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公开(公告)号：US09655287B1
公开(公告)日：2017-05-16
申请号：US15014101
申请日：2016-02-03
发明人： Raymond F. Babcock , Matthew A. Butterbaugh , Eric A. Eckberg , Gerhard I. Meijer , David R. Motschman
CPC分类号： H05K7/20809 , F28D15/00 , F28D2021/0031 , F28F1/02 , F28F1/124 , F28F3/022 , F28F3/06 , F28F3/12 , F28F9/262 , F28F2215/10 , F28F2250/08 , G06F1/20 , H01L23/473 , H05K1/0203 , H05K7/20772
摘要： A heat exchanger includes a flat metal tube that has flat top and bottom surfaces and an inner passage. The surfaces remove heat from a liquid passing through the passage from an inlet and toward an outlet of the heat exchanger. A first plurality of solid metal posts are mounted perpendicularly upon the top surface. Each fin of a first plurality of fins has holes fitted about the first plurality of posts such that the fins are mounted on the posts in vertically-spaced, parallel alignment relative to each other and the top surface. A second plurality of solid metal posts are mounted perpendicularly upon the bottom surface. Each fin of a second plurality of fins has holes fitted about the second plurality of posts such that the fins are mounted on the posts in vertically-spaced, parallel alignment relative to each other and the bottom surface.
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公开(公告)号：US09609785B1
公开(公告)日：2017-03-28
申请号：US15014114
申请日：2016-02-03
发明人： Raymond F. Babcock , Matthew A. Butterbaugh , Eric A. Eckberg , Gerhard I. Meijer , David R. Motschman
CPC分类号： H05K7/20154 , H01L23/3672 , H01L23/467
摘要： A system includes an integrated circuit and a heatsink mounted thereon. The heatsink includes a flat base plate thermally coupled to a top surface of the integrated circuit, thermally-conductive solid metal posts mounted perpendicularly on the base plate, and flat metal fins. Each of the fins has holes fitted about the posts such that the fins are mounted on the posts in vertically-spaced, parallel alignment relative to each other and the top surface of the base plate. The system further includes a load plate mounted upon top surfaces of the posts, a printed circuit board, and a microprocessor socket mounted on the printed circuit board. The microprocessor socket includes a socket base upon which the integrated circuit is mounted such that the integrated circuit is electrically coupled through the socket base to the printed circuit board. Air may be forced through the heatsink.
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3.发明申请HORIZONTALLY ALIGNED GRAPHITE NANOFIBERS IN ETCHED SILICON WAFER TROUGHS FOR ENHANCED THERMAL PERFORMANCE 有权用于增强热性能的蚀刻硅砂轮中的水平对准的石墨纳米纤维公开(公告)号：US20140210068A1
公开(公告)日：2014-07-31
申请号：US13754149
申请日：2013-01-30
发明人： Gerald K. Bartley , Charles L. Johnson , John E. Kelly, III , Joseph Kuczynski , David R. Motschman , Arvind K. Sinha , Kevin A. Splittstoesser , Timothy A. Tofil
CPC分类号： H01L23/00 , H01L21/4882 , H01L23/36 , H01L23/373 , H01L23/42 , H01L23/4275 , H01L23/481 , H01L25/0657 , H01L2225/06513 , H01L2225/06541 , H01L2225/06589 , H01L2924/0002 , H01L2924/00
摘要： The chip stack of semiconductor chips with enhanced cooling apparatus includes a first chip with circuitry on a first side and a second chip electrically and mechanically coupled to the first chip by a grid of connectors. The apparatus further includes a thermal interface material pad between the first chip and the second chip, wherein the thermal interface material pad includes nanofibers aligned parallel to mating surfaces of the first chip and the second chip, and a heat removal device thermally connected to the thermal interface material pad.
摘要翻译： 具有增强的冷却装置的半导体芯片的芯片堆叠包括具有第一侧上的电路的第一芯片和通过连接器格栅电和机械地耦合到第一芯片的第二芯片。 该装置还包括在第一芯片和第二芯片之间的热界面材料焊盘，其中热界面材料焊盘包括平行于第一芯片和第二芯片的配合表面排列的纳米纤维，以及热连接到热 界面材料垫。
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4.发明授权Horizontally aligned graphite nanofibers in etched silicon wafer troughs for enhanced thermal performance 有权在蚀刻的硅晶圆槽中采用水平对准的石墨纳米纤维，以提高热性能公开(公告)号：US09245813B2
公开(公告)日：2016-01-26
申请号：US13754149
申请日：2013-01-30
发明人： Gerald K. Bartley , Charles L. Johnson , John E. Kelly, III , Joseph Kuczynski , David R. Motschman , Arvind K Sinha , Kevin A. Splittstoesser , Timothy A. Tofil
IPC分类号： H01L23/34 , H01L23/00 , H01L23/373 , H01L23/36 , H01L23/42 , H01L23/427 , H01L21/48 , H01L25/065 , H01L23/48
CPC分类号： H01L23/00 , H01L21/4882 , H01L23/36 , H01L23/373 , H01L23/42 , H01L23/4275 , H01L23/481 , H01L25/0657 , H01L2225/06513 , H01L2225/06541 , H01L2225/06589 , H01L2924/0002 , H01L2924/00
摘要： The chip stack of semiconductor chips with enhanced cooling apparatus includes a first chip with circuitry on a first side and a second chip electrically and mechanically coupled to the first chip by a grid of connectors. The apparatus further includes a thermal interface material pad between the first chip and the second chip, wherein the thermal interface material pad includes nanofibers aligned parallel to mating surfaces of the first chip and the second chip, and a heat removal device thermally connected to the thermal interface material pad.
摘要翻译： 具有增强的冷却装置的半导体芯片的芯片堆叠包括具有第一侧上的电路的第一芯片和通过连接器格栅电和机械地耦合到第一芯片的第二芯片。 该装置还包括在第一芯片和第二芯片之间的热界面材料焊盘，其中热界面材料焊盘包括平行于第一芯片和第二芯片的配合表面排列的纳米纤维，以及热连接到热 界面材料垫。
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