公开(公告)号：US20240070366A1

公开(公告)日：2024-02-29

申请号：US17895107

申请日：2022-08-25

Applicant: Intel Corporation

Inventor： Nicholas HAEHN ,  Raquel DE SOUZA BORGES FERREIRA ,  Siddharth ALUR ,  Prakaram JOSHI ,  Dhanya ATHREYA ,  Yidnekachew MEKONNEN ,  Ali HARIRI ,  Andrea NICOLAS ,  Sri Chaitra Jyotsna CHAVALI ,  Kemal AYGUN

IPC: G06F30/392 ,  H01L23/498

CPC classification number: G06F30/392 ,  H01L23/49838 ,  G06F2119/22 ,  H01L23/49822

Abstract: A package substrate stack modeler includes a manufacturing modeler, configured to generate a model of a real package substrate stack based on an ideal design of the package substrate stack; a signal integrity model, configured to determine a signal integrity of a metal trace of the real package substrate stack; and a yield model, configured to determine a yield of the real package substrate stack; wherein the metal trace comprises a first value of a trace variable; further comprising a processor, configured to select a second value of the trace variable of the metal trace based on the determined signal integrity of the metal trace or the determined yield of the package substrate stack model.

公开(公告)号：US20240079259A1

公开(公告)日：2024-03-07

申请号：US17901894

申请日：2022-09-02

Applicant: Intel Corporation

Inventor： Jacob VEHONSKY ,  Onur OZKAN ,  Vinith BEJUGAM ,  Mao-Feng TSENG ,  Andrea NICOLAS ,  Nicholas HAEHN

IPC: H01L21/683 ,  B32B3/30 ,  B32B7/12 ,  B32B33/00 ,  B32B37/12 ,  H01L21/67

CPC classification number: H01L21/6835 ,  B32B3/30 ,  B32B7/12 ,  B32B33/00 ,  B32B37/12 ,  H01L21/67121 ,  B32B17/06 ,  H01L2221/68345

Abstract: The present disclosure is directed to a system that uses a dual surface substrate carrier that includes a first transparent support with a first top surface and first bottom surface, a second transparent support with a second top surface and second bottom surface, and a reflective film positioned between and attached to the first transparent support and the second transparent support. The first transparent support has a first set of trenches configured in the first top surface that form a first set of ridges between the plurality of trenches and the second transparent support has a second set of trenches configured in the second top surface that form a second set of ridges between the plurality of trenches. The first transparent support is also configured with a first build surface and the second transparent support is also configured with a second build surface that are platforms for building package substrates.