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公开(公告)号：US09635761B2
公开(公告)日：2017-04-25
申请号：US14306768
申请日：2014-06-17
CPC分类号： H05K3/42 , H05K1/0222 , H05K1/115 , H05K1/116 , H05K3/0094 , H05K3/4685 , H05K2201/0959 , H05K2201/09745 , H05K2201/10242 , H05K2203/03 , H05K2203/0703 , H05K2203/30 , Y10T29/49123
摘要： A printed circuit board, and a method of fabricating the printed circuit board is disclosed. The printed circuit board includes at least one coaxial via. A hollow via is disposed in the printed circuit board. A metal sleeve is formed around the circumference of said hollow via. An inner conductive path is disposed in the hollow via. Additionally, an insulating material is disposed in the hollow via, between the conducting path and the metal sleeve. The conductive path is used to connect signal traces disposed on two different layers of the printed circuit board. In some embodiments, these signal traces carry signals having a frequency above 1 GHz, although the disclosure is not limited to this embodiment.
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公开(公告)号：US20170208695A1
公开(公告)日：2017-07-20
申请号：US15459383
申请日：2017-03-15
CPC分类号： H05K3/42 , H05K1/0222 , H05K1/115 , H05K1/116 , H05K3/0094 , H05K3/4685 , H05K2201/0959 , H05K2201/09745 , H05K2201/10242 , H05K2203/03 , H05K2203/0703 , H05K2203/30 , Y10T29/49123
摘要： A printed circuit board, and a method of fabricating the printed circuit board is disclosed. The printed circuit board includes at least one coaxial via. A hollow via is disposed in the printed circuit board. A metal sleeve is formed around the circumference of said hollow via. An inner conductive path is disposed in the hollow via. Additionally, an insulating material is disposed in the hollow via, between the conducting path and the metal sleeve. The conductive path is used to connect signal traces disposed on two different layers of the printed circuit board. In some embodiments, these signal traces carry signals having a frequency above 1 GHz, although the disclosure is not limited to this embodiment.
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3.发明申请METHOD OF REMOVING SOLUBLE MATERIAL LAYER BY DISSOLVING, METHOD OF MANUFACTURING MEMBER, SOCKET FOR USE IN ELECTRONIC PART, AND ELECTRIC AND ELECTRONIC DEVICES 有权通过解决方法去除可溶材料层的方法，制造成员的方法，用于电子部件的插座以及电气和电子设备公开(公告)号：US20160338208A1
公开(公告)日：2016-11-17
申请号：US15154354
申请日：2016-05-13
发明人： Hiroyuki Kanno , Masahiro Koike
CPC分类号： H05K3/22 , C23C18/1651 , C23C18/1689 , C23C18/32 , H05K1/0216 , H05K2201/0715 , H05K2203/0703 , H05K2203/0756
摘要： A concave part defined by a ring-shaped step is formed on the upper surface of a housing body. A first elastic member is brought into contact with a portion of an electroless nickel-plated layer, the portion being in a region inside the concave part. The first elastic member is then pressed and deformed so that the whole of an angular portion, at which the upper surface of the ring-shaped step and its side surface cross, bites into the first elastic member and that the first elastic member and the electroless nickel-plated layer on the upper surface of the ring-shaped step are separated from each other. The housing body is then immersed in a dissolving liquid that can dissolve the electroless nickel-plated layer while the first elastic member is kept deformed.
摘要翻译： 在壳体的上表面上形成由环状台阶形成的凹部。 使第一弹性部件与无电镀镍层的一部分接触，该部分位于凹部内部的区域。 然后将第一弹性构件压制和变形，使得环形台阶的上表面及其侧表面交叉的整个角部分咬入第一弹性构件，并且第一弹性构件和无电解 在环状台阶的上表面上的镀镍层彼此分离。 然后将壳体浸入可溶解化学镀镍层的溶解液体中，同时第一弹性构件保持变形。
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公开(公告)号：US20150342073A1
公开(公告)日：2015-11-26
申请号：US14287083
申请日：2014-05-26
发明人： Tiam Meng PON , Theng Chao LONG
CPC分类号： H05K7/02 , H01L23/3107 , H01L23/49562 , H01L23/50 , H01L23/64 , H01L23/645 , H01L24/83 , H01L25/07 , H01L2224/291 , H01L2224/32245 , H01L2224/33181 , H01L2224/48091 , H01L2224/4903 , H01L2224/49111 , H01L2224/83801 , H05K3/32 , H05K2203/0703 , H05K2203/1305 , Y10T29/49131 , Y10T29/49147 , H01L2924/00014 , H01L2924/014
摘要： An electronic module is provided, comprising an electronic chip arranged in the electronic module and comprising an input terminal and an output terminal; a first current path electrically connected to the input terminal; a second current path electrically connected to the output terminal; and an insulation arranged between the first current path and the second current path, wherein the first current path and the second current path extend in the same direction and arranged in close proximity to each other.
摘要翻译： 提供了一种电子模块，包括布置在电子模块中的电子芯片，包括输入端子和输出端子; 电连接到所述输入端的第一电流通路; 电连接到输出端的第二电流通路; 以及布置在所述第一电流路径和所述第二电流路径之间的绝缘体，其中所述第一电流路径和所述第二电流路径在相同方向上延伸并彼此靠近地布置。
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公开(公告)号：US20180192516A1
公开(公告)日：2018-07-05
申请号：US15581947
申请日：2017-04-28
申请人： HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd. , FuKui Precision Component (Shenzhen) Co., Ltd.
发明人： XIAN-QIN HU , MEI YANG , CHENG-JIA LI
CPC分类号： H05K1/115 , H05K3/0023 , H05K3/18 , H05K3/185 , H05K3/4076 , H05K3/429 , H05K3/4644 , H05K3/4661 , H05K3/4691 , H05K2201/096 , H05K2203/0703
摘要： A composite circuit board includes an insulation layer, an inner circuit layer, a first conductive layer and a second conductive layer embedded in the insulation layer, a third conductive layer and a fourth conductive layer formed on opposite surfaces of the insulation layer. The third conductive layer electrically connects with the first conductive layer. The fourth conductive layer electrically connects with the second conductive layer. The inner circuit layer is in a middle portion of the insulation layer. The first conductive layer and the second conductive layer respectively forms on opposite sides of the inner circuit layer. The insulation layer forms a plurality of first through holes between the first conductive layer and the inner circuit layer, a plurality of second through holes between the second conductive layer and the inner circuit layer.
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6.发明申请公开(公告)号：US20170290150A1
公开(公告)日：2017-10-05
申请号：US15505619
申请日：2015-09-08
发明人： Takashi KASUGA , Yoshio OKA , Shigeaki UEMURA , Shigeyoshi NAKAYAMA , Jinjoo PARK , Sumito UEHARA , Hiroshi UEDA , Kousuke MIURA
CPC分类号： H05K1/092 , B22F1/0018 , B22F1/0059 , B22F3/16 , B22F7/064 , B22F2998/10 , B22F2999/00 , C09D11/037 , C09D11/10 , C09D11/52 , C23C18/1653 , C23C18/1692 , C23C18/1879 , C23C18/2033 , C23C18/208 , C23C18/2086 , C23C18/30 , C23C18/31 , C23C18/32 , C23C18/405 , C23C18/42 , H05K1/097 , H05K3/02 , H05K3/022 , H05K3/108 , H05K3/18 , H05K3/381 , H05K3/4661 , H05K2201/032 , H05K2203/0703 , H05K2203/1105 , C22C1/0425 , B22F7/08 , B22F1/0074 , C23C18/00 , B22F2003/248 , C25D7/00
摘要： The substrate for a printed circuit board according to an embodiment of the present invention includes a base film having insulating properties, and a metal layer stacked on at least one surface of the base film, in which the base film includes a portion where a transition metal in group 10 of the periodic table is present. The transition metal in group 10 is preferably nickel or palladium. The portion where the transition metal in group 10 is present preferably includes a region having an average thickness of 500 nm and extending from an interface with the metal layer.
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7.发明授权公开(公告)号：US09198278B2
公开(公告)日：2015-11-24
申请号：US14188998
申请日：2014-02-25
CPC分类号： H05K1/0218 , H05K1/0366 , H05K1/09 , H05K1/115 , H05K3/0017 , H05K3/0097 , H05K3/403 , H05K3/427 , H05K3/429 , H05K2201/0397 , H05K2201/09545 , H05K2201/1034 , H05K2203/063 , H05K2203/0703 , Y10T29/49155 , Y10T29/49165
摘要： A printed circuit board includes at least one plated-through hole via drilled into at least one of a first layer on a first side of the printed circuit board and a second layer on a second side of the printed circuit board. The printed circuit board also includes a core section laminated between the first layer and the second layer, wherein a length of the core section is shorter than a length of the first layer and a length of the second layer. The printed circuit board further includes an open slot configured to house a connection tab of an electronic product connected to the printed circuit board, wherein the open slot is formed adjacent to the core section and between sections of the first layer and the second layer that are longer than the core section.
摘要翻译： 印刷电路板包括穿过印刷电路板的第一侧上的第一层和印刷电路板的第二面上的第二层中的至少一个的至少一个电镀通孔。 印刷电路板还包括层叠在第一层和第二层之间的芯部，其中芯部的长度短于第一层的长度和第二层的长度。 印刷电路板还包括开口槽，其构造成容纳连接到印刷电路板的电子产品的连接片，其中所述开口狭缝形成在所述芯部分附近以及在所述第一层和所述第二层的部分之间 比核心部分长。
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公开(公告)号：US20150299839A1
公开(公告)日：2015-10-22
申请号：US14680782
申请日：2015-04-07
CPC分类号： C23C4/123 , B41J2/06 , B41J2202/04 , C23C4/01 , C23C4/08 , H05K3/14 , H05K2203/0703 , H05K2203/104
摘要： In a method for ejecting droplets of a molten metal, the metal is an alloy including a first metal and a second metal. During a jetting operation, the second metal segregates from the first metal. A method of using such alloy is also disclosed herein.
摘要翻译： 在用于喷射熔融金属的液滴的方法中，金属是包括第一金属和第二金属的合金。 在喷射操作期间，第二金属与第一金属分离。 本文还公开了使用这种合金的方法。
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公开(公告)号：US08872329B1
公开(公告)日：2014-10-28
申请号：US12351596
申请日：2009-01-09
IPC分类号： H01L23/12
CPC分类号： H05K3/4617 , H01L21/486 , H01L21/6835 , H01L23/16 , H01L23/48 , H01L23/49827 , H01L2221/68345 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/2919 , H01L2224/32225 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2924/00014 , H05K3/0064 , H05K2203/041 , H05K2203/061 , H05K2203/0703 , H01L2224/45099 , H01L2924/014 , H01L2924/00
摘要： An extended landing pad substrate package includes a dielectric layer having an upper surface and an opposite lower surface. A lower circuit pattern is embedded in the lower surface of the dielectric layer. The lower circuit pattern includes traces having a first thickness and extended landing pads having a second thickness greater than the first thickness. Blind via apertures are formed through an upper circuit pattern embedded into the upper surface of the dielectric layer, through the dielectric layer and to the extended landing pads. The length of the blind via apertures is minimized due to the increase second thickness of the extended landing pads as compared to the first thickness of traces. Accordingly, the width of the blind via apertures at the upper surface of the dielectric layer is minimized.
摘要翻译： 延伸的着陆垫衬底封装包括具有上表面和相对的下表面的电介质层。 在电介质层的下表面嵌入较低的电路图案。 较低电路图案包括具有第一厚度的迹线和具有大于第一厚度的第二厚度的延伸着陆焊盘。 通过孔的盲孔通过嵌入电介质层的上表面的上电路图案形成，穿过电介质层和扩展的着陆焊盘。 盲孔通孔的长度由于与第一厚度的迹线相比扩大的着陆焊盘的第二厚度增加而最小化。 因此，电介质层上表面处的盲孔通孔的宽度最小化。
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公开(公告)号：US20170181292A1
公开(公告)日：2017-06-22
申请号：US15375592
申请日：2016-12-12
发明人： Qin Tang , Kit Ho Tong , Chit Yiu Chan , Kowk-Wai Yee
CPC分类号： H05K3/282 , C09D5/08 , C23C18/1637 , C23C18/168 , C23C18/1834 , C23C22/58 , C23F11/08 , C23F11/149 , H05K2203/0591 , H05K2203/0703
摘要： A method for forming an organic coating on a surface of nickel or nickel alloy is disclosed. The method includes contacting the nickel surface with a composition comprising a specific pyrazine derived compound to prevent corrosion of nickel without forming known gold emersion film on the surface of the nickel.
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