公开(公告)号：US5151153A

公开(公告)日：1992-09-29

申请号：US725176

申请日：1991-07-03

Applicant: Igor I. Bol

Inventor： Igor I. Bol

IPC: B23P11/00 ,  B23P15/00 ,  B23P15/14 ,  B81B3/00 ,  B81C1/00 ,  G03F7/00 ,  H01H1/00

CPC classification number: B81C1/00198 ,  B23P11/00 ,  B23P15/00 ,  B23P15/14 ,  G03F7/00 ,  H01H1/0036

Abstract: A process in which concave surfaces to form undercut edges can be made and the application of such process to making micromechanical devices. Concave surfaces forming undercut edges are made in a wall of a stationary structure extending from a planar surface by growing a convex bumper into the wall. The bumper forms a convexo-concave relationship with the wall. The bumper is then removed from the wall in such a manner as to preserve the concave, undercut surface of the wall. The stationary structure and the planar surface is then further processed by coating with a sacrificial layer, and a structural layer. The structural layer is patterned into a movable structure that is held onto the stationary structure by the curved, undercut edge such as the slot in a slider. Final processing includes removing the sacrificial layer to free the movable structure from the stationary structure.

Abstract translation: 可以制造形成底切边缘的凹面以及制造微机械装置的方法的应用。 形成底切边缘的凹面形成在从平面表面延伸的固定结构的壁中，通过将凸起的保险杠生长到壁中。 保险杠与墙壁形成凹凸的关系。 然后将保险杠从壁上移除，以便保持壁的凹入的底切表面。 然后通过用牺牲层和结构层进行涂覆来进一步处理固定结构和平面。 结构层被图案化成可移动结构，其通过弯曲的下切边缘（例如滑块中的狭槽）保持在固定结构上。 最终处理包括去除牺牲层以使可移动结构从静止结构释放。

公开(公告)号：US5112436A

公开(公告)日：1992-05-12

申请号：US632870

申请日：1990-12-24

Applicant: Igor I. Bol

Inventor： Igor I. Bol

IPC: H01L49/02 ,  H01J9/02 ,  H01J21/10

CPC classification number: H01J9/025 ,  H01J21/105

Abstract: A method for forming on a substrate a microelectronic device having a first and second element. According to the method, a first conductive layer is deposited on the surface. Next, a cap material is deposited, then the first element and a first element cap are formed from the first conductive layer and the cap material respectively. A sacrificial material is conformally deposited, then a second conductive layer is conformally deposited. The second conductive layer is anisotropically etched to form the second element. Finally, the sacrificial material is anisotropically etched.

Abstract translation: 一种在基板上形成具有第一和第二元件的微电子器件的方法。 根据该方法，在表面上沉积第一导电层。 接下来，沉积盖材料，然后分别由第一导电层和盖材料形成第一元件和第一元件盖。 牺牲材料被共形沉积，然后第二导电层被共形沉积。 第二导电层被各向异性地蚀刻以形成第二元件。 最后，牺牲材料进行各向异性蚀刻。

公开(公告)号：US5248379A

公开(公告)日：1993-09-28

申请号：US817163

申请日：1992-01-06

Applicant: Igor I. Bol

Inventor： Igor I. Bol

IPC: G02B1/02 ,  G02B3/00 ,  G02B6/122 ,  G02B7/00

CPC classification number: G02B6/122 ,  Y10S438/911

Abstract: A process for making a micromechanical generally bowl shaped or round shaped element upon a substrate by providing a member having a generally planar surface and walls extending from the surface Bumpers are then grown into the walls. The generally round shaped oxide bumpers form a generally bowl shaped convexo-concave relationship with the walls. The walls are covered on their outer periphery with a material which is resistant to the growth of the bumpers to control the growth of the bumpers at the periphery of the walls as the bumper is grown into the walls. The final step is removing either the bumpers from the walls or removing the walls from the bumpers leaving either a generally bowl shaped element or a round shaped element respectively on the substrate. In addition the walls may be implanted with a dopant to further control the shape of the bumper. When the generally bowl shaped element is made from silicon, it can be utilized as an optical mirror. When the generally round shaped element is made from silicon dioxide it can be utilized as a lens.

公开(公告)号：US5417801A

公开(公告)日：1995-05-23

申请号：US083226

申请日：1993-06-29

Applicant: Igor I. Bol

Inventor： Igor I. Bol

IPC: B23P15/00 ,  B81C1/00 ,  G03F7/00 ,  H01H1/00 ,  H02N1/00 ,  H01L21/302

CPC classification number: B81C1/00198 ,  B23P15/00 ,  G03F7/00 ,  H01H1/0036 ,  H02N1/002 ,  B81B2201/035

Abstract: A process in which micromechanical bushings can be made and the application of such process to making micromechanical devices. Bushings are made on a surface of a stationary structure extending from a planar surface. The bushings are separated from the stationary structure by a sacrificial layer. The stationary structure, the bushing and the planar surface are then further processed by coating with a second sacrificial layer, and a structural layer. The structural layer is patterned into a movable structure that is held onto the stationary structure by a curved, undercut edge such as gear on stool. Final processing includes removing both sacrificial layers to free the movable structure, the bushing, and the stationary structure from each other. The bushing is trapped between the movable structure and the stationary structure but able to move freely.

Abstract translation: 可以制造微机械套管的过程以及制造微机械装置的这种工艺的应用。 衬套在从平坦表面延伸的固定结构的表面上制成。 衬套通过牺牲层与静止结构分离。 然后通过用第二牺牲层和结构层进行涂覆来进一步处理固定结构，衬套和平面表面。 结构层被图案化成可移动的结构，其通过弯曲的底切边缘（例如在凳子上的齿轮）保持在固定结构上。 最终处理包括移除两个牺牲层以使可移动结构，衬套和固定结构彼此释放。 衬套被夹在可移动结构和固定结构之间，但能够自由移动。

公开(公告)号：US5269877A

公开(公告)日：1993-12-14

申请号：US908200

申请日：1992-07-02

Applicant: Igor I. Bol

Inventor： Igor I. Bol

IPC: H01J1/304 ,  H01J9/02 ,  B44C1/22 ,  C03C15/00 ,  H01L21/306

CPC classification number: H01J9/025 ,  H01J2209/0226

Abstract: A process for making a tip microstructure in amorphous silicon or polysilicon. A layer of nitride is first deposited on the amorphous silicon or polysilicon. Then the amorphous silicon or polysilicon is roughly patterned to form the base of the tip structure. the tip is carved out of the amorphous silicon or polysilicon by using an oxide growth process that is controlled by the amount of dopant in the amorphous silicon or polysilicon. After the tip is carved, the oxide is stripped away exposing the tip.

公开(公告)号：US5209818A

公开(公告)日：1993-05-11

申请号：US725173

申请日：1991-07-03

Applicant: Igor I. Bol

Inventor： Igor I. Bol

IPC: C23F17/00 ,  B23P11/00 ,  B23P15/00 ,  B81C1/00 ,  C23F1/00 ,  F16C33/14 ,  G03F7/00 ,  H01H1/00 ,  H01L21/302 ,  H01L21/306

CPC classification number: H01H1/0036 ,  B23P11/00 ,  B23P15/00 ,  G03F7/00

Abstract: A method of fabricating a micromechanical structure of a rod enclosed by a casing and able to both slide and rotate in the casing is described. The rod is formed on a substrate by growing a cylinder into a wall. The wall is then removed leaving the cylinder. The cylinder is coated with a sacrificial layer and a structural layer. The structural layer is patterend to form the casing and the sacrificial layer is removed.

公开(公告)号：US5149397A

公开(公告)日：1992-09-22

申请号：US725174

申请日：1991-07-03

Applicant: Igor I. Bol

Inventor： Igor I. Bol

IPC: C23F17/00 ,  B23P11/00 ,  B23P15/00 ,  F16C33/14 ,  G03F7/00

CPC classification number: B23P15/00 ,  B23P11/00 ,  G03F7/00

Abstract: A process in which concave surfaces to form undercut edges can be made and the application of such process to making micromechanical devices. Concave surfaces forming undercut edges are made in a wall of a stationary structure extending from a planar surface by growing a convex bumper into the wall. The bumper forms a convexo-concave relationship with the wall. The bumper is then removed from the wall in such a manner as to preserve the concave, undercut surface of the wall. The stationary structure and the planar surface is then further processed by coating with a sacrificial layer, and a structural layer. The structural layer is patterned into a movable structure that is held onto the stationary structure by the curved, undercut edge such as the slot in a slider. Final processing includes removing the sacrificial layer to free the movable structure from the stationary structure.

公开(公告)号：US5322594A

公开(公告)日：1994-06-21

申请号：US93915

申请日：1993-07-20

Applicant: Igor I. Bol

Inventor： Igor I. Bol

IPC: B41J2/14 ,  B41J2/16 ,  B44C1/22 ,  C03C15/00 ,  C23F1/00

CPC classification number: B41J2/1626 ,  B41J2/14072 ,  B41J2/1603 ,  B41J2/1635 ,  B41J2/1639 ,  B41J2/164 ,  B41J2/1643 ,  B41J2202/18 ,  B41J2202/21

Abstract: A method of manufacturing a one piece full width ink jet printing bar starting with a glass or ceramic plate with conductive vias, metal interconnects and ink feeds preformed on the plate. Heater filaments are formed from a suitable metal such as tungsten, nickel or tantalum on the plate and insulated from the metal interconnects with silicon nitride. Jet chambers and transport chambers to transport the ink from the ink feeds to the jet chambers are formed using sacrificial material and a structural layer. After the structural layer has been patterned the sacrificial material is removed forming the jet chambers and the transport chambers. Bonding bumps are then formed on the reverse side of the ceramic or glass plate from the jet chambers to provide connections to electronic components which determine which ink jet chambers should fire.

Abstract translation: 制造一片全幅喷墨印刷条的方法，该印刷条由具有导电通孔，金属互连和在板上预成型的油墨进料的玻璃或陶瓷板开始。 加热丝由板上合适的金属如钨，镍或钽形成，并与金属互连与氮化硅绝缘。 使用牺牲材料和结构层形成用于将油墨从油墨进料输送到喷射室的喷射室和输送室。 在结构层已被图案化之后，去除牺牲材料形成射流室和输送室。 然后从喷射室在陶瓷或玻璃板的背面形成接合凸块，以提供连接到确定哪些喷墨室应该起动的电子部件。

公开(公告)号：US5145438A

公开(公告)日：1992-09-08

申请号：US730322

申请日：1991-07-15

Applicant: Igor I. Bol

Inventor： Igor I. Bol

IPC: H01J3/02 ,  H01J9/02 ,  H01J21/10

CPC classification number: H01J3/022 ,  H01J21/105 ,  H01J9/025

Abstract: A microelectronic device and a method of forming the same are disclosed. The microelectronic device includes a cathode, an anode and a first grid disposed adjacent a major surface of a substrate. The first grid is positioned between the cathode and the anode. The first grid is formed from conductive material using a sidewall spacer technique. The anode is made of conductive polysilicon, the cathode is made of tungsten and has a portion elevated from the substrate to aid in the ballistic transport of electrons. A second grid is formed using a sidewall spacer technique, and is positioned between the first grid and the anode. The method of making a microelectronic device includes forming an anode and a cathode on a surface of a substrate, then depositing, in series, first and second sacrificial layers. A first wall is formed by removing portion of the second sacrificial layer. The first wal is positioned between the anode and the cathode. A first conductive layer is deposited against the first wall and over the exposed second sacrificial layer and over exposed portions of the first sacrificial layer. A conductive sidewall spacer is formed against the first wall and between the anode and cathode by anisotropically etching the first conductive layer. The remaining portions of the first and second sacrificial layers are removed. The conductive sidewall spacer forms a first grid. A microelectronic device having a second grid is formed by the additional step of forming a second wall between the first wall and the anode.

Abstract translation: 公开了一种微电子器件及其形成方法。 微电子器件包括阴极，阳极和邻近衬底的主表面设置的第一栅极。 第一栅极位于阴极和阳极之间。 第一栅格由使用侧壁间隔物技术的导电材料形成。 阳极由导电多晶硅制成，阴极由钨制成，并且具有从衬底升高的部分以帮助电子的弹道输送。 使用侧壁间隔物技术形成第二格栅，并且位于第一格栅和阳极之间。 制造微电子器件的方法包括在衬底的表面上形成阳极和阴极，然后串联沉积第一和第二牺牲层。 通过去除第二牺牲层的部分形成第一壁。 第一瓦尔位于阳极和阴极之间。 第一导电层沉积在第一壁上并暴露在第二牺牲层上以及第一牺牲层的暴露部分之上。 通过各向异性蚀刻第一导电层，形成抵靠第一壁并且在阳极和阴极之间的导电侧壁间隔物。 去除第一和第二牺牲层的剩余部分。 导电侧壁间隔物形成第一栅极。 通过在第一壁和阳极之间形成第二壁的附加步骤形成具有第二栅极的微电子器件。