Method for manufacturing electronic device
    3.
    发明申请

    公开(公告)号:US20190027458A1

    公开(公告)日:2019-01-24

    申请号:US16142151

    申请日:2018-09-26

    Abstract: A method for manufacturing an electronic device is disclosed, which includes the following steps: providing a first substrate and modifying a surface of the first substrate to obtain a modified surface; applying silane or derivatives thereof on the modified surface to form an adhesion precursor layer; heat-treating the adhesion precursor layer to form an adhesion layer; forming an inorganic layer on the adhesion layer; and forming an active unit on the inorganic layer, wherein the inorganic layer is disposed between the adhesion layer and the active unit.

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