公开(公告)号：US08695690B2

公开(公告)日：2014-04-15

申请号：US12241010

申请日：2008-09-29

申请人： Ihab A. Ali ,  Frank Liang

发明人： Ihab A. Ali ,  Frank Liang

IPC分类号： H05K7/20 ,  G05D23/00

CPC分类号： G06F1/203 ,  G06F1/1613 ,  G06F1/206 ,  H01L23/34 ,  H01L23/467 ,  H01L2924/0002 ,  Y02D10/16 ,  H01L2924/00

摘要： An electronic device can be provided with a housing having at least one wall defining a cavity and a flow sensor at least partially contained within the cavity. The flow sensor may be configured to detect a flow characteristic related to the flow of a fluid through a first portion of the cavity. The electronic device may also include a processor configured to alter a performance characteristic of the electronic device based on the detected flow characteristic.

摘要翻译： 电子设备可以设置有具有限定空腔的至少一个壁和至少部分地包含在腔内的流量传感器的壳体。 流量传感器可以被配置为检测与通过空腔的第一部分的流体的流动相关的流动特性。 电子设备还可以包括被配置为基于检测到的流量特性来改变电子设备的性能特性的处理器。

公开(公告)号：US20100051243A1

公开(公告)日：2010-03-04

申请号：US12241010

申请日：2008-09-29

申请人： Ihab A. Ali ,  Frank Liang

发明人： Ihab A. Ali ,  Frank Liang

IPC分类号： F28D15/00 ,  H05K7/20

CPC分类号： G06F1/203 ,  G06F1/1613 ,  G06F1/206 ,  H01L23/34 ,  H01L23/467 ,  H01L2924/0002 ,  Y02D10/16 ,  H01L2924/00

摘要： An electronic device can be provided with a housing having at least one wall defining a cavity and a flow sensor at least partially contained within the cavity. The flow sensor may be configured to detect a flow characteristic related to the flow of a fluid through a first portion of the cavity. The electronic device may also include a processor configured to alter a performance characteristic of the electronic device based on the detected flow characteristic.

摘要翻译： 电子设备可以设置有具有限定空腔的至少一个壁和至少部分地包含在腔内的流量传感器的壳体。 流量传感器可以被配置为检测与通过空腔的第一部分的流体的流动相关的流动特性。 电子设备还可以包括被配置为基于检测到的流量特性来改变电子设备的性能特性的处理器。

公开(公告)号：US20100053885A1

公开(公告)日：2010-03-04

申请号：US12241012

申请日：2008-09-29

申请人： Ihab A. Ali

发明人： Ihab A. Ali

IPC分类号： H05K7/20

CPC分类号： G06F1/203 ,  G06F1/1616 ,  G06F1/1681

摘要： An electronic device can be provided with a first housing at least partially containing a first electronic component, a second housing, and a hinge assembly coupled to the first housing and the second housing. The hinge assembly may be configured to dissipate heat generated by the first electronic component away from the first housing. In some embodiments, the hinge assembly may be configured to dissipate heat generated by the first electronic component away from the first housing and on to the second housing. The second housing may include a heat spreader for dissipating the heat from the hinge assembly throughout the second housing.

摘要翻译： 电子设备可以设置有至少部分地包含第一电子部件，第二壳体和联接到第一壳体和第二壳体的铰链组件的第一壳体。 铰链组件可以被配置为将由第一电子部件产生的热量散发离开第一壳体。 在一些实施例中，铰链组件可以被配置为将由第一电子部件产生的热量从第一壳体和第二壳体上散出。 第二壳体可以包括用于在整个第二壳体中从铰链组件散热的散热器。

公开(公告)号：US20080298021A1

公开(公告)日：2008-12-04

申请号：US11809460

申请日：2007-05-31

申请人： Ihab A. Ali ,  Frank F. Liang ,  Amaury Heresztyn

发明人： Ihab A. Ali ,  Frank F. Liang ,  Amaury Heresztyn

IPC分类号： H05K7/20

CPC分类号： H01L23/3732 ,  H01L23/3672 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： Embodiments of a device are described. This device includes an integrated circuit and a heat spreader coupled to the integrated circuit. This heat spreader includes a first layer of an allotrope of carbon. Note that the allotrope of carbon has an approximately face-centered-cubic crystal structure. Furthermore, the allotrope of carbon has a thermal conductivity greater than a first pre-determined value and a specific heat greater than a second pre-determined value.

摘要翻译： 描述设备的实施例。 该装置包括集成电路和耦合到集成电路的散热器。 该散热器包括碳的同素异形体的第一层。 注意，碳的同素异形体具有大致的面心立方晶体结构。 此外，碳的同素异形体具有大于第一预定值的热导率和大于第二预定值的比热。

公开(公告)号：US20080291629A1

公开(公告)日：2008-11-27

申请号：US11805501

申请日：2007-05-22

申请人： Ihab A. Ali

发明人： Ihab A. Ali

IPC分类号： H05K7/20

CPC分类号： G06F1/203 ,  G06F2200/201

摘要： Embodiments of a computer system are described. This computer system includes a power source that is coupled to a heat pipe, where the power source includes an integrated circuit. This heat pipe may contain a liquid coolant that has a density greater than a first pre-determined value at room temperature. A pump is coupled to the heat pipe is configured to circulate the liquid coolant through the heat pipe. Furthermore, a heat exchanger coupled to the heat pipe is configured to transfer heat from the heat pipe to an environment external to the computer system.

摘要翻译： 描述计算机系统的实施例。 该计算机系统包括耦合到热管的电源，其中电源包括集成电路。 该热管可以包含在室温下具有大于第一预定值的密度的液体冷却剂。 耦合到热管的泵被配置为使液体冷却剂循环通过热管。 此外，耦合到热管的热交换器被配置为将热量从热管传递到计算机系统外部的环境。

公开(公告)号：US07978474B2

公开(公告)日：2011-07-12

申请号：US11805501

申请日：2007-05-22

申请人： Ihab A. Ali

发明人： Ihab A. Ali

IPC分类号： H05K7/20

CPC分类号： G06F1/203 ,  G06F2200/201

摘要： Embodiments of a computer system are described. This computer system includes a power source that is coupled to a heat pipe, where the power source includes an integrated circuit. This heat pipe may contain a liquid coolant that has a density greater than a first pre-determined value at room temperature. A pump is coupled to the heat pipe is configured to circulate the liquid coolant through the heat pipe. Furthermore, a heat exchanger coupled to the heat pipe is configured to transfer heat from the heat pipe to an environment external to the computer system.

摘要翻译： 描述计算机系统的实施例。 该计算机系统包括耦合到热管的电源，其中电源包括集成电路。 该热管可以包含在室温下具有大于第一预定值的密度的液体冷却剂。 耦合到热管的泵被配置为使液体冷却剂循环通过热管。 此外，耦合到热管的热交换器被配置为将热量从热管传递到计算机系统外部的环境。

公开(公告)号：US07480145B2

公开(公告)日：2009-01-20

申请号：US11591926

申请日：2006-11-01

申请人： Ihab A. Ali

发明人： Ihab A. Ali

IPC分类号： H05K7/20 ,  F28F7/00

CPC分类号： G06F1/203 ,  H05K7/20481 ,  H05K7/20518

摘要： A system includes a power source and a heat-shield mechanism which encloses the power source. This heat-shield mechanism includes a 3-dimensional housing that defines a cavity in which the power source resides, and a plate that is positioned to cover an opening to the cavity that is defined by an edge of the housing. Note that the housing contains three layers in which a second layer is sandwiched between a first layer and a third layer. This second layer has a first anisotropic thermal conductivity. Furthermore, the plate includes a material having a second anisotropic thermal conductivity.

摘要翻译： 系统包括电源和封闭电源的隔热机构。 该热屏蔽机构包括限定电源所在的空腔的三维壳体，以及定位成覆盖由壳体的边缘限定的空腔的开口的板。 注意，壳体包含三层，其中第二层夹在第一层和第三层之间。 该第二层具有第一各向异性热导率。 此外，该板包括具有第二各向异性热导率的材料。

公开(公告)号：US07447033B2

公开(公告)日：2008-11-04

申请号：US11591851

申请日：2006-11-01

申请人： Ihab A. Ali

发明人： Ihab A. Ali

IPC分类号： H05K7/20

CPC分类号： G06F1/203

摘要： A portable computing device includes a housing having an external surface and an inner surface. A solid-state cooling mechanism in the computing device is coupled to the inner surface. This solid-state cooling mechanism is configured to maintain a temperature difference across at least a portion of the external surface that is less than a pre-determined value.

摘要翻译： 便携式计算设备包括具有外表面和内表面的外壳。 计算装置中的固态冷却机构联接到内表面。 该固态冷却机构被配置为保持外表面的至少一部分上的温度差小于预定值。

公开(公告)号：US20080128119A1

公开(公告)日：2008-06-05

申请号：US11607571

申请日：2006-11-30

申请人： Ihab A. Ali ,  Jay S. Nigen

发明人： Ihab A. Ali ,  Jay S. Nigen

IPC分类号： H05K7/20

CPC分类号： G06F1/203

摘要： A cooling mechanism includes a first heat exchanger, a first fluid-flow port, and a second fluid-flow port. The first heat exchanger includes a forced-fluid driver and is configured to pump heat from inside an enclosed area to outside of the enclosed area. Furthermore, the first fluid-flow port is configured to accommodate a first fluid flow into the enclosed area and the second fluid-flow port is configured to accommodate a second fluid flow from the enclosed area. Note that the first fluid-flow port and the second fluid-flow port are approximately coplanar. In addition, a given fluid-flow port, which may be either or both of the fluid-flow ports, is tapered to have an associated cross-sectional area which is smaller at an edge of the given fluid-flow port that is proximate to the outside of the enclosed area than at an edge of the given fluid-flow port that is proximate to the inside of the enclosed area.

摘要翻译： 冷却机构包括第一热交换器，第一流体流通口和第二流体流动端口。 第一热交换器包括强制流体驱动器，并且构造成将热量从封闭区域内部泵送到封闭区域的外部。 此外，第一流体流动端口构造成容纳第一流体流入封闭区域，并且第二流体流动端口构造成容纳来自封闭区域的第二流体流。 注意，第一流体流动端口和第二流体流动端口近似共面。 此外，可以是流体流动端口中的一个或两个的给定流体流动端口是锥形的，以具有在给定的流体流动端口的边缘处更接近的相关联的横截面面积 封闭区域的外侧比在靠近封闭区域内部的给定流体流动端口的边缘处。

公开(公告)号：US20080101038A1

公开(公告)日：2008-05-01

申请号：US11591851

申请日：2006-11-01

申请人： Ihab A. Ali

发明人： Ihab A. Ali

IPC分类号： H05K7/20

CPC分类号： G06F1/203

摘要： A portable computing device includes a housing having an external surface and an inner surface. A solid-state cooling mechanism in the computing device is coupled to the inner surface. This solid-state cooling mechanism is configured to maintain a temperature difference across at least a portion of the external surface that is less than a pre-determined value.