公开(公告)号：US20150026975A1

公开(公告)日：2015-01-29

申请号：US14449322

申请日：2014-08-01

Applicant: Ibiden Co., Ltd.

Inventor： Takashi Kariya ,  Kazuhiro Yoshikawa ,  Daiki Komatsu ,  Ramesh Bhandari

IPC: H05K3/42 ,  H05K3/46

CPC classification number: H05K3/429 ,  H01L21/486 ,  H01L23/13 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5389 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/3011 ,  H05K1/0271 ,  H05K1/183 ,  H05K3/4602 ,  H05K3/4644 ,  H05K3/4694 ,  H05K2201/0187 ,  H05K2201/068 ,  Y10T29/49165 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A multilayer printed wiring board includes a core base material having a penetrating portion, a low-thermal-expansion substrate accommodated inside the penetrating portion of the core base material and having a first surface for mounting a semiconductor element and a second surface on the opposite side of the first surface, a first through-hole conductor provided inside the low-thermal-expansion substrate and provided for electrical connection between the first surface and the second surface of the low-thermal-expansion substrate, a filler filled in a gap between the low-thermal-expansion substrate and an inner wall of the core base material, and a wiring layer formed on at least one of the first surface and the second surface of the low-thermal-expansion substrate and having a resin insulation layer and a conductive layer. The wiring layer has a via conductor connecting the first through-hole conductor and the conductive layer.

Abstract translation: 多层印刷布线板包括具有穿透部分的芯基材，容纳在芯基材的穿透部分内的低热膨胀基板，并且具有用于安装半导体元件的第一表面和在相对侧上的第二表面 所述第一通孔导体设置在所述低热膨胀基板内部并且设置用于在所述低热膨胀基板的第一表面和所述第二表面之间的电连接，填充在所述低热膨胀基板之间的间隙中的填料 低热膨胀基板和芯基材的内壁，以及形成在低热膨胀基板的第一表面和第二表面中的至少一个上的布线层，并且具有树脂绝缘层和导电 层。 布线层具有连接第一通孔导体和导电层的通孔导体。