公开(公告)号：US20230305331A1

公开(公告)日：2023-09-28

申请号：US18326466

申请日：2023-05-31

申请人： Innolux Corporation

发明人： May PAN ,  Fu KUO ,  Maggy HSU

IPC分类号： G02F1/13357 ,  F21V8/00

CPC分类号： G02F1/133603 ,  G02B6/0031 ,  G02B6/0078 ,  G02F1/133605

摘要： A light-emitting device is provided, which includes a circuit board, a plurality of light-emitting elements, a first reflective element, and a second reflective element. The light-emitting elements are arranged on the circuit board. The first reflective element is disposed on the circuit board. The second reflective element is disposed on the first reflective element and comprises a plurality of apertures. The plurality of light-emitting elements are disposed in the plurality of apertures.

公开(公告)号：US20220413332A1

公开(公告)日：2022-12-29

申请号：US17894963

申请日：2022-08-24

申请人： Innolux Corporation

发明人： May PAN ,  Maggy HSU

IPC分类号： G02F1/1339 ,  G02F1/1337 ,  G02F1/1362

摘要： An electronic device is provided, which includes a first substrate, a second substrate, a data line, a first spacer, and a second spacer. The first spacer and the data line are on the first substrate, and the second spacer is on the second substrate and between the first spacer and the second substrate. Part of the first spacer does not overlap with the second spacer, and the first spacer includes a first portion, a second portion, and a third portion. The first portion overlaps with the second spacer. The first portion connects between the second portion and the third portion. The data line has a first part and a second part. The first part overlaps with the first portion. The second part does not overlap with the first portion. A maximum width of the first part is less than a maximum width of the second part.

公开(公告)号：US20230071623A1

公开(公告)日：2023-03-09

申请号：US17984061

申请日：2022-11-09

申请人： Innolux Corporation

发明人： May PAN

IPC分类号： H01L27/12 ,  H01L29/786 ,  G02F1/1368 ,  G02F1/1362

摘要： A driving substrate is provided. The driving substrate includes a substrate and a thin film transistor disposed on the substrate. The thin film transistor includes a first metal layer, a second metal layer, and a semiconductor disposed between the first metal layer and the second metal layer. The thin film transistor is divided into a first active block and a second active block, the first active block and the second active block are separated by a first gap in a first direction, and the first active block and the second active block are connected by a first bridge.

公开(公告)号：US20220404669A1

公开(公告)日：2022-12-22

申请号：US17846822

申请日：2022-06-22

申请人： Innolux Corporation

发明人： May PAN ,  Fu KUO ,  Maggy HSU

IPC分类号： G02F1/13357 ,  F21V8/00

摘要： A light-emitting device is provided, which includes a circuit board, a plurality of light-emitting elements, a first reflective element, and a second reflective element. The light-emitting elements are arranged on the circuit board. The first reflective element is disposed on the circuit board. The second reflective element is disposed on the circuit board. The first reflective element has a first reflectivity R1. The second reflective element has a second reflectivity R2. The first reflectivity R1 is different from the second reflectivity R2. The first reflectivity R1 and the second reflectivity R2 satisfy the following formula: 0

公开(公告)号：US20230420450A1

公开(公告)日：2023-12-28

申请号：US18462795

申请日：2023-09-07

申请人： Innolux Corporation

发明人： Dong-Lin LI ,  May PAN ,  Lavender CHENG

IPC分类号： H01L27/02 ,  H01L29/786 ,  H01L27/12

CPC分类号： H01L27/0296 ,  H01L29/78672 ,  H01L27/124 ,  H01L27/1222

摘要： An electronic device is provided. The electronic device includes a substrate, first, second, and third wires, first and second semiconductor elements, and a conductor. The first, second, and third wires are disposed on the substrate. The third wire is adjacent to the second wire. The second and third wires cross the first wire, and a width of the third wire is less than that of the second wire. The first semiconductor element is overlapped the first and third wires. The second semiconductor element is overlapped the first wire and adjacent to the first semiconductor element. The conductor is disposed below the second semiconductor element. The first and the second semiconductor element each crosses the first wire in two parts and the two parts of the second semiconductor element is less than the two parts of the first semiconductor element in distance.

公开(公告)号：US20240153960A1

公开(公告)日：2024-05-09

申请号：US18417329

申请日：2024-01-19

申请人： Innolux Corporation

发明人： May PAN

IPC分类号： H01L27/12 ,  G02F1/1362 ,  G02F1/1368 ,  H01L29/786

CPC分类号： H01L27/1222 ,  G02F1/136281 ,  G02F1/136286 ,  G02F1/1368 ,  G02F1/13685 ,  H01L29/78669 ,  H01L29/78696 ,  G02F2202/103 ,  G02F2202/28

摘要： A driving substrate is provided. The driving substrate includes a substrate and a thin film transistor disposed on the substrate. The thin film transistor includes a first metal layer, a second metal layer, and a semiconductor. The first metal layer has a first portion, a second portion, and a first bridge. The second metal layer has a third portion, a fourth portion, and a second bridge. The first metal layer is overlapped with the second metal layer and the semiconductor. In a top view, the first portion and the second portion are separated by a first gap and are connected by the first bridge, the third portion and the fourth portion are separated by the first gap and are connected by the second bridge.

公开(公告)号：US20230393323A1

公开(公告)日：2023-12-07

申请号：US18454483

申请日：2023-08-23

申请人： Innolux Corporation

发明人： Fu KUO ,  May PAN ,  Maggy HSU ,  Lavender CHENG

IPC分类号： F21V8/00 ,  H01L25/075 ,  H01L33/48

CPC分类号： G02B6/0031 ,  G02B6/0083 ,  G02B6/0068 ,  G02B6/0055 ,  G02B6/0091 ,  G02B6/009 ,  H01L25/0753 ,  H01L33/483 ,  H01L33/486 ,  G02F1/133314

摘要： An electronic device is provided. The electronic device includes a circuit board, a first light-emitting element and a second light-emitting element disposed on the circuit board along a first direction. The electronic device includes a light guide plate and an adhesive structure between the circuit board and the light guide plate and having a first opening and a second opening. The electronic device includes a reflective layer disposed between the adhesive structure and the circuit board. The first and second light-emitting elements are disposed in the first and second openings respectively. A portion of the adhesive structure disposed between the first and second openings includes a first part and a second part, the first part is disposed between the first and second light-emitting elements, and the second part is connected with the first part and extends toward the light guide plate.

公开(公告)号：US20230074248A1

公开(公告)日：2023-03-09

申请号：US17892944

申请日：2022-08-22

申请人： Innolux Corporation

发明人： Fu KUO ,  May PAN ,  Maggy HSU ,  Lavender CHENG

IPC分类号： F21V8/00

摘要： A electronic device is provided. The electronic device includes a circuit board, a first light-emitting element and a second light-emitting element disposed on the circuit board along a first direction. The backlight module includes a light guide plate and an adhesive structure between the circuit board and the light guide plate and having a first opening and a second opening. The first and second light-emitting elements are disposed in the first and second openings respectively. A portion of the adhesive structure disposed between the first and second openings includes a first part and a second part, the first part is disposed between the first and second light-emitting elements, and the second part is connected with the first part and extends toward the light guide plate. A second maximum width of the second part is greater than a first maximum width of the first part along the first direction.