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    Measuring and controlling electromagnetic radiation emitted by electronic components
    2.
    发明授权
    Measuring and controlling electromagnetic radiation emitted by electronic components 有权

    公开(公告)号：US10101462B2

    公开(公告)日：2018-10-16

    申请号：US14883443

    申请日：2015-10-14

    Applicant: International Business Machines Corporation

    Inventor： Matthew S. Doyle ,  Joseph Kuczynski ,  Kevin A. Splittstoesser ,  Timothy J. Tofil

    IPC: G01S19/37

    Abstract: An apparatus and system for measuring electromagnetic radiation emitted by one or more electronic components included on a first substrate, and an associated method of controlling the emitted radiation. The apparatus includes a cap member having an interior surface and an exterior surface, the interior surface defining an interior cavity and arranged to receive at least a portion of the one or more electronic components within the interior cavity. The apparatus further includes at least one sensor device coupled with the cap member and configured to detect electromagnetic radiation emitted by the one or more electronic components. The apparatus further includes at least one conductive pad disposed on the cap member and coupled with the at least one sensor device, wherein the conductive pad is configured to couple with external circuitry to transmit a sensor signal generated by the at least one sensor device responsive to the detected electromagnetic radiation.

    THERMOSET RESIN FLOW MODELS FOR PRINTED CIRCUIT BOARD LAMINATES
    4.
    发明申请
    THERMOSET RESIN FLOW MODELS FOR PRINTED CIRCUIT BOARD LAMINATES 审中-公开
    印刷电路板层压板的热固性树脂流动模型

    公开(公告)号：US20170017733A1

    公开(公告)日：2017-01-19

    申请号：US14798818

    申请日：2015-07-14

    Applicant: International Business Machines Corporation

    Inventor： Joseph Kuczynski ,  Arvind K. Sinha ,  Kevin A. Splittstoesser ,  Timothy J. Tofil

    IPC: G06F17/50

    CPC classification number: G06F17/5018 ,  G06F17/5068

    Abstract: In an example, a method includes storing thermoset resin rheology data associated with a thermoset resin at a memory. The thermoset resin rheology data includes a plurality of sets of dynamic fluid flow properties that are measured for the thermoset resin. The method includes receiving, at a computing device, information associated with a printed circuit board (PCB) laminate design. The method also includes receiving, at the computing device, a first set of PCB lamination parameters. The method further includes storing, at the computing device, a first thermoset resin flow model. The first thermoset resin flow model is generated based on the thermoset resin rheology data, the information associated with the PCB laminate design, and the first set of PCB lamination parameters.

    Abstract translation: 在一个实例中，一种方法包括将与热固性树脂相关的热固性树脂流变学数据存储在存储器中。 热固性树脂流变学数据包括针对热固性树脂测量的多组动态流体流动性质。 该方法包括在计算设备处接收与印刷电路板（PCB）叠层设计相关联的信息。 该方法还包括在计算设备处接收第一组PCB层叠参数。 该方法还包括在计算设备处存储第一热固树脂流模型。 第一个热固树脂流动模型基于热固性树脂流变学数据，与PCB层压板设计相关的信息以及第一组PCB层压参数生成。

    ELECTRONIC DATA SECURITY APPARATUS
    5.
    发明申请
    ELECTRONIC DATA SECURITY APPARATUS 有权
    电子数据安全装置

    公开(公告)号：US20160283742A1

    公开(公告)日：2016-09-29

    申请号：US15178589

    申请日：2016-06-10

    Applicant: International Business Machines Corporation

    Inventor： Matthew S. Doyle ,  Joseph Kuczynski ,  Kevin A. Splittstoesser ,  Timothy J. Tofil

    IPC: G06F21/62 ,  G01R17/00

    CPC classification number: G06F21/6245 ,  G01N27/045 ,  G01R17/00 ,  G01R27/02 ,  G06F21/60 ,  G06F21/87 ,  H05K3/30

    Abstract: An apparatus for providing security for an integrated circuit (IC) chip is disclosed. The apparatus may include the IC chip, attached to a surface of a printed circuit board (PCB). The PCB may include a first, electrically insulative, conformal coating layer attached to the PCB surface and to exposed IC chip surfaces. The PCB may also include a Wheatstone bridge circuit to indicate changes to a second, X-ray opaque, optically opaque and electrically resistive, conformal coating layer. The circuit may include four resistors, formed from second conformal coating layer regions, four sets of electrically conductive pads on the PCB, each set electrically connected to a resistor of the four resistors. The circuit may also include a voltage source, connected to two conductive pads and a monitoring device, connected to another two conductive pads and configured to detect a change of resistance of the Wheatstone bridge.

    Abstract translation: 公开了一种用于为集成电路（IC）芯片提供安全性的装置。 该装置可以包括附接到印刷电路板（PCB）的表面的IC芯片。 PCB可以包括附接到PCB表面和暴露的IC芯片表面的第一，电绝缘的保形涂层。 PCB还可以包括惠斯通电桥电路，以指示对第二X射线不透明，光学不透明和电阻的保形涂层的变化。 电路可以包括由第二共形涂层区域形成的四个电阻器，PCB上的四组导电焊盘，每组电连接到四个电阻器的电阻器。 电路还可以包括连接到两个导电焊盘的电压源和监控装置，其连接到另外两个导电焊盘并被配置成检测惠斯通电桥的电阻变化。

    IMPLEMENTING EMBEDDED HYBRID ELECTRICAL-OPTICAL PCB CONSTRUCT
    7.
    发明申请
    IMPLEMENTING EMBEDDED HYBRID ELECTRICAL-OPTICAL PCB CONSTRUCT 有权
    实现嵌入式混合电光PCB构造

    公开(公告)号：US20140205232A1

    公开(公告)日：2014-07-24

    申请号：US13745982

    申请日：2013-01-21

    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

    Inventor： Matthew S. Doyle ,  Joseph Kuczynski ,  Kevin A. Splittstoesser ,  Timothy J. Tofil

    IPC: G02B6/122 ,  G02B6/13

    CPC classification number: G02B6/122 ,  G02B6/13 ,  H05K1/0274 ,  H05K2201/2054 ,  Y10T156/10 ,  Y10T156/1039

    Abstract: Methods and structures are provided for implementing embedded hybrid electrical-optical printed circuit board (PCB) constructs. The embedded hybrid electrical-optical PCB construct includes electrical channels and optical channels within a single physical PCB layer. The embedded hybrid electrical-optical PCB construct includes an electrically conductive sheet or a copper sheet, and a reflective mesh adhesive layer provided with the electrical channels and optical channels within the single physical PCB layer.

    Abstract translation: 提供了实现嵌入式混合电光印刷电路板（PCB）结构的方法和结构。 嵌入式混合电光PCB构造包括在单个物理PCB层内的电通道和光通道。 嵌入式混合电光PCB构造包括导电片或铜片，以及在单个物理PCB层内设置有电通道和光通道的反射网状粘合剂层。

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