申请号：US13754149

申请日：2013-01-30

Applicant: International Business Machines Corporation

Inventor： Gerald K. Bartley ,  Charles L. Johnson ,  John E. Kelly, III ,  Joseph Kuczynski ,  David R. Motschman ,  Arvind K Sinha ,  Kevin A. Splittstoesser ,  Timothy A. Tofil

IPC: H01L23/34 ,  H01L23/00 ,  H01L23/373 ,  H01L23/36 ,  H01L23/42 ,  H01L23/427 ,  H01L21/48 ,  H01L25/065 ,  H01L23/48

CPC classification number: H01L23/00 ,  H01L21/4882 ,  H01L23/36 ,  H01L23/373 ,  H01L23/42 ,  H01L23/4275 ,  H01L23/481 ,  H01L25/0657 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The chip stack of semiconductor chips with enhanced cooling apparatus includes a first chip with circuitry on a first side and a second chip electrically and mechanically coupled to the first chip by a grid of connectors. The apparatus further includes a thermal interface material pad between the first chip and the second chip, wherein the thermal interface material pad includes nanofibers aligned parallel to mating surfaces of the first chip and the second chip, and a heat removal device thermally connected to the thermal interface material pad.

Abstract translation: 具有增强的冷却装置的半导体芯片的芯片堆叠包括具有第一侧上的电路的第一芯片和通过连接器格栅电和机械地耦合到第一芯片的第二芯片。 该装置还包括在第一芯片和第二芯片之间的热界面材料焊盘，其中热界面材料焊盘包括平行于第一芯片和第二芯片的配合表面排列的纳米纤维，以及热连接到热 界面材料垫。