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公开(公告)号：US11085672B2
公开(公告)日：2021-08-10
申请号：US16268890
申请日：2019-02-06
IPC分类号： H01L23/42 , F24V30/00 , H01L23/427 , H01L23/373 , H01L23/34
摘要： A self-heating thermal interface material (TIM) may be formed using heating components dispersed within the TIM. The heating components may produce heat when the TIM is compressed. The heating components may be formed from microcapsules and the microcapsules may contain exothermic reactants. The reactants may be isolated from contact within the microcapsule until a compressive force is applied.
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公开(公告)号：US10101462B2
公开(公告)日：2018-10-16
申请号：US14883443
申请日：2015-10-14
IPC分类号： G01S19/37
摘要： An apparatus and system for measuring electromagnetic radiation emitted by one or more electronic components included on a first substrate, and an associated method of controlling the emitted radiation. The apparatus includes a cap member having an interior surface and an exterior surface, the interior surface defining an interior cavity and arranged to receive at least a portion of the one or more electronic components within the interior cavity. The apparatus further includes at least one sensor device coupled with the cap member and configured to detect electromagnetic radiation emitted by the one or more electronic components. The apparatus further includes at least one conductive pad disposed on the cap member and coupled with the at least one sensor device, wherein the conductive pad is configured to couple with external circuitry to transmit a sensor signal generated by the at least one sensor device responsive to the detected electromagnetic radiation.
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公开(公告)号：US09697380B2
公开(公告)日：2017-07-04
申请号：US15178589
申请日：2016-06-10
CPC分类号： G06F21/6245 , G01N27/045 , G01R17/00 , G01R27/02 , G06F21/60 , G06F21/87 , H05K3/30
摘要： An apparatus for providing security for an integrated circuit (IC) chip is disclosed. The apparatus may include the IC chip, attached to a surface of a printed circuit board (PCB). The PCB may include a first, electrically insulative, conformal coating layer attached to the PCB surface and to exposed IC chip surfaces. The PCB may also include a Wheatstone bridge circuit to indicate changes to a second, X-ray opaque, optically opaque and electrically resistive, conformal coating layer. The circuit may include four resistors, formed from second conformal coating layer regions, four sets of electrically conductive pads on the PCB, each set electrically connected to a resistor of the four resistors. The circuit may also include a voltage source, connected to two conductive pads and a monitoring device, connected to another two conductive pads and configured to detect a change of resistance of the Wheatstone bridge.
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公开(公告)号：US20170017733A1
公开(公告)日：2017-01-19
申请号：US14798818
申请日：2015-07-14
IPC分类号： G06F17/50
CPC分类号： G06F17/5018 , G06F17/5068
摘要： In an example, a method includes storing thermoset resin rheology data associated with a thermoset resin at a memory. The thermoset resin rheology data includes a plurality of sets of dynamic fluid flow properties that are measured for the thermoset resin. The method includes receiving, at a computing device, information associated with a printed circuit board (PCB) laminate design. The method also includes receiving, at the computing device, a first set of PCB lamination parameters. The method further includes storing, at the computing device, a first thermoset resin flow model. The first thermoset resin flow model is generated based on the thermoset resin rheology data, the information associated with the PCB laminate design, and the first set of PCB lamination parameters.
摘要翻译： 在一个实例中，一种方法包括将与热固性树脂相关的热固性树脂流变学数据存储在存储器中。 热固性树脂流变学数据包括针对热固性树脂测量的多组动态流体流动性质。 该方法包括在计算设备处接收与印刷电路板（PCB）叠层设计相关联的信息。 该方法还包括在计算设备处接收第一组PCB层叠参数。 该方法还包括在计算设备处存储第一热固树脂流模型。 第一个热固树脂流动模型基于热固性树脂流变学数据，与PCB层压板设计相关的信息以及第一组PCB层压参数生成。
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公开(公告)号：US20160283742A1
公开(公告)日：2016-09-29
申请号：US15178589
申请日：2016-06-10
CPC分类号： G06F21/6245 , G01N27/045 , G01R17/00 , G01R27/02 , G06F21/60 , G06F21/87 , H05K3/30
摘要： An apparatus for providing security for an integrated circuit (IC) chip is disclosed. The apparatus may include the IC chip, attached to a surface of a printed circuit board (PCB). The PCB may include a first, electrically insulative, conformal coating layer attached to the PCB surface and to exposed IC chip surfaces. The PCB may also include a Wheatstone bridge circuit to indicate changes to a second, X-ray opaque, optically opaque and electrically resistive, conformal coating layer. The circuit may include four resistors, formed from second conformal coating layer regions, four sets of electrically conductive pads on the PCB, each set electrically connected to a resistor of the four resistors. The circuit may also include a voltage source, connected to two conductive pads and a monitoring device, connected to another two conductive pads and configured to detect a change of resistance of the Wheatstone bridge.
摘要翻译： 公开了一种用于为集成电路（IC）芯片提供安全性的装置。 该装置可以包括附接到印刷电路板（PCB）的表面的IC芯片。 PCB可以包括附接到PCB表面和暴露的IC芯片表面的第一，电绝缘的保形涂层。 PCB还可以包括惠斯通电桥电路，以指示对第二X射线不透明，光学不透明和电阻的保形涂层的变化。 电路可以包括由第二共形涂层区域形成的四个电阻器，PCB上的四组导电焊盘，每组电连接到四个电阻器的电阻器。 电路还可以包括连接到两个导电焊盘的电压源和监控装置，其连接到另外两个导电焊盘并被配置成检测惠斯通电桥的电阻变化。
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公开(公告)号：US09081137B2
公开(公告)日：2015-07-14
申请号：US13745982
申请日：2013-01-21
CPC分类号： G02B6/122 , G02B6/13 , H05K1/0274 , H05K2201/2054 , Y10T156/10 , Y10T156/1039
摘要： Methods and structures are provided for implementing embedded hybrid electrical-optical printed circuit board (PCB) constructs. The embedded hybrid electrical-optical PCB construct includes electrical channels and optical channels within a single physical PCB layer. The embedded hybrid electrical-optical PCB construct includes an electrically conductive sheet or a copper sheet, and a reflective mesh adhesive layer provided with the electrical channels and optical channels within the single physical PCB layer.
摘要翻译： 提供了实现嵌入式混合电光印刷电路板（PCB）结构的方法和结构。 嵌入式混合电光PCB构造包括在单个物理PCB层内的电通道和光通道。 嵌入式混合电光PCB构造包括导电片或铜片，以及在单个物理PCB层内设置有电通道和光通道的反射网状粘合剂层。
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公开(公告)号：US20140205232A1
公开(公告)日：2014-07-24
申请号：US13745982
申请日：2013-01-21
CPC分类号： G02B6/122 , G02B6/13 , H05K1/0274 , H05K2201/2054 , Y10T156/10 , Y10T156/1039
摘要： Methods and structures are provided for implementing embedded hybrid electrical-optical printed circuit board (PCB) constructs. The embedded hybrid electrical-optical PCB construct includes electrical channels and optical channels within a single physical PCB layer. The embedded hybrid electrical-optical PCB construct includes an electrically conductive sheet or a copper sheet, and a reflective mesh adhesive layer provided with the electrical channels and optical channels within the single physical PCB layer.
摘要翻译： 提供了实现嵌入式混合电光印刷电路板（PCB）结构的方法和结构。 嵌入式混合电光PCB构造包括在单个物理PCB层内的电通道和光通道。 嵌入式混合电光PCB构造包括导电片或铜片，以及在单个物理PCB层内设置有电通道和光通道的反射网状粘合剂层。
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公开(公告)号：US10309692B2
公开(公告)日：2019-06-04
申请号：US14937944
申请日：2015-11-11
摘要： A self-heating thermal interface material (TIM) may be formed using heating components dispersed within the TIM. The heating components may produce heat when the TIM is compressed. The heating components may be formed from microcapsules and the microcapsules may contain exothermic reactants. The reactants may be isolated from contact within the microcapsule until a compressive force is applied.
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公开(公告)号：US09942990B2
公开(公告)日：2018-04-10
申请号：US15245361
申请日：2016-08-24
IPC分类号： H05K3/02 , H05K3/26 , H01P3/02 , H05K1/02 , H05K1/11 , H05K1/18 , H05K3/46 , H05K1/09 , H05K3/38 , H05K3/06 , H05K1/03
CPC分类号： H05K3/26 , H01P3/02 , H05K1/0213 , H05K1/0237 , H05K1/0242 , H05K1/0298 , H05K1/0393 , H05K1/09 , H05K1/111 , H05K1/115 , H05K1/181 , H05K3/06 , H05K3/064 , H05K3/382 , H05K3/46 , H05K3/4611 , H05K2201/0355 , H05K2201/0391 , Y10T29/49117 , Y10T29/49124 , Y10T29/49155 , Y10T29/49156
摘要： A circuit apparatuses include at least one circuit feature formed from patterning a conductive sheet. The conductive sheet includes an irregular surface and a planarized surface. Conductive sheet roughness is minimized in first regions of the circuit apparatus and is maintained in second regions of the circuit apparatus. Selectively planarizing portions of the conductive sheet allows for the utilization of lower cost rougher conductive sheets. The planarized surface allows for increased signal integrity and reduced insertion loss and the irregular surface allows for increased adhesion and enhancing reliability of the circuit apparatus.
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公开(公告)号：US09926471B2
公开(公告)日：2018-03-27
申请号：US15717740
申请日：2017-09-27
CPC分类号： C09J11/04 , A61K9/5094 , B01J13/02 , B01J13/22
摘要： A self-heating sealant or adhesive may be formed using multi-compartment microcapsules dispersed within a sealant or adhesive. The multi-compartment microcapsules produce heat when subjected to a stimulus (e.g., a compressive force, a magnetic field, or combinations thereof). In some embodiments, the multi-compartment microcapsules have first and second compartments separated by an isolating structure adapted to rupture in response to the stimulus, wherein the first and second compartments contain reactants that come in contact and react to produce heat when the isolating structure ruptures. In some embodiments, the multi-compartment microcapsules are shell-in-shell microcapsules each having an inner shell contained within an outer shell, wherein the inner shell defines the isolating structure and the outer shell does not allow the heat-generating chemistry to escape the microcapsule upon rupture of the inner shell.
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