摘要:
A semiconductor memory device includes at least one memory cell block and at least one connection unit. The at least one memory cell block has a first region including at least one first memory cell connected to a first bit line, and a second region including at least one second memory cell connected to a second bit line. The at least one connection unit is configured to selectively connect the first bit line to a corresponding bit line sense amplifier based on a first control signal, and configured to selectively connect the second bit line to the corresponding bit line sense amplifier via a corresponding global bit line based on a second control signal.
摘要:
Semiconductor memory device having a stacking structure including resistor switch based logic circuits. The semiconductor memory device includes a first conductive line that includes a first line portion and a second line portion, wherein the first line portion and the second line portion are electrically separated from each other by an intermediate region disposed between the first and second line portions, a first variable resistance material film that is connected to the first line portion and stores data, and a second variable resistance material film that controls an electrical connection between the first line portion and the second line portion.
摘要:
A semiconductor device includes a first memory region including a plurality of memory cells; a test unit configured to test the first memory region, and detect a weak bit from among the plurality of memory cells; and a second memory region configured to store a weak bit address (WBA) of the first memory region, and data intended to be stored in the weak bit, wherein the first memory region and the second memory region include different types of memory cells.
摘要:
A method of performing write operations in a memory device including a plurality of banks is performed. Each bank includes two or more sub-banks including at least a first sub-bank and a second sub-bank. The method comprises: performing a first row cycle for writing to a first word line of the first sub-bank, the first row cycle including a plurality of first sub-periods, each sub-period for performing a particular action; and performing a second row cycle for writing to a first word line of the second sub-bank, the second row cycle including a plurality of second sub-periods of the same type as the plurality of first sub-periods. The first row cycle overlaps with the second row cycle, and a first type sub-period of the first sub-periods overlaps with a second type sub-period of the second sub-periods, the first type and second type being different types.
摘要:
A memory module can include a plurality of dynamic memory devices that each can include a dynamic memory cell array with respective regions therein, where the plurality of dynamic memory devices can be configured to operate the respective regions responsive to a command. A DRAM management unit can be on the module and coupled to the plurality of dynamic memory devices, and can include a memory device operational parameter storage circuit that is configured to store memory device operational parameters for the respective regions to affect operation of the respective regions responsive to the command.
摘要:
A memory device performing an internal copy operation is provided. The memory device may receive a source address, a destination address, and page size information together with an internal copy command, compares the source address with the destination address, and performs an internal copy operation. The internal copy operation may be an internal block copy operation, an inter-bank copy operation, or an internal bank copy operation. The internal copy operation may be performed with respect to one-page data, half-page data, or quarter-page data, based on the page size information. The memory device may output as a flag signal a copy-done signal indicating that the internal copy operation has been completed.
摘要:
An upright vacuum cleaner has a cleaner body; a suction port assembly hinged to the cleaner body with a drum brush mounted on a front lower surface thereof; and a height adjusting apparatus set to an active mode or an inactive mode. In the active mode, the height adjusting apparatus raises the rear portion of the suction port assembly from an initial height, with the drum brush spaced from a surface, to bring the drum brush into contact with the surface when the cleaner body tilts from an upright position towards the rear of the suction port assembly. In the inactive mode, the rear portion of the suction port assembly remains at the initial height when the cleaner body tilts from the upright position towards the rear of the suction port assembly.
摘要:
The memory device includes a memory array, control logic and a recovery circuit. The memory array has a first region configured to store data, a second region configured to store a portion of fail cell information, and a third region configured to store recovery information. The fail cell information identifies failed cells in the first region, and the recovery information is for recovering data stored in the identified failed cells. The control logic is configured to store the fail cell information, to transfer the portion of the fail cell information to the second region of the memory array, and to determine whether to perform a recovery operation based on address information in an access request and the portion of the fail cell information stored in the second region. The access request is a request to access the first region. The recovery circuit is configured to perform the recovery operation.
摘要:
A memory device includes a repair circuit including a fail bit location information table configured to store row and column addresses of a defective cell in a normal area of a memory cell array. The repair circuit also includes a row address comparison unit configured to compare the row address of the defective cell with a row address of a first access cell received from the outside, and to output a first row match signal when the defective cell's row address matches the row address of the first access cell, and a column address comparison unit configured to compare the column address of the defective cell with a column address of the first access cell received from the outside, and to output a first column address replacement signal if the column address of the defective cell is the same as the column address of the first access cell.