-
公开(公告)号：US20220115245A1
公开(公告)日：2022-04-14
申请号：US17492865
申请日：2021-10-04
发明人： Jayaganasan Narayanasamy , Syahir Abd Hamid , Meng How Chong , Michael Reyes Godoy , Chee Ming Lam , Adbul Rahman Mohamed , Sanjay Kumar Murugan , Thomas Stoek
IPC分类号： H01L21/48 , H01L21/56 , H01L23/495 , H01L23/31
摘要： A method for fabricating a power semiconductor package includes: providing a leadframe having a die pad and a frame, wherein the die pad is connected to the frame by at least one tie bar; attaching a semiconductor die to the die pad; laser cutting through the at least one tie bar, thereby forming a cut surface; and after the laser cutting, molding over the die pad and the semiconductor die, wherein the cut surface is completely covered by molding compound.
-
公开(公告)号：US20200020607A1
公开(公告)日：2020-01-16
申请号：US16504692
申请日：2019-07-08
发明人： Syahir Abd Hamid , Jagen Krishnan , Mian Mian Lam , Jayaganasan Narayanasamy , Fabian Schnoy , Thomas Stoek , Christian Stuempfl
IPC分类号： H01L23/373 , H01L23/495 , H01L23/31 , H01L23/367 , H01L21/56 , H01L21/48
摘要： A method of forming a semiconductor device includes providing a semiconductor package comprising an electrically insulating mold compound body, a semiconductor die that is encapsulated by the mold compound body, a plurality of electrically conductive leads that each protrude out of the mold compound body, and a metal heat slug, the metal heat slug comprising a rear surface that is exposed from the mold compound body, coating outer portions of the leads that are exposed from the mold compound body with a metal coating, and after completing the coating of the outer portions of the leads, providing a planar metallic heat sink interface surface on the semiconductor device which is exposed from the mold compound body, and substantially devoid of the metal coating.
-
公开(公告)号：US10651109B2
公开(公告)日：2020-05-12
申请号：US16504692
申请日：2019-07-08
发明人： Syahir Abd Hamid , Jagen Krishnan , Mian Mian Lam , Jayaganasan Narayanasamy , Fabian Schnoy , Thomas Stoek , Christian Stuempfl
IPC分类号： H01L23/373 , H01L23/495 , H01L21/48 , H01L23/367 , H01L21/56 , H01L23/31
摘要： A method of forming a semiconductor device includes providing a semiconductor package comprising an electrically insulating mold compound body, a semiconductor die that is encapsulated by the mold compound body, a plurality of electrically conductive leads that each protrude out of the mold compound body, and a metal heat slug, the metal heat slug comprising a rear surface that is exposed from the mold compound body, coating outer portions of the leads that are exposed from the mold compound body with a metal coating, and after completing the coating of the outer portions of the leads, providing a planar metallic heat sink interface surface on the semiconductor device which is exposed from the mold compound body, and substantially devoid of the metal coating.
-
公开(公告)号：US20200020621A1
公开(公告)日：2020-01-16
申请号：US16036354
申请日：2018-07-16
IPC分类号： H01L23/495 , H01L21/48 , H01L23/31 , C25D7/12 , C25D5/02
摘要： A semiconductor package having an electrically insulating mold compound body, a metal heat slug and a plurality of electrically conductive leads is provided. The heat slug has a rear surface that is exposed from the mold compound body and a die attach surface opposite the rear surface and to which a semiconductor die is mounted. each of the leads have outer portions that are exposed from the mold compound body. The outer portions of the leads are coated with a metal coating. After completing the coating of the outer portions of the leads, a planar metallic heat sink interface surface is provided on the semiconductor device. The planar metallic heat sink interface surface is exposed from the mold compound body, thermally coupled to the semiconductor die via the heat slug, and substantially devoid of the metal coating.
-
-
-
搜索结果
4 条记录 (耗时 0.01 秒)
