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公开(公告)号:US20230129176A1
公开(公告)日:2023-04-27
申请号:US18086616
申请日:2022-12-21
Applicant: Intel Corporation
Inventor: Dheeraj Subbareddy , Ankireddy Nalamalpu , Mahesh A. Iyer , Dhananjay Raghavan
IPC: G01R31/26 , G01R31/317 , G01R31/3193 , G01R31/28 , G01R31/30 , G01R31/3185
Abstract: A method includes mapping an aging measurement circuit (AMC) into the core fabric of an FPGA and operating the AMC for a select time period. During the select period of time, the AMC counts transition of a signal propagating through the AMC. Timing information based on the counted transitions is stored in a timing model in a memory. The timing information represents an aging characteristic of the core fabric at a time that the AMC is operated. An EDA toolchain uses the timing information in the timing model to generate a timing guard-band for the configurable IC die. The AMC is removed from the core fabric and another circuit device is mapped and fitted into the core fabric using the generated timing guard-band models. The circuit device is operated in the configurable IC die based on the timing guard-band models.
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公开(公告)号:US20190146028A1
公开(公告)日:2019-05-16
申请号:US16232023
申请日:2018-12-25
Applicant: Intel Corporation
Inventor: Dheeraj Subbareddy , Ankireddy Nalamalpu , Mahesh A. Iyer , Dhananjay Raghavan
IPC: G01R31/26 , G01R31/317 , G01R31/28 , G01R31/3193
Abstract: A method includes mapping an AMC into the core fabric of an FPGA and operating the AMC for a select time period. During the select period of time, the AMC counts transition of a signal propagating through the AMC. Timing information based on the counted transitions is stored in a timing model in a memory. The timing information represents an aging characteristic of the core fabric at a time that the AMC is operated. An EDA toolchain uses the timing information in the timing model to generate a timing guard-band for the configurable IC die. The AMC is removed from the core fabric and another circuit device is mapped and fitted into the core fabric using the generated timing guard-band models. The circuit device is operated in the configurable IC die based on the timing guard-band models.
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公开(公告)号:US12216150B2
公开(公告)日:2025-02-04
申请号:US18086616
申请日:2022-12-21
Applicant: Intel Corporation
Inventor: Dheeraj Subbareddy , Ankireddy Nalamalpu , Mahesh A. Iyer , Dhananjay Raghavan
IPC: G01R31/26 , G01R31/28 , G01R31/30 , G01R31/317 , G01R31/3185 , G01R31/3193
Abstract: A method includes mapping an aging measurement circuit (AMC) into the core fabric of an FPGA and operating the AMC for a select time period. During the select period of time, the AMC counts transition of a signal propagating through the AMC. Timing information based on the counted transitions is stored in a timing model in a memory. The timing information represents an aging characteristic of the core fabric at a time that the AMC is operated. An EDA toolchain uses the timing information in the timing model to generate a timing guard-band for the configurable IC die. The AMC is removed from the core fabric and another circuit device is mapped and fitted into the core fabric using the generated timing guard-band models. The circuit device is operated in the configurable IC die based on the timing guard-band models.
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公开(公告)号:US11609262B2
公开(公告)日:2023-03-21
申请号:US16232023
申请日:2018-12-25
Applicant: Intel Corporation
Inventor: Dheeraj Subbareddy , Ankireddy Nalamalpu , Mahesh A. Iyer , Dhananjay Raghavan
IPC: G01R31/26 , G01R31/317 , G01R31/3193 , G01R31/28 , G01R31/30 , G01R31/3185
Abstract: An integrated circuit die includes a core fabric configurable to include an aging measurement circuit and a device manager coupled to the core fabric to operate the aging measurement circuit for a select period of time. The aging measurement circuit includes a counter to count transitions of a signal propagating through the aging measurement circuit during the select period of time when the aging measurement circuit is operating. The transitions of the signal counted by the counter during the select period of time are a measure of an aging characteristic of the integrated circuit die.
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