Temperature Sensor Arrangement in Semiconductor Module

    公开(公告)号:US20230326823A1

    公开(公告)日:2023-10-12

    申请号:US17714550

    申请日:2022-04-06

    Abstract: A semiconductor module includes a first circuit carrier including one or more heat generating elements mounted on an upper surface of the first circuit carrier, a second circuit carrier mounted over the first circuit carrier and being vertically spaced apart from the upper surface of the first circuit carrier, and a temperature sensor that is fixedly attached to the second circuit carrier and is arranged in a vertical space between the lower surface of the second circuit carrier and the upper surface of the first circuit carrier, wherein the temperature sensor is arranged in sufficient proximity to a first one of the heat generating elements to obtain a direct temperature measurement from the first one of the heat generating elements.

    Power Semiconductor Module
    5.
    发明申请

    公开(公告)号:US20220399259A1

    公开(公告)日:2022-12-15

    申请号:US17829610

    申请日:2022-06-01

    Inventor: Michael Ebli

    Abstract: A power semiconductor module includes an electrically insulating carrier plate with a structured, electrically conducting metallization layer disposed on a surface thereof, and a connection pin having two ends and being adhered to the carrier plate, one end of the connection pin being electrically connected to the metallization layer. The module further includes a semiconductor device adhered to the carrier plate and electrically connected to the metallization layer, and a discrete circuit including a voltage-or-current-or-both controlling device, the voltage-or-current-or-both controlling device being operatively coupled with the semiconductor device and being integrated in the connection pin at one of or between the two ends of the connection pin.

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