-
公开(公告)号：US20190178848A1
公开(公告)日：2019-06-13
申请号：US16211991
申请日：2018-12-06
Applicant: Infineon Technologies AG
Inventor： Oliver Nagler , Sebastian Bernrieder , Marianne Unterreitmeier
Abstract: A system for examining semiconductor substrates may comprise an indenter configured to exercise a force onto the semiconductor substrate such that a crack in the semiconductor substrate occurs, a piezoelectric acoustic emission sensor configured to detect an acoustic signal emitted by the crack, and attaching means configured to fasten the indenter to a first surface of the piezoelectric acoustic emission sensor. The indenter and the attaching means are configured to transmit the acoustic signal to the piezoelectric acoustic emission sensor. The resonance frequencies of the indenter and the piezoelectric acoustic emission sensor are attuned to one another.
-
Patent Agency Ranking
公开(公告)号：US10598480B2
公开(公告)日：2020-03-24
申请号：US15471565
申请日：2017-03-28
Applicant: Infineon Technologies AG
Inventor： Ivan Penjovic , Oliver Nagler
Abstract: A method of determining a minimum permissible tip diameter of probing needles of a probe card for wafer probing is described. The method includes performing a plurality of contact procedures of at least one probing needle to a plurality of bonding pads on a wafer. The plurality of contact procedures is performed at different stress applied by the at least one probing needle to the bonding pads. A chart of indentation depths of the plurality of bonding pads caused by the contact procedures at different stress is determined. A set of calibration coefficients based on the chart is determined, wherein the set of calibration coefficients allows to compute a predicted indentation depth as a function of stress. The minimum permissible probing needle tip diameter is determined based on an evaluation of the function.
-
公开(公告)号：US12222322B2
公开(公告)日：2025-02-11
申请号：US17401380
申请日：2021-08-13
Applicant: Infineon Technologies AG
Inventor： Oliver Nagler , Marianne Unterreitmeier
Abstract: A system and method for the acoustic detection of cracks in a semiconductor substrate is disclosed. In one example, the system includes a force generating unit configured to apply a force onto the semiconductor substrate, a detector unit comprising a resonating indenter and an acoustic emission sensor coupled to the resonating indenter, and an evaluation unit configured to evaluate acoustic signals detected by the detector unit and configured to determine whether a crack has occurred based on the detected signals. The resonating indenter is configured to contact the semiconductor substrate at a lateral distance from the force generating unit, and wherein the force generating unit and the resonating indenter are configured to contact the semiconductor substrate on the same side.
-
公开(公告)号：US09885749B2
公开(公告)日：2018-02-06
申请号：US15176186
申请日：2016-06-08
Applicant: Infineon Technologies AG
Inventor： Ivan Penjovic , Josef Martin Paul Hennig , Oliver Nagler
CPC classification number: G01R31/2891 , G01L5/0028 , G01L5/0038 , G01R1/06 , G01R1/067 , G01R1/06711 , G01R1/06716 , G01R1/06794 , G01R31/26 , G01R31/2642 , G01R31/2887 , G01R31/2889 , H05K1/0268
Abstract: A method in accordance with various embodiments may include: measuring a contact force between at least one probe and at least one contact pad for a plurality of probe overdrive positions, and determining a relationship between contact force and probe overdrive position from the measured contact forces; determining a first region in the relationship exhibiting a non-linear dependence of the contact force from the probe overdrive position, and a second region exhibiting a linear dependence of the contact force from the probe overdrive position; and determining a process window for a pad probing process based on the determined first region and second region.
-
公开(公告)号：US20170292832A1
公开(公告)日：2017-10-12
申请号：US15471565
申请日：2017-03-28
Applicant: Infineon Technologies AG
Inventor： Ivan Penjovic , Oliver Nagler
CPC classification number: G01B11/08 , G01R1/06738 , G01R1/0675
Abstract: A method of determining a minimum permissible tip diameter of probing needles of a probe card for wafer probing is described. The method includes performing a plurality of contact procedures of at least one probing needle to a plurality of bonding pads on a wafer. The plurality of contact procedures is performed at different stress applied by the at least one probing needle to the bonding pads. A chart of indentation depths of the plurality of bonding pads caused by the contact procedures at different stress is determined. A set of calibration coefficients based on the chart is determined, wherein the set of calibration coefficients allows to compute a predicted indentation depth as a function of stress. The minimum permissible probing needle tip diameter is determined based on an evaluation of the function.
-
公开(公告)号：US10859534B2
公开(公告)日：2020-12-08
申请号：US16211991
申请日：2018-12-06
Applicant: Infineon Technologies AG
Inventor： Oliver Nagler , Sebastian Bernrieder , Marianne Unterreitmeier
Abstract: A system for examining semiconductor substrates may comprise an indenter configured to exercise a force onto the semiconductor substrate such that a crack in the semiconductor substrate occurs, a piezoelectric acoustic emission sensor configured to detect an acoustic signal emitted by the crack, and attaching means configured to fasten the indenter to a first surface of the piezoelectric acoustic emission sensor. The indenter and the attaching means are configured to transmit the acoustic signal to the piezoelectric acoustic emission sensor. The resonance frequencies of the indenter and the piezoelectric acoustic emission sensor are attuned to one another.
-
-
-
-
-
Search Results
6
records
(took 0.013 seconds)
