公开(公告)号：US10576567B2

公开(公告)日：2020-03-03

申请号：US15546032

申请日：2016-01-26

申请人： Illinois Tool Works Inc.

发明人： Gerardus Johannes Adrianus Maria Diepstraten ,  Antonie Cornelis Colijn

IPC分类号： B23K37/00 ,  B23K3/08 ,  B23K1/008 ,  B23K1/20 ,  B23K1/00 ,  B23K3/04 ,  H05K3/34 ,  B23K101/42

摘要： The present application relates to a reflow soldering oven (1) for soldering an electronic circuit board (300), the oven (1) comprising a gas purification system (11, 21) for purifying gas that contains flux components vaporized from the electronic circuit board (300). The gas purification system further comprises at least one gas purification unit (11, 21) comprising a catalyst unit comprising a catalyst material. The invention further relates to a corresponding reflow soldering method.

公开(公告)号：US20180333796A1

公开(公告)日：2018-11-22

申请号：US15546032

申请日：2016-01-26

申请人： Illinois Tool Works Inc.

发明人： Gerardus Johannes Adrianus Maria Diepstraten ,  Antonie Cornelis Colijn

IPC分类号： B23K3/08 ,  B23K1/008 ,  B23K1/00 ,  B23K1/20 ,  B23K3/04 ,  H05K3/34

CPC分类号： B23K3/08 ,  B23K1/0016 ,  B23K1/008 ,  B23K1/20 ,  B23K1/203 ,  B23K3/04 ,  B23K2101/42 ,  H05K3/3494

摘要： The present application relates to a reflow soldering oven (1) for soldering an electronic circuit board (300), the oven (1) comprising a gas purification system (11, 21) for purifying gas that contains flux components vaporized from the electronic circuit board (300). The gas purification system further comprises at least one gas purification unit (11, 21) comprising a catalyst unit comprising a catalyst material. The invention further relates to a corresponding reflow soldering method.

公开(公告)号：US12128505B2

公开(公告)日：2024-10-29

申请号：US17369717

申请日：2021-07-07

申请人： Illinois Tool Works Inc.

发明人： Antonie Cornelis Colijn ,  Gerardus Johannes Adrianus Maria Diepstraten

IPC分类号： B23K3/06

CPC分类号： B23K3/0607 ,  B23K3/0646

摘要： A soldering system comprising a solder pot and a nozzle exchange unit. The solder pot is configured to detachably couple to a solder nozzle during a soldering operation. The nozzle exchange unit is arranged to: store a plurality of solder nozzles; detach a first nozzle from the nozzle coupling; and attach a stored second nozzle to the nozzle coupling.

公开(公告)号：US10086460B2

公开(公告)日：2018-10-02

申请号：US15320351

申请日：2015-07-24

申请人： Illinois Tool Works Inc.

发明人： Antonie Cornelis Colijn

IPC分类号： B23K37/00 ,  B23K3/06 ,  B23K1/08

摘要： The invention relates to a soldering module (3) for the, in particular selective, soldering of components to a circuit board (14), having a soldering nozzle (32) for creating a solder wave. It is proposed that the soldering module (3) comprises a linear conveyor (8), in particular a belt conveyor or a chain conveyor, for applying solder to the circuit board (14) by moving the circuit board (14) in a conveying direction over the solder wave, and that the linear conveyor (8) is tiltable, in particular about a first tilting axis (23).

公开(公告)号：US20170209949A1

公开(公告)日：2017-07-27

申请号：US15320351

申请日：2015-07-24

申请人： Illinois Tool Works Inc.

发明人： Antonie Cornelis Colijn

IPC分类号： B23K3/06 ,  B23K1/08

CPC分类号： B23K3/0653 ,  B23K1/085 ,  B23K3/0676 ,  H05K13/0061 ,  H05K13/0465

摘要： The invention relates to a soldering module (3) for the, in particular selective, soldering of components to a circuit board (14), having a soldering nozzle (32) for creating a solder wave. It is proposed that the soldering module (3) comprises a linear conveyor (8), in particular a belt conveyor or a chain conveyor, for applying solder to the circuit board (14) by moving the circuit board (14) in a conveying direction over the solder wave, and that the linear conveyor (8) is tiltable, in particular about a first tilting axis (23).