公开(公告)号：US09655265B2

公开(公告)日：2017-05-16

申请号：US14287083

申请日：2014-05-26

Applicant: Infineon Technologies AG

Inventor： Tiam Meng Pon ,  Theng Chao Long

IPC: H01R9/00 ,  H05K7/02 ,  H05K3/32 ,  H01L23/64 ,  H01L25/07 ,  H01L23/495 ,  H01L23/50 ,  H01L23/31 ,  H01L23/00

CPC classification number: H05K7/02 ,  H01L23/3107 ,  H01L23/49562 ,  H01L23/50 ,  H01L23/64 ,  H01L23/645 ,  H01L24/83 ,  H01L25/07 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/48091 ,  H01L2224/4903 ,  H01L2224/49111 ,  H01L2224/83801 ,  H05K3/32 ,  H05K2203/0703 ,  H05K2203/1305 ,  Y10T29/49131 ,  Y10T29/49147 ,  H01L2924/00014 ,  H01L2924/014

Abstract: An electronic module is provided, comprising an electronic chip arranged in the electronic module and comprising an input terminal and an output terminal; a first current path electrically connected to the input terminal; a second current path electrically connected to the output terminal; and an insulation arranged between the first current path and the second current path, wherein the first current path and the second current path extend in the same direction and arranged in close proximity to each other.