Active organic light emitting diode display structure
    1.
    发明申请
    Active organic light emitting diode display structure 有权
    主动有机发光二极管显示结构

    公开(公告)号:US20040263065A1

    公开(公告)日:2004-12-30

    申请号:US10673324

    申请日:2003-09-30

    CPC classification number: H01L27/322 H01L27/3244 H01L27/3246 H01L51/5284

    Abstract: The present invention discloses an active organic light emitting diode (AOLED) display structure. A color filter and thin film transistor organic light emitting diode (TFT-OLED) are incorporated on one substrate of the AOLED. Moreover, a Indium Tin Oxide(ITO)layer of the AOLED is deposited with a black matrix layer so as to lower light leakage effect and increase the contrast and color purity level in between pixels of the display. By adopting such technology, a flat panel display having large area, high resolution and low product cost is accordingly implemented.

    Abstract translation: 本发明公开了一种有源有机发光二极管(AOLED)显示结构。 滤色器和薄膜晶体管有机发光二极管(TFT-OLED)结合在AOLED的一个基板上。 此外,AOLED的氧化铟锡(ITO)层沉积有黑矩阵层,以便降低漏光效应并增加显示器的像素之间的对比度和色纯度水平。 通过采用这种技术,可以实现面积大,分辨率高,产品成本低的平板显示器。

    Method of forming a flexible thin film transistor display device with a metal foil substrate
    2.
    发明申请
    Method of forming a flexible thin film transistor display device with a metal foil substrate 审中-公开
    用金属箔基板形成柔性薄膜晶体管显示装置的方法

    公开(公告)号:US20040053431A1

    公开(公告)日:2004-03-18

    申请号:US10459032

    申请日:2003-06-11

    CPC classification number: H01L27/1262 H01L27/1214 H01L27/1218 H01L29/78603

    Abstract: A method of forming a flexible thin film transistor (TFT) display device. A metal foil serving as a flexible metal substrate of a display device is provided, wherein the metal foil is an aluminum alloy foil, a titanium foil or a titanium alloy foil. The thickness of the metal foil is 0.05null0.8 mm. An insulation layer is formed on the flexible metal substrate. A thin film transistor (TFT) array is formed on the insulation layer. In addition, the aluminum alloy foil can include magnesium of 0.01null1% wt and/or silicon of 0.01null1% wt and the titanium alloy foil can include aluminum of 0.01null20% wt and/or molybdenum of 0.01null20% wt.

    Abstract translation: 一种形成柔性薄膜晶体管(TFT)显示装置的方法。 提供了用作显示装置的柔性金属基板的金属箔,其中金属箔是铝合金箔,钛箔或钛合金箔。 金属箔的厚度为0.05〜0.8mm。 在柔性金属基板上形成绝缘层。 在绝缘层上形成薄膜晶体管(TFT)阵列。 此外,铝合金箔可以含有0.01〜1重量%的镁和/或0.01〜1重量%的硅,钛合金箔可以含有0.01〜20重量%的铝和/或0.01〜20重量%的钼 。

    Heating plate crystallization method
    3.
    发明申请
    Heating plate crystallization method 失效
    加热板结晶法

    公开(公告)号:US20040253797A1

    公开(公告)日:2004-12-16

    申请号:US10648290

    申请日:2003-08-27

    Abstract: The present invention relates to a heating plate crystallization method used in the crystallization process for the poly-silicon thin-film transistor, and more particularly, the present invention relates to a heating plate crystallization method by using a pulsed rapid thermal annealing process (PRTP) By means of the characteristic provided by the present invention, namely, the heating plate area has a better absorption rate to the infrared rays and has a high thermal stability. The heating plate area is used for absorbing the infrared rays, and after the heating, the energy is indirectly transferred to the amorphous layer via a thermal conduction method so that the amorphous layer will be rapidly crystallized to form the poly-silicon. Furthermore, the present invention uses the pulsed rapid thermal annealing process (PRTP) using the infrared rays to instantly heat, to selectively heat the materials by taking the advantage that different materials have different absorption rates to the infrared rays. However, the glass substrate and the amorphous cannot effectively absorb the infrared rays so that the glass substrate will not be broken while the process temperature of the heating plate area is excessively high (>70null C.). Therefore, the most effective rapid thermal crystallization can be achieved.

    Abstract translation: 本发明涉及用于多晶硅薄膜晶体管的结晶工艺中的加热板结晶方法,更具体地说,本发明涉及使用脉冲快速热退火工艺(PRTP)的加热板结晶方法, 通过本发明提供的特征,即加热板区域对红外线具有更好的吸收率并具有高的热稳定性。 加热板区域用于吸收红外线,并且在加热之后,能量通过热传导方法间接转移到非晶层,使得非晶层将快速结晶以形成多晶硅。 此外,本发明使用红外线的脉冲快速热退火工艺(PRTP)立即加热,通过利用不同材料对红外线具有不同吸收率的优点来选择性地加热材料。 然而,玻璃基板和非晶体不能有效地吸收红外线,使得当加热板区域的处理温度过高(> 70℃)时玻璃基板不会断裂。 因此,可以实现最有效的快速热结晶。

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