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公开(公告)号：US10598480B2
公开(公告)日：2020-03-24
申请号：US15471565
申请日：2017-03-28
Applicant: Infineon Technologies AG
Inventor： Ivan Penjovic , Oliver Nagler
Abstract: A method of determining a minimum permissible tip diameter of probing needles of a probe card for wafer probing is described. The method includes performing a plurality of contact procedures of at least one probing needle to a plurality of bonding pads on a wafer. The plurality of contact procedures is performed at different stress applied by the at least one probing needle to the bonding pads. A chart of indentation depths of the plurality of bonding pads caused by the contact procedures at different stress is determined. A set of calibration coefficients based on the chart is determined, wherein the set of calibration coefficients allows to compute a predicted indentation depth as a function of stress. The minimum permissible probing needle tip diameter is determined based on an evaluation of the function.
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公开(公告)号：US09885749B2
公开(公告)日：2018-02-06
申请号：US15176186
申请日：2016-06-08
Applicant: Infineon Technologies AG
Inventor： Ivan Penjovic , Josef Martin Paul Hennig , Oliver Nagler
CPC classification number: G01R31/2891 , G01L5/0028 , G01L5/0038 , G01R1/06 , G01R1/067 , G01R1/06711 , G01R1/06716 , G01R1/06794 , G01R31/26 , G01R31/2642 , G01R31/2887 , G01R31/2889 , H05K1/0268
Abstract: A method in accordance with various embodiments may include: measuring a contact force between at least one probe and at least one contact pad for a plurality of probe overdrive positions, and determining a relationship between contact force and probe overdrive position from the measured contact forces; determining a first region in the relationship exhibiting a non-linear dependence of the contact force from the probe overdrive position, and a second region exhibiting a linear dependence of the contact force from the probe overdrive position; and determining a process window for a pad probing process based on the determined first region and second region.
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公开(公告)号：US20170292832A1
公开(公告)日：2017-10-12
申请号：US15471565
申请日：2017-03-28
Applicant: Infineon Technologies AG
Inventor： Ivan Penjovic , Oliver Nagler
CPC classification number: G01B11/08 , G01R1/06738 , G01R1/0675
Abstract: A method of determining a minimum permissible tip diameter of probing needles of a probe card for wafer probing is described. The method includes performing a plurality of contact procedures of at least one probing needle to a plurality of bonding pads on a wafer. The plurality of contact procedures is performed at different stress applied by the at least one probing needle to the bonding pads. A chart of indentation depths of the plurality of bonding pads caused by the contact procedures at different stress is determined. A set of calibration coefficients based on the chart is determined, wherein the set of calibration coefficients allows to compute a predicted indentation depth as a function of stress. The minimum permissible probing needle tip diameter is determined based on an evaluation of the function.
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