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公开(公告)号：US10145882B2
公开(公告)日：2018-12-04
申请号：US15132783
申请日：2016-04-19
Applicant: Infineon Technologies AG
Inventor： Friedrich Rasbornig , Mario Motz , Dirk Hammerschmidt , Ferdinand Gastinger , Bernhard Schaffer , Wolfgang Granig
Abstract: Embodiments relate to systems and methods for sensor self-diagnostics using multiple signal paths. In an embodiment, the sensors are magnetic field sensors, and the systems and/or methods are configured to meet or exceed relevant safety or other industry standards, such as SIL standards. For example, a monolithic integrated circuit sensor system implemented on a single semiconductor ship can include a first sensor device having a first signal path for a first sensor signal on a semiconductor chip; and a second sensor device having a second signal path for a second sensor signal on the semiconductor chip, the second signal path distinct from the first signal path, wherein a comparison of the first signal path signal and the second signal path signal provides a sensor system self-test.
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公开(公告)号：US20130200909A1
公开(公告)日：2013-08-08
申请号：US13833852
申请日：2013-03-15
Applicant: Infineon Technologies AG
Inventor： Friedrich Rasbornig , Mario Motz , Wolfgang Scherr , Wolfgang Granig , Michael Strasser , Bernhard Schaffer , Gerhard Pircher
IPC: G01R31/3187
CPC classification number: G01R31/3187 , B60T8/885 , B60T2250/06 , B60T2270/406 , B60T2270/411 , B60T2270/413 , B60W50/0205 , B60W2050/0047 , B60W2050/0215 , G01D3/08 , G01R31/007 , G01R31/2829
Abstract: Embodiments relate to systems and methods for self-diagnostics and/or error detection using multiple signal paths in sensor and other systems. In an embodiment, a sensor system comprises at least two sensors, such as magnetic field sensors, and separate signal paths associated with each of the sensors. A first signal path can be coupled to a first sensor and a first digital signal processor (DSP), and a second signal path can be coupled to a second sensor and a second DSP. A signal from the first DSP can be compared with a signal from the second DSP, either on-chip or off, to detect faults, errors, or other information related to the operation of the sensor system. Embodiments of these systems and/or methods can be configured to meet or exceed relevant safety or other industry standards, such as safety integrity level (SIL) standards.
Abstract translation: 实施例涉及在传感器和其他系统中使用多个信号路径的自诊断和/或错误检测的系统和方法。 在一个实施例中，传感器系统包括至少两个传感器，例如磁场传感器，以及与每个传感器相关联的单独的信号路径。 第一信号路径可以耦合到第一传感器和第一数字信号处理器（DSP），并且第二信号路径可以耦合到第二传感器和第二DSP。 可以将来自第一DSP的信号与来自第二DSP的信号进行片内或截止比较，以检测与传感器系统的操作相关的故障，错误或其他信息。 这些系统和/或方法的实施例可以被配置为满足或超过相关安全或其他行业标准，例如安全完整性等级（SIL）标准。
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公开(公告)号：US11855789B2
公开(公告)日：2023-12-26
申请号：US16941050
申请日：2020-07-28
Applicant: Infineon Technologies AG
Inventor： Friedrich Rasbornig , Wolfgang Granig , Bernhard Schaffer , Wolfgang Scherr , Michael Strasser
Abstract: Embodiments relate to a controller operable to transmit digital data messages to a receiver via a communication link having at least a first and a second transmission path, the controller comprising a first signal terminal the first transmission path and a second signal terminal for the second transmission path. The first signal terminal is operable to digitally transmit a first message to the receiver according to a first transmission technique and the second signal terminal is being operable to digitally transmit a second message to the receiver according to a second, different transmission technique.
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公开(公告)号：US20230305048A1
公开(公告)日：2023-09-28
申请号：US18329018
申请日：2023-06-05
Applicant: Infineon Technologies AG
Inventor： Friedrich Rasbornig , Dirk Hammerschmidt , Bernhard Schaffer , Hans-Jörg Wagner
CPC classification number: G01R31/005 , G01R33/0047
Abstract: Some described techniques address issues of latency and lengthy processing times associated with conventional redundant sensor measurement systems that rely upon digital transmission protocols by implementing a diverse analog sensor interface architecture. Additional described techniques provide a redundant signaling solution to achieve signaling diversity using a combination of analog and digital sensor interface architectures. The described architectures may advantageously use a number of sensor measurement paths that may be independent of one another or share any suitable number of common components to provide varying levels of redundancy. When redundant analog sensor interface architectures are implemented, the analog interfaces may also provide signal diversity with respect to the use of different types of analog transmission protocols, which may include different signaling interfaces (e.g. differential versus single-ended), different transmission interfaces (e.g. voltage versus current interfaces), and/or the use of different signalization schemes.
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公开(公告)号：US10903865B2
公开(公告)日：2021-01-26
申请号：US14604063
申请日：2015-01-23
Applicant: Infineon Technologies AG
Inventor： Friedrich Rasbornig , Robert Hermann , Wolfgang Granig , Bernhard Schaffer , Wolfgang Scherr , Michael Strasser
Abstract: A signal interface for a receiver includes a first receiver module configured to receive a first message related to a content. The first receiver module is configured to generate a first adapted message based on the first message and a first transformation protocol. The signal interface further includes a second receiver module configured to receive a second message related to the content. The second receiver module is configured to generate a second adapted message based on the second message and a second transformation protocol. The first transformation protocol associated with the first receiver module and the second transformation protocol associated with the second receiver module are different.
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Patent Agency Ranking
公开(公告)号：US10514410B2
公开(公告)日：2019-12-24
申请号：US16046093
申请日：2018-07-26
Applicant: Infineon Technologies AG
Inventor： Friedrich Rasbornig , Mario Motz , Dirk Hammerschmidt , Ferdinand Gastinger , Bernhard Schaffer , Wolfgang Granig
Abstract: Embodiments relate to systems and methods for sensor self-diagnostics using multiple signal paths. In an embodiment, the sensors are magnetic field sensors, and the systems and/or methods are configured to meet or exceed relevant safety or other industry standards, such as SIL standards. For example, a monolithic integrated circuit sensor system implemented on a single semiconductor ship can include a first sensor device having a first signal path for a first sensor signal on a semiconductor chip; and a second sensor device having a second signal path for a second sensor signal on the semiconductor chip, the second signal path distinct from the first signal path, wherein a comparison of the first signal path signal and the second signal path signal provides a sensor system self-test.
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公开(公告)号：US09874609B2
公开(公告)日：2018-01-23
申请号：US13833852
申请日：2013-03-15
Applicant: Infineon Technologies AG
Inventor： Friedrich Rasbornig , Mario Motz , Wolfgang Scherr , Wolfgang Granig , Michael Strasser , Bernhard Schaffer , Gerhard Pircher , Ferdinand Gastinger , Dirk Hammerschmidt
CPC classification number: G01R31/3187 , B60T8/885 , B60T2250/06 , B60T2270/406 , B60T2270/411 , B60T2270/413 , B60W50/0205 , B60W2050/0047 , B60W2050/0215 , G01D3/08 , G01R31/007 , G01R31/2829
Abstract: Embodiments relate to systems and methods for self-diagnostics and/or error detection using multiple signal paths in sensor and other systems. In an embodiment, a sensor system comprises at least two sensors, such as magnetic field sensors, and separate signal paths associated with each of the sensors. A first signal path can be coupled to a first sensor and a first digital signal processor (DSP), and a second signal path can be coupled to a second sensor and a second DSP. A signal from the first DSP can be compared with a signal from the second DSP, either on-chip or off, to detect faults, errors, or other information related to the operation of the sensor system. Embodiments of these systems and/or methods can be configured to meet or exceed relevant safety or other industry standards, such as safety integrity level (SIL) standards.
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公开(公告)号：US20170122772A1
公开(公告)日：2017-05-04
申请号：US15290355
申请日：2016-10-11
Applicant: Infineon Technologies AG
Inventor： Alessandro Michelutti , Bernhard Schaffer , Wolfgang Horn , Simon Hainz
Abstract: A circuit for obtaining information on a physical quantity according to an embodiment includes a sensor arrangement sensitive to the physical quantity, at least one further sensor element sensitive to the physical quantity and a supply circuit configured to provide the sensor arrangement with a supply signal comprising a supply voltage controlled by the supply circuit in a closed-loop configuration. The supply circuit is further configured to provide the at least one further sensor element with a further supply signal comprising a further supply current such that a magnitude of the further supply current fulfills a predetermined relationship with a magnitude of a supply current of the supply signal. As a consequence, it may be possible to improve a trade-off between an improved compensation of variations, simplifying an implementation, simplifying the manufacturing, simplifying the sensing and providing stable sensing conditions.
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公开(公告)号：US20140266163A1
公开(公告)日：2014-09-18
申请号：US14182984
申请日：2014-02-18
Applicant: Infineon Technologies AG
Inventor： Bernhard Schaffer
CPC classification number: G01B7/30 , G01B11/26 , G01D5/145 , G01D5/2451 , G01P3/487 , G01P13/045 , G01R27/2605 , G01R33/0029 , G01R33/0035 , G01R33/02
Abstract: Embodiments relate to sensor systems and methods for rapidly detecting a direction of rotation. In one embodiment, a sensor system is configured to identify positive and negative peaks of both speed and direction signals and to evaluate a sequential order of the peaks. A direction of rotation can be identified rapidly from the evaluation of the sequential order of peaks.
Abstract translation: 实施例涉及用于快速检测旋转方向的传感器系统和方法。 在一个实施例中，传感器系统被配置为识别速度和方向信号的正峰值和负峰值，并且评估峰值的顺序。 可以从峰值的顺序顺序的评估中快速识别旋转方向。
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公开(公告)号：US12013259B2
公开(公告)日：2024-06-18
申请号：US16143171
申请日：2018-09-26
Applicant: Infineon Technologies AG
Inventor： Benjamin Kollmitzer , Stephan Leisenheimer , Mario Motz , Bernhard Schaffer
Abstract: A device may determine a sensor identifier corresponding to a sensor integrated circuit (IC) associated with a sensor system. The device may provide the sensor identifier corresponding to the sensor IC. The device may receive, based on providing the sensor identifier, compensation parameter information associated with the sensor IC. The device may cause a set of compensation parameters, associated with the compensation parameter information, to be stored on a controller associated with the sensor system. The set of compensation parameters may include one or more parameters associated with correcting a measurement performed by the sensor IC or a safety result provided by the sensor IC.
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