Photoacoustic gas sensors and method of operating a photoacoustic gas sensor

    公开(公告)号:US11156547B2

    公开(公告)日:2021-10-26

    申请号:US16380376

    申请日:2019-04-10

    Abstract: A photoacoustic gas sensor is provided. The photoacoustic gas sensor includes a hermetically sealed housing filled with a reference gas. Further, the photoacoustic gas sensor includes a microphone system arranged inside the housing. The microphone system is configured to generate a first microphone signal comprising a first signal component related to a photoacoustic excitation of the reference gas and a second microphone signal comprising a second signal component related to the photoacoustic excitation. The photoacoustic gas sensor additionally includes a circuit configured to generate an output signal based on the first microphone signal and the second microphone signal by destructively superimposing a third signal component of the first microphone signal related to mechanical vibrations of the photoacoustic gas sensor and a fourth signal component of the second microphone signal related to the mechanical vibrations.

    Photoacoustic gas sensor and method for operating a photoacoustic gas sensor

    公开(公告)号:US11137376B2

    公开(公告)日:2021-10-05

    申请号:US16408712

    申请日:2019-05-10

    Abstract: A photoacoustic gas sensor includes a hermetically sealed housing filled with a reference gas. The photoacoustic gas sensor furthermore includes a microphone arranged in the housing and configured to generate a microphone signal as a function of a sound wave based on light incident in the housing. Furthermore, the photoacoustic gas sensor includes a controllable heat source arranged in the housing and configured to selectively thermoacoustically excite the reference gas in order to generate a thermoacoustic sound wave phase-shifted with respect to the sound wave.

    Gas concentration detection by means of thermoacoustic sound wave

    公开(公告)号:US11635410B2

    公开(公告)日:2023-04-25

    申请号:US17446507

    申请日:2021-08-31

    Abstract: A gas sensor having a heater, a receiver, and a space arranged between the heater and the receiver, is described, the heater being configured to generate a thermoacoustic sound wave propagating through the space by using a stimulation signal. The receiver is in this case configured to receive the thermoacoustic sound wave that has propagated through the space and to convert it into a reception signal that has a time-of-flight-dependent shift with respect to the stimulation signal and therefore information relating to the gas concentration in the space.

    Photoacoustic sensor, method for checking a gas-tightness, and system

    公开(公告)号:US10900932B2

    公开(公告)日:2021-01-26

    申请号:US16203859

    申请日:2018-11-29

    Abstract: An example of a system comprises a volume filled with a gas, a gas excitation device configured to excite the gas inside the volume, a microphone configured to output a microphone signal on the basis of the gas excited by the gas excitation device, and a testing unit configured to take the microphone signal as a basis for testing a gas-tightness of the volume. An example of a photoacoustic sensor comprises a hermetically sealed sensor cell, a gas excitation device and a testing unit configured to take the microphone signal dependent on the thermally excited gas as a basis for testing a gas-tightness of the sensor cell. One example comprises a method for testing a gas-tightness of a volume filled with a gas.

    Integration of a sensor system in a casing

    公开(公告)号:US12157145B2

    公开(公告)日:2024-12-03

    申请号:US17865504

    申请日:2022-07-15

    Abstract: A sensor system for attachment to a casing includes at least one sensor element, where the sensor element is configured for detecting an environment property of an environment which, with the sensor system attached to the casing, is situated on the opposite side of the casing with respect to the sensor system. The sensor system also includes an encapsulation layer, where the sensor element is embedded in the encapsulation layer, and where the encapsulation layer has a contact surface for attaching the sensor system to the casing.

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