公开(公告)号：US20240162602A1

公开(公告)日：2024-05-16

申请号：US18401885

申请日：2024-01-02

申请人： InnoLux Corporation

发明人： Chia-Ping TSENG ,  Ker-Yih KAO ,  Chia-Chi HO ,  Ming-Yen WENG ,  Hung-I TSENG ,  Shu-Ling WU ,  Huei-Ying CHEN

IPC分类号： H01Q1/38 ,  G02F1/1343 ,  H01L21/04 ,  H01L27/12 ,  H01Q3/34 ,  H01Q3/44 ,  H01Q9/04

CPC分类号： H01Q1/38 ,  G02F1/13439 ,  H01L21/045 ,  H01L27/1237 ,  H01Q3/34 ,  H01Q3/44 ,  H01Q9/0407 ,  G02F1/133345

摘要： An electronic device is provided. The electronic device includes a first substrate, an insulating layer, a first conductive layer and a second conductive layer. The insulating layer is overlapped with the first substrate. The second conductive layer contacts with the first conductive layer. The first conductive layer and the second conductive layer are disposed between the first substrate and the insulating layer. The second conductive layer is disposed between the first conductive layer and the insulating layer. Moreover, a thermal expansion coefficient of the second conductive layer is between a thermal expansion coefficient of the first conductive layer and a thermal expansion coefficient of the insulating layer.

公开(公告)号：US20230282969A1

公开(公告)日：2023-09-07

申请号：US18315662

申请日：2023-05-11

申请人： InnoLux Corporation

发明人： Yi-Hung LIN ,  Tang-Chin HUNG ,  Chia-Chi HO ,  I-Yin LI

IPC分类号： H01Q1/36 ,  H01Q9/04

CPC分类号： H01Q1/36 ,  H01Q9/0407 ,  G09G2300/0876 ,  H01Q3/44

摘要： An electronic device is provided. The electronic device includes a substrate, a conductive layer, an insulating layer, and a modulating material. The conductive layer is disposed on the substrate and has a first opening penetrating through the conductive layer. The insulating layer is disposed on the conductive layer and includes a second opening penetrating through the insulating layer. The first opening of the conductive layer and the second opening of the insulating layer are at least partially overlapped. The modulating material is disposed on the insulating layer.

公开(公告)号：US20180026374A1

公开(公告)日：2018-01-25

申请号：US15657345

申请日：2017-07-24

申请人： InnoLux Corporation

发明人： Huei-Ying CHEN ,  I-Yin LI ,  Chia-Chi HO ,  Hsu-Kuan HSU ,  Ker-Yih KAO ,  Chung-Kuang WEI ,  Chin-Lung TING ,  Cheng-Chi WANG ,  Chien-Hsing LEE

IPC分类号： H01Q9/06 ,  H01Q9/04 ,  H01Q1/38

摘要： An antenna device includes a first dielectric substrate, a first radiator disposed on the first dielectric substrate, a second dielectric substrate disposed on the first radiator, a second radiator disposed between the first dielectric substrate and the second dielectric substrate, a main radiator, disposed on the second dielectric substrate, and a modulation structure located between a first radiation portion of the first radiator and a second radiation portion of the second radiator. The first radiation portion, the modulation structure, and the second radiation portion are located in a central area.

公开(公告)号：US20230006342A1

公开(公告)日：2023-01-05

申请号：US17929907

申请日：2022-09-06

申请人： InnoLux Corporation

发明人： Chia-Ping TSENG ,  Ker-Yih KAO ,  Chia-Chi HO ,  Ming-Yen WENG ,  Hung-I TSENG ,  Shu-Ling WU ,  Huei-Ying CHEN

IPC分类号： H01Q1/38 ,  H01Q3/44 ,  H01Q9/04 ,  H01L27/12 ,  H01L21/04 ,  H01Q3/34 ,  G02F1/1343

摘要： An electronic device is provided. The electronic device includes a first substrate, a multilayer structure, and a passivation layer. The multilayer structure is disposed on the first substrate. The multilayer structure includes a first conductive layer and a second conductive layer disposed on the first conductive layer. The passivation layer is disposed on the second conductive layer. In addition, a thermal expansion coefficient of the second conductive layer is between a thermal expansion coefficient of the first conductive layer and a thermal expansion coefficient of the passivation layer.

公开(公告)号：US20200161249A1

公开(公告)日：2020-05-21

申请号：US16672859

申请日：2019-11-04

申请人： InnoLux Corporation

发明人： Chia-Chi HO ,  Ming-Yen WENG ,  I-Yin LI

IPC分类号： H01L23/532 ,  H01L23/14 ,  H01L29/786 ,  H01L21/48

摘要： An electronic device is provided. The electronic device includes a first substrate. The electronic device also includes a multilayer electrode disposed on the first substrate. The multilayer electrode includes a first conductive layer, a second conductive layer disposed on the first conductive layer, and a third conductive layer disposed on the second conductive layer. The electronic device further includes a second substrate facing the first substrate. In addition, the electronic device includes a working medium disposed between the first substrate and the second substrate. The chemical electromotive force of the second conductive layer is between that of the first conductive layer and the third conductive layer.

公开(公告)号：US20200091594A1

公开(公告)日：2020-03-19

申请号：US16546504

申请日：2019-08-21

申请人： InnoLux Corporation

发明人： Yi-Hung LIN ,  Tang-Chin HUNG ,  Chia-Chi HO ,  I-Yin LI

IPC分类号： H01Q1/36 ,  H01Q9/04

摘要： An antenna device is provided. The antenna device includes a first substrate, a first conductive layer, a first insulating structure, a second substrate, a second conductive layer and a liquid-crystal layer. The first conductive layer is disposed on the first substrate. The first insulating structure is disposed on the first conductive layer, and the first insulating structure includes a first region and a second region. The second substrate is disposed opposite to the first substrate. The second conductive layer is disposed on the second substrate. The liquid-crystal layer is disposed between the first conductive layer and the second conductive layer. The thickness of the first region is less than the thickness of the second region, and at least a portion of the first region is disposed in an overlapping region of the first conductive layer and the second conductive layer.

公开(公告)号：US20210399411A1

公开(公告)日：2021-12-23

申请号：US17462461

申请日：2021-08-31

申请人： InnoLux Corporation

发明人： Yi-Hung LIN ,  Tang-Chin HUNG ,  Chia-Chi HO ,  I-Yin LI

IPC分类号： H01Q1/36 ,  H01Q9/04

摘要： An antenna device is provided. The antenna device includes a first substrate, a first conductive layer, a first insulating structure, a second substrate, a second conductive layer and a liquid-crystal layer. The first conductive layer is disposed on the first substrate. The first insulating structure is disposed on the first conductive layer, and the first insulating structure includes a first region and a second region. The second substrate is disposed opposite to the first substrate. The second conductive layer is disposed on the second substrate. The liquid-crystal layer is disposed between the first conductive layer and the second conductive layer. The thickness of the first region is less than the thickness of the second region, and at least a portion of the first region is disposed in an overlapping region of the first conductive layer and the second conductive layer.

公开(公告)号：US20190013574A1

公开(公告)日：2019-01-10

申请号：US16026171

申请日：2018-07-03

申请人： InnoLux Corporation

发明人： I-Yin LI ,  Chin-Lung TING ,  Chia-Chi HO ,  Yi-Hung LIN

IPC分类号： H01Q1/40 ,  H01Q1/36

摘要： A microwave device includes a first substrate having a first surface, a first metal layer, a second substrate having a second surface corresponding to the first substrate, a second metal layer, a sealing element, a modulation material, and a fill material. The first metal layer is disposed on the first surface, and the first metal layer includes openings. The second metal layer is disposed on the second surface. The second metal layer includes electrodes corresponding to the openings. The sealing element is located between the first substrate and the second substrate. An active zone is formed by a space between the sealing element, the first substrate, and the second substrate. The modulation material is filled within the active area. The fill material is disposed in the active area. The thickness of the fill material is greater than 0.3 μm, and less than the thickness of the sealing element.

公开(公告)号：US20180205148A1

公开(公告)日：2018-07-19

申请号：US15869786

申请日：2018-01-12

申请人： InnoLux Corporation

发明人： I-Yin LI ,  Chia-Chi HO ,  Chin-Lung TING ,  Yan-Zheng WU

IPC分类号： H01Q3/44 ,  H01Q9/16 ,  H01Q7/00

CPC分类号： H01Q3/44 ,  H01Q7/00 ,  H01Q9/16 ,  H01Q9/27 ,  H04B1/034 ,  H04B7/0404 ,  H04B13/00

摘要： A microwave modulation device includes a first radiator; a second radiator disposed on the first radiator; a third radiator disposed on the second radiator; a support structure disposed between the first radiator and the second radiator; and a modulation structure disposed between the second radiator and the third radiator. A microwave-transmission layer is located among the space defined by the first radiator, the second radiator, and the support structure. The microwave-transmission layer is gas, substantially vacuum, liquid or insulating material.

公开(公告)号：US20200294891A1

公开(公告)日：2020-09-17

申请号：US16891916

申请日：2020-06-03

申请人： InnoLux Corporation

发明人： Ming-Yen WENG ,  Ker-Yih KAO ,  Chia-Chi HO ,  Tsutomu SHINOZAKI ,  Cheng-Chi WANG ,  I-Yin LI

IPC分类号： H01L23/485 ,  H01L21/311 ,  H01L23/66 ,  H01L25/065 ,  H01L21/48 ,  H01Q1/38

摘要： A high-frequency device manufacturing method is provided. The method includes providing a substrate; forming a conductive material on the substrate; standing the substrate and the conductive material for a first time duration; forming a conductive layer by sequentially repeating the steps of forming the conductive material and standing at least once; and patterning the conductive layer. The thickness of the conductive layer is in a range from 0.9 μm to 10 μm. A high-frequency device is also provided.