公开(公告)号：US09478488B2

公开(公告)日：2016-10-25

申请号：US14154291

申请日：2014-01-14

Applicant: Intel Corporation

Inventor： Damion T. Searls ,  Edward P. Osburn

IPC: H05K1/11 ,  H05K1/14 ,  H01L23/498 ,  H05K1/02 ,  H05K1/18

CPC classification number: H01L23/49844 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/13091 ,  H01L2924/1531 ,  H01L2924/19106 ,  H05K1/023 ,  H05K1/0231 ,  H05K1/0262 ,  H05K1/181 ,  H05K2201/1006 ,  H05K2201/10166 ,  H05K2201/10325 ,  H05K2201/10515 ,  H05K2201/10545 ,  H05K2201/10704 ,  Y10T29/4913 ,  Y10T29/49147 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401

Abstract: In one embodiment, the present invention includes a semiconductor device mounted to a first side of a circuit board; and at least one voltage regulator device mounted to a second side of the circuit board, the second side opposite to the first side. Examples of the voltage regulator devices include output filters, inductors, capacitors, and the like. In certain embodiments, the devices may be located directly underneath the semiconductor device.

Abstract translation: 在一个实施例中，本发明包括安装到电路板的第一侧的半导体器件; 以及安装到电路板的第二侧的至少一个电压调节器装置，第二侧与第一侧相对。 电压调节器装置的示例包括输出滤波器，电感器，电容器等。 在某些实施例中，器件可以位于半导体器件的正下方。