METHOD TO ACHIEVE VARIABLE DIELECTRIC THICKNESS IN PACKAGES FOR BETTER ELECTRICAL PERFORMANCE

    公开(公告)号:US20190341342A1

    公开(公告)日:2019-11-07

    申请号:US15970602

    申请日:2018-05-03

    Abstract: Embodiments include packages substrates and a method of forming the package substrate. A package substrate includes a first dielectric comprising a first conductive layer, and a second dielectric comprising a second conductive layer and a third conductive layer. The second and third conductive layers are embedded in the second dielectric, where a top surface of the third conductive layer is above a top surface of the second conductive layer. The package substrate has a fourth conductive layer on the second dielectric. The first dielectric has a first dielectric thickness between the first and third conductive layers. The first dielectric also has a second dielectric thickness between the first and second conductive layers. The package substrate includes the second dielectric thickness that is greater than the first dielectric thickness. The second dielectric may have a z-height of a first bottom surface greater than a z-height of a second bottom surface.

    HORIZONTAL PITCH TRANSLATION USING EMBEDDED BRIDGE DIES

    公开(公告)号:US20220157706A1

    公开(公告)日:2022-05-19

    申请号:US17665315

    申请日:2022-02-04

    Abstract: Methods/structures of joining package structures are described. Those methods/structures may include a die disposed on a surface of a substrate, wherein the die comprises a plurality of high density features. An interconnect bridge is embedded in the substrate, wherein the interconnect bridge may comprise a first region disposed on a surface of the interconnect bridge comprising a first plurality of features, wherein the first plurality of features comprises a first pitch. A second region disposed on the surface of the interconnect bridge comprises a second plurality of features comprising a second pitch, wherein the second pitch is greater than the first pitch.

    HORIZONTAL PITCH TRANSLATION USING EMBEDDED BRIDGE DIES

    公开(公告)号:US20200381350A1

    公开(公告)日:2020-12-03

    申请号:US16636620

    申请日:2017-09-29

    Abstract: Methods/structures of joining package structures are described. Those methods/structures may include a die disposed on a surface of a substrate, wherein the die comprises a plurality of high density features. An interconnect bridge is embedded in the substrate, wherein the interconnect bridge may comprise a first region disposed on a surface of the interconnect bridge comprising a first plurality of features, wherein the first plurality of features comprises a first pitch. A second region disposed on the surface of the interconnect bridge comprises a second plurality of features comprising a second pitch, wherein the second pitch is greater than the first pitch.

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