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公开(公告)号：US10681819B2
公开(公告)日：2020-06-09
申请号：US16224578
申请日：2018-12-18
Applicant: Infineon Technologies Austria AG
Inventor： Eung San Cho , Danny Clavette , Darryl Galipeau
IPC: H01L23/48 , H05K3/00 , H01L23/538 , H01L23/00 , H05K1/11 , H05K1/14 , H05K1/18 , H05K3/46 , H05K3/32 , H05K3/40
Abstract: In one example, a method includes drilling a cavity into each contact pad of one or more contact pads of a first printed circuit board to form one or more cavities. The first printed circuit board includes an embedded integrated circuit and one or more metal layers. The method further includes forming one or more first metal layers for a second printed circuit board below a bottom surface of the first printed circuit board. The method further includes forming an electrically conductive material in the one or more cavities. The electrically conductive material electrically couples the one or more contact pads of the first printed circuit board to the second printed circuit board. The method further includes forming one or more second metal layers for the second printed circuit board above a top surface of the first printed circuit board.
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公开(公告)号：US20240107669A1
公开(公告)日：2024-03-28
申请号：US17952859
申请日：2022-09-26
Applicant: Infineon Technologies Austria AG
Inventor： Darryl Galipeau , Danny Clavette , Darryl TSCHIRHART
CPC classification number: H05K1/14 , H02M3/003 , H05K1/141 , H05K1/145 , H05K1/18 , H05K3/366 , H02M3/1584 , H05K2201/047 , H05K2201/09163 , H05K2201/10015 , H05K2201/1003 , H05K2201/10166
Abstract: A circuit board assembly may include a first circuit board including a first slot. The circuit board assembly may include a second circuit board. The first circuit board may be interlocked with the second circuit board via interlocking provided by the second circuit board into the first slot.
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公开(公告)号：US20190124773A1
公开(公告)日：2019-04-25
申请号：US16224578
申请日：2018-12-18
Applicant: Infineon Technologies Austria AG
Inventor： Eung San Cho , Danny Clavette , Darryl Galipeau
IPC: H05K3/00 , H05K1/11 , H05K3/32 , H05K3/40 , H05K3/46 , H05K1/18 , H05K1/14 , H01L23/00 , H01L23/538
Abstract: In one example, a method includes drilling a cavity into each contact pad of one or more contact pads of a first printed circuit board to form one or more cavities. The first printed circuit board includes an embedded integrated circuit and one or more metal layers. The method further includes forming one or more first metal layers for a second printed circuit board below a bottom surface of the first printed circuit board. The method further includes forming an electrically conductive material in the one or more cavities. The electrically conductive material electrically couples the one or more contact pads of the first printed circuit board to the second printed circuit board. The method further includes forming one or more second metal layers for the second printed circuit board above a top surface of the first printed circuit board.
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公开(公告)号：US11683889B2
公开(公告)日：2023-06-20
申请号：US17475429
申请日：2021-09-15
Applicant: Infineon Technologies Austria AG
Inventor： Danny Clavette , Darryl Galipeau
CPC classification number: H05K1/188 , H05K1/05 , H05K1/162 , H05K1/165 , H05K2201/0221
Abstract: An interposer for a processor includes: an electrically insulating material having a first main side and a second main side opposite the first main side; an electrical interface for a processor substrate at the first main side of the electrically insulating material; and a power device module embedded in the electrically insulating material and configured to convert a voltage provided at the second main side of the electrically insulating material to a lower voltage. The power device module has at least one contact configured to receive the voltage provided at the second main side of the electrically insulating material. Distribution circuitry embedded in the electrically insulating material is configured to carry the lower voltage provided by the power device module to the first main side of the electrically insulating material.
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公开(公告)号：US10206286B2
公开(公告)日：2019-02-12
申请号：US15633154
申请日：2017-06-26
Applicant: Infineon Technologies Austria AG
Inventor： Eung San Cho , Danny Clavette , Darryl Galipeau
Abstract: In one example, a method includes drilling a cavity into each contact pad of one or more contact pads of a first printed circuit board to form one or more cavities. The first printed circuit board includes an embedded integrated circuit and one or more metal layers. The method further includes forming one or more first metal layers for a second printed circuit board below a bottom surface of the first printed circuit board. The method further includes forming an electrically conductive material in the one or more cavities. The electrically conductive material electrically couples the one or more contact pads of the first printed circuit board to the second printed circuit board. The method further includes forming one or more second metal layers for the second printed circuit board above a top surface of the first printed circuit board.
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Patent Agency Ranking
公开(公告)号：US20220007512A1
公开(公告)日：2022-01-06
申请号：US17475429
申请日：2021-09-15
Applicant: Infineon Technologies Austria AG
Inventor： Danny Clavette , Darryl Galipeau
Abstract: An interposer for a processor includes: an electrically insulating material having a first main side and a second main side opposite the first main side; an electrical interface for a processor substrate at the first main side of the electrically insulating material; and a power device module embedded in the electrically insulating material and configured to convert a voltage provided at the second main side of the electrically insulating material to a lower voltage. The power device module has at least one contact configured to receive the voltage provided at the second main side of the electrically insulating material. Distribution circuitry embedded in the electrically insulating material is configured to carry the lower voltage provided by the power device module to the first main side of the electrically insulating material.
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公开(公告)号：US11147165B2
公开(公告)日：2021-10-12
申请号：US16655306
申请日：2019-10-17
Applicant: Infineon Technologies Austria AG
Inventor： Danny Clavette , Darryl Galipeau
Abstract: An interposer for a processor includes: an electrically insulating material having a first main side and a second main side opposite the first main side; a plurality of electrically conductive structures embedded in the electrically insulating material and configured to provide an electrical interface for a processor substrate at the first main side of the electrically insulating material and to provide electrical connections from the electrical interface to the second main side of the electrically insulating material; and a power device module embedded in the electrically insulating material and configured to convert a voltage provided at the second main side of the electrically insulating material to a lower voltage at the first main side of the electrically insulating material.
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公开(公告)号：US11811316B2
公开(公告)日：2023-11-07
申请号：US16228444
申请日：2018-12-20
Applicant: INFINEON TECHNOLOGIES AUSTRIA AG
Inventor： Benjamin L. Schwabe , Christian Rainer , Darryl Galipeau
Abstract: A power supply system comprises: a switched-capacitor converter, a controller, and a monitor. Via generation of control signals, the controller controls settings of switches in the switched-capacitor converter to convert a received input voltage to an output voltage that powers a load. The monitor in the power supply system at least occasionally determines an impedance associated with the switched-capacitor converter. A magnitude of the determined impedance provides an indication whether the switched-capacitor converter is operating efficiently. To ensure efficient operation of the switched-capacitor converter, based on input form the monitor, the controller adjusts the control signals controlling the switches in the switched-capacitor converter as a function of the determined impedance.
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公开(公告)号：US20210120676A1
公开(公告)日：2021-04-22
申请号：US16655306
申请日：2019-10-17
Applicant: Infineon Technologies Austria AG
Inventor： Danny Clavette , Darryl Galipeau
Abstract: An interposer for a processor includes: an electrically insulating material having a first main side and a second main side opposite the first main side; a plurality of electrically conductive structures embedded in the electrically insulating material and configured to provide an electrical interface for a processor substrate at the first main side of the electrically insulating material and to provide electrical connections from the electrical interface to the second main side of the electrically insulating material; and a power device module embedded in the electrically insulating material and configured to convert a voltage provided at the second main side of the electrically insulating material to a lower voltage at the first main side of the electrically insulating material.
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公开(公告)号：US20180376598A1
公开(公告)日：2018-12-27
申请号：US15633154
申请日：2017-06-26
Applicant: Infineon Technologies Austria AG
Inventor： Eung San Cho , Danny Clavette , Darryl Galipeau
Abstract: In one example, a method includes drilling a cavity into each contact pad of one or more contact pads of a first printed circuit board to form one or more cavities. The first printed circuit board includes an embedded integrated circuit and one or more metal layers. The method further includes forming one or more first metal layers for a second printed circuit board below a bottom surface of the first printed circuit board. The method further includes forming an electrically conductive material in the one or more cavities. The electrically conductive material electrically couples the one or more contact pads of the first printed circuit board to the second printed circuit board. The method further includes forming one or more second metal layers for the second printed circuit board above a top surface of the first printed circuit board.
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