公开(公告)号：US10184978B2

公开(公告)日：2019-01-22

申请号：US14571507

申请日：2014-12-16

Applicant: Infineon Technologies AG

Inventor： Karl Dominizi ,  Oliver Frank ,  Klaus Standner ,  Stefan Zielke

IPC: G01R31/28

Abstract: A probe card for a wafer tester includes a mother card having a reinforcing element and at least one daughter card which is rigidly connected to the reinforcing element detachably. The mother card includes electrical contacts for producing an electrical connection with the wafer tester. The at least one daughter card includes electrical contact elements for making contact with an electrical circuit on a wafer. In addition, the mother card and the at least one daughter card are electrically detachably connected to one another via an electrical interface.

公开(公告)号：US20150168456A1

公开(公告)日：2015-06-18

申请号：US14571507

申请日：2014-12-16

Applicant: Infineon Technologies AG

Inventor： Karl Dominizi ,  Oliver Frank ,  Klaus Standner ,  Stefan Zielke

IPC: G01R1/073 ,  G01R1/04

CPC classification number: G01R31/2889

Abstract: A probe card for a wafer tester includes a mother card having a reinforcing element and at least one daughter card which is rigidly connected to the reinforcing element detachably. The mother card includes electrical contacts for producing an electrical connection with the wafer tester. The at least one daughter card includes electrical contact elements for making contact with an electrical circuit on a wafer. In addition, the mother card and the at least one daughter card are electrically detachably connected to one another via an electrical interface.

Abstract translation: 用于晶片测试器的探针卡包括具有加强元件的母卡和可拆卸地刚性地连接到加强元件的至少一个子卡。 母卡包括用于与晶片测试器产生电连接的电触点。 至少一个子卡包括用于与晶片上的电路接触的电接触元件。 此外，母卡和至少一个子卡经由电接口彼此电可拆卸地连接。

公开(公告)号：US10574367B2

公开(公告)日：2020-02-25

申请号：US16174867

申请日：2018-10-30

Applicant: Infineon Technologies AG

Inventor： Karl Dominizi ,  Oliver Frank ,  Herbert Jaeger ,  Herbert Knapp ,  Hao Li ,  Florian Starzer ,  Rainer Stuhlberger ,  Jonas Kammerer

IPC: H04B17/00 ,  H04B17/21 ,  H04B17/11 ,  H04B17/18 ,  H04B17/10

Abstract: One exemplary embodiment of the present invention relates to a circuit that includes at least one RF signal path for an RF signal and at least one power sensor, which is coupled to the RF signal path and configured to generate a sensor signal representing the power of the RF signal during normal operation of the circuit. The circuit further includes a circuit node for receiving an RF test signal during calibration operation of the circuit. The circuit node is coupled to the at least one power sensor, so that the at least one power sensor receives the RF test signal additionally or alternatively to the RF signal and generates the sensor signal as representing the power of the RF test signal.

公开(公告)号：US10128962B2

公开(公告)日：2018-11-13

申请号：US15145485

申请日：2016-05-03

Applicant: Infineon Technologies AG

Inventor： Karl Dominizi ,  Oliver Frank ,  Herbert Jaeger ,  Herbert Knapp ,  Hao Li ,  Florian Starzer ,  Rainer Stuhlberger ,  Jonas Wursthorn

IPC: H04B17/00 ,  H04B17/21 ,  H04B17/11 ,  H04B17/18 ,  H04B17/10

Abstract: One exemplary embodiment of the present invention relates to a circuit that includes at least one RF signal path for an RF signal and at least one power sensor, which is coupled to the RF signal path and configured to generate a sensor signal representing the power of the RF signal during normal operation of the circuit. The circuit further includes a circuit node for receiving an RF test signal during calibration operation of the circuit. The circuit node is coupled to the at least one power sensor, so that the at least one power sensor receives the RF test signal additionally or alternatively to the RF signal and generates the sensor signal as representing the power of the RF test signal.