公开(公告)号：US20240162602A1

公开(公告)日：2024-05-16

申请号：US18401885

申请日：2024-01-02

Applicant: InnoLux Corporation

Inventor： Chia-Ping TSENG ,  Ker-Yih KAO ,  Chia-Chi HO ,  Ming-Yen WENG ,  Hung-I TSENG ,  Shu-Ling WU ,  Huei-Ying CHEN

IPC: H01Q1/38 ,  G02F1/1343 ,  H01L21/04 ,  H01L27/12 ,  H01Q3/34 ,  H01Q3/44 ,  H01Q9/04

CPC classification number: H01Q1/38 ,  G02F1/13439 ,  H01L21/045 ,  H01L27/1237 ,  H01Q3/34 ,  H01Q3/44 ,  H01Q9/0407 ,  G02F1/133345

Abstract: An electronic device is provided. The electronic device includes a first substrate, an insulating layer, a first conductive layer and a second conductive layer. The insulating layer is overlapped with the first substrate. The second conductive layer contacts with the first conductive layer. The first conductive layer and the second conductive layer are disposed between the first substrate and the insulating layer. The second conductive layer is disposed between the first conductive layer and the insulating layer. Moreover, a thermal expansion coefficient of the second conductive layer is between a thermal expansion coefficient of the first conductive layer and a thermal expansion coefficient of the insulating layer.

公开(公告)号：US20230006342A1

公开(公告)日：2023-01-05

申请号：US17929907

申请日：2022-09-06

Applicant: InnoLux Corporation

Inventor： Chia-Ping TSENG ,  Ker-Yih KAO ,  Chia-Chi HO ,  Ming-Yen WENG ,  Hung-I TSENG ,  Shu-Ling WU ,  Huei-Ying CHEN

IPC: H01Q1/38 ,  H01Q3/44 ,  H01Q9/04 ,  H01L27/12 ,  H01L21/04 ,  H01Q3/34 ,  G02F1/1343

Abstract: An electronic device is provided. The electronic device includes a first substrate, a multilayer structure, and a passivation layer. The multilayer structure is disposed on the first substrate. The multilayer structure includes a first conductive layer and a second conductive layer disposed on the first conductive layer. The passivation layer is disposed on the second conductive layer. In addition, a thermal expansion coefficient of the second conductive layer is between a thermal expansion coefficient of the first conductive layer and a thermal expansion coefficient of the passivation layer.

公开(公告)号：US20230089751A1

公开(公告)日：2023-03-23

申请号：US17736067

申请日：2022-05-03

Applicant: InnoLux Corporation

Inventor： Ker-Yih KAO ,  Hung-I TSENG

IPC: H01L23/538 ,  H01L21/48

Abstract: An electronic device includes a first metal layer, a first insulating layer, a second metal layer and a second insulating layer. The first insulating layer is disposed on the first metal layer, the second metal layer is disposed on the first insulating layer, and the second insulating layer is disposed between the second metal layer and the first insulating layer. The second metal layer is electrically connected to the first metal layer through a first opening of the first insulating layer and a second opening of the second insulating layer.

公开(公告)号：US20200251812A1

公开(公告)日：2020-08-06

申请号：US16732701

申请日：2020-01-02

Applicant: InnoLux Corporation

Inventor： Chia-Ping TSENG ,  Ker-Yih KAO ,  Chia-Chi HO ,  Ming-Yen WENG ,  Hung-I TSENG ,  Shu-Ling WU ,  Huei-Ying CHEN

IPC: H01Q1/38 ,  H01Q3/44 ,  H01Q3/34 ,  H01L27/12 ,  H01L21/04 ,  H01Q9/04

Abstract: An antenna device is provided. The antenna device includes a first substrate, a multilayer electrode, a second substrate, and a liquid-crystal layer. The multilayer electrode is disposed on the first substrate, and the multilayer electrode includes a first conductive layer, a second conductive layer, and a third conductive layer. The second conductive layer is disposed on the first conductive layer. The third conductive layer is disposed on the second conductive layer. The liquid-crystal layer is disposed between the first substrate and the second substrate. In addition, the third conductive layer includes a first portion that extends beyond the second conductive layer.

公开(公告)号：US20180375202A1

公开(公告)日：2018-12-27

申请号：US15906126

申请日：2018-02-27

Applicant: InnoLux Corporation

Inventor： I-Yin LI ,  Yi-Hung LIN ,  Chia-Chi HO ,  Li-Wei SUNG ,  Ming-Yen WENG ,  Hung-I TSENG ,  Kuo-Chun LO ,  Charlene SU ,  Ker-Yih KAO

IPC: H01Q1/40 ,  H01Q1/38 ,  H01Q3/44

CPC classification number: H01Q1/40 ,  G02F1/1313 ,  H01Q1/2266 ,  H01Q1/2275 ,  H01Q1/2283 ,  H01Q1/24 ,  H01Q1/241 ,  H01Q1/38 ,  H01Q1/50 ,  H01Q3/44 ,  H01Q9/0407 ,  H01Q9/0457 ,  H01Q13/10

Abstract: A microwave modulation device includes a first radiator, a second radiator and a modulation structure. The first radiator includes a substrate; a metal layer disposed on the substrate; a protective layer disposed on at least a portion of the metal layer and including a through hole overlapping with at least a portion of the metal layer; and an etch stop layer disposed between the metal layer and the protective layer. The second radiator disposed corresponding to the first radiator. The modulation structure is disposed between the first radiator and the second radiator.