公开(公告)号：US10466339B2

公开(公告)日：2019-11-05

申请号：US16186938

申请日：2018-11-12

Applicant: Infineon Technologies AG

Inventor： Jonas Kammerer ,  Herbert Knapp ,  Hao Li

IPC: G01S7/40 ,  G01R21/12 ,  H04B17/11 ,  G01R19/00 ,  G01R21/00 ,  H04B17/10 ,  H04B17/12 ,  H04B17/13 ,  H04B17/14

Abstract: An on-chip power sensor and a millimeter-wave communication device (e.g. transmitter or transceiver) on a chip including the on-chip power sensor are described. The millimeter-wave communication device can also include a coupler disposed on a transmit path, the coupler being configured to receive a transmit signal and to provide the transmit signal to an antenna connection (e.g. pad). The on-chip power sensor can be configured to receive a coupled portion of the transmit signal from the coupler, and measure a transmit power of the transmit signal based on the coupled portion of the transmit signal.

公开(公告)号：US20190094337A1

公开(公告)日：2019-03-28

申请号：US16186938

申请日：2018-11-12

Applicant: Infineon Technologies AG

Inventor： Jonas Kammerer ,  Herbert Knapp ,  Hao Li

IPC: G01S7/40 ,  G01R21/12 ,  H04B17/11 ,  H04B17/10 ,  H04B17/14 ,  G01R19/00 ,  G01R21/00 ,  H04B17/13 ,  H04B17/12

CPC classification number: G01S7/4008 ,  G01R19/00 ,  G01R19/0084 ,  G01R19/0092 ,  G01R21/00 ,  G01R21/12 ,  G01S2007/4013 ,  H04B17/102 ,  H04B17/11 ,  H04B17/12 ,  H04B17/13 ,  H04B17/14

Abstract: An on-chip power sensor and a millimeter-wave communication device (e.g. transmitter or transceiver) on a chip including the on-chip power sensor are described. The millimeter-wave communication device can also include a coupler disposed on a transmit path, the coupler being configured to receive a transmit signal and to provide the transmit signal to an antenna connection (e.g. pad). The on-chip power sensor can be configured to receive a coupled portion of the transmit signal from the coupler, and measure a transmit power of the transmit signal based on the coupled portion of the transmit signal.

公开(公告)号：US10574367B2

公开(公告)日：2020-02-25

申请号：US16174867

申请日：2018-10-30

Applicant: Infineon Technologies AG

Inventor： Karl Dominizi ,  Oliver Frank ,  Herbert Jaeger ,  Herbert Knapp ,  Hao Li ,  Florian Starzer ,  Rainer Stuhlberger ,  Jonas Kammerer

IPC: H04B17/00 ,  H04B17/21 ,  H04B17/11 ,  H04B17/18 ,  H04B17/10

Abstract: One exemplary embodiment of the present invention relates to a circuit that includes at least one RF signal path for an RF signal and at least one power sensor, which is coupled to the RF signal path and configured to generate a sensor signal representing the power of the RF signal during normal operation of the circuit. The circuit further includes a circuit node for receiving an RF test signal during calibration operation of the circuit. The circuit node is coupled to the at least one power sensor, so that the at least one power sensor receives the RF test signal additionally or alternatively to the RF signal and generates the sensor signal as representing the power of the RF test signal.