公开(公告)号：US20180212645A1

公开(公告)日：2018-07-26

申请号：US15745908

申请日：2015-09-25

Applicant: Intel Corporation

Inventor： Telesphor KAMGAING ,  Adel A. ELSHERBINI ,  Emanuel COHEN

IPC: H04B1/48 ,  H01L23/66 ,  H01L25/065 ,  H01Q1/22

CPC classification number: H04W76/10 ,  H01L23/66 ,  H01L24/16 ,  H01L24/17 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/16 ,  H01L2223/6616 ,  H01L2223/6677 ,  H01L2223/6683 ,  H01L2223/6688 ,  H01L2224/16221 ,  H01L2224/16235 ,  H01L2224/73253 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06548 ,  H01L2225/06572 ,  H01L2225/06589 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/1421 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/15153 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/15321 ,  H01L2924/19105 ,  H01Q1/2266 ,  H01Q1/2283 ,  H01Q3/30 ,  H04B1/38 ,  H04B1/48 ,  H04Q1/15 ,  H05K7/1487

Abstract: A microelectronic package is described with a wireless interconnect for chip-to-chip communication. In one example, the package includes an integrated circuit chip, a package substrate to carry the integrated circuit chip, the package substrate having conductive connectors to connect the integrated circuit chip to external components, a radio coupled to the integrated circuit chip to receive data from the integrated circuit chip and modulate the data onto a radio frequency carrier, and an antenna on the package substrate coupled to the radio to send the modulated data over the carrier to an external device.