公开(公告)号：US10712789B2

公开(公告)日：2020-07-14

申请号：US14975356

申请日：2015-12-18

Applicant: Intel Corporation

Inventor： Ameya Limaye

IPC: G06F1/32 ,  G06F1/20 ,  G06F1/324

Abstract: A method and apparatus for integrated circuit (IC) thermal throttling is described. In one embodiment, the apparatus comprises a plurality of thermal sensors, each of the plurality of thermal sensors being located in an area in the IC to record a die temperature at a location in its associated area; and a thermal controller coupled to the plurality of thermal sensors to perform thermal throttling of the IC to reduce the temperature of the IC in response to the die temperature recorded by any one temperature sensors of the plurality of thermal sensors being greater than an individual temperature threshold for said any one temperature sensor, the individual temperature threshold for each temperature sensor being based on a maximum temperature allowed for the area in the IC in which said each thermal sensor is located and power supplied to a plurality of areas of the IC.

公开(公告)号：US20180269128A1

公开(公告)日：2018-09-20

申请号：US15461033

申请日：2017-03-16

Applicant: Intel Corporation

Inventor： Ameya Limaye ,  Shubhada H. Sahasrabudhe ,  Nachiket R. Raravikar

IPC: H01L23/367 ,  H01L23/373 ,  H01L21/48 ,  H01L23/00

CPC classification number: H01L23/3737 ,  H01L23/42 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/271 ,  H01L2224/27334 ,  H01L2224/29083 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/2936 ,  H01L2224/29471 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/83191 ,  H01L2224/83203 ,  H01L2224/92225 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/01062

Abstract: Embodiments of the present disclosure provide techniques and configurations for a computing system with a thermal interface having magnetic particles. In some embodiments, the computing system may include a first part, a second part, and a thermal interface to couple the first and second parts. The thermal interface may comprise a thermal interface material having magnetic particles that are aligned in a defined direction relative to a surface of the first or second part, to provide desired thermal conductivity between the first and second parts. The defined direction of alignment of magnetic particles may comprise an alignment of the particles substantially perpendicularly to the surface of the first or second part. Other embodiments may be described and/or claimed.

公开(公告)号：US20210320048A1

公开(公告)日：2021-10-14

申请号：US17357792

申请日：2021-06-24

Applicant: Intel Corporation

Inventor： Ameya Limaye ,  Evan A. Chenelly

IPC: H01L23/427 ,  H01L23/473 ,  H01L25/065 ,  H01L25/10

Abstract: A cold plate with an integrated vapor chamber allows for improved temperature equalization across integrated circuit dies in an integrated circuit component. The cold plate comprises a first chamber and a vapor chamber that share a common inner wall. The cold plate is attached to an integrated circuit component positioned adjacent to the vapor chamber. Heat generated by integrated circuit dies is transferred to the vapor chamber where it is absorbed by a two-phase working fluid as latent heat. Heat is removed from the vapor chamber by a cooling liquid flowing through the cold plate absorbing heat ejected from the working fluid as it condenses. The heated cooling liquid exits the cold plate at a fluid outlet. Cold plates with integrated vapor chambers can be used to equalize temperatures across multiple integrated circuit components in a similar fashion.

公开(公告)号：US20170177044A1

公开(公告)日：2017-06-22

申请号：US14975356

申请日：2015-12-18

Applicant: Intel Corporation

Inventor： Ameya Limaye

IPC: G06F1/20

CPC classification number: G06F1/206 ,  G06F1/203 ,  G06F1/324 ,  Y02D10/126

Abstract: A method and apparatus for integrated circuit (IC) thermal throttling is described. In one embodiment, the apparatus comprises a plurality of thermal sensors, each of the plurality of thermal sensors being located in an area in the IC to record a die temperature at a location in its associated area; and a thermal controller coupled to the plurality of thermal sensors to perform thermal throttling of the IC to reduce the temperature of the IC in response to the die temperature recorded by any one temperature sensors of the plurality of thermal sensors being greater than an individual temperature threshold for said any one temperature sensor, the individual temperature threshold for each temperature sensor being based on a maximum temperature allowed for the area in the IC in which said each thermal sensor is located and power supplied to a plurality of areas of the IC.

公开(公告)号：US10181432B2

公开(公告)日：2019-01-15

申请号：US15461033

申请日：2017-03-16

Applicant: Intel Corporation

Inventor： Ameya Limaye ,  Shubhada H. Sahasrabudhe ,  Nachiket R. Raravikar

IPC: H01L23/34 ,  H01L23/367 ,  H01L23/373 ,  H01L21/48 ,  H01L23/00

Abstract: Embodiments of the present disclosure provide techniques and configurations for a computing system with a thermal interface having magnetic particles. In some embodiments, the computing system may include a first part, a second part, and a thermal interface to couple the first and second parts. The thermal interface may comprise a thermal interface material having magnetic particles that are aligned in a defined direction relative to a surface of the first or second part, to provide desired thermal conductivity between the first and second parts. The defined direction of alignment of magnetic particles may comprise an alignment of the particles substantially perpendicularly to the surface of the first or second part. Other embodiments may be described and/or claimed.

公开(公告)号：US10177066B2

公开(公告)日：2019-01-08

申请号：US15447559

申请日：2017-03-02

Applicant: INTEL CORPORATION

Inventor： Ameya Limaye ,  Shubhada Sahasrabudhe

IPC: H01L23/36 ,  H01L23/00 ,  H01L23/31 ,  H01L25/065 ,  H01L25/07 ,  H01L23/367 ,  H01L25/04 ,  H01L21/48

Abstract: A thermal management solution may be provided for a microelectronic system including a flexible integrated heat spreader, wherein the flexible integrated heat spreader may comprise a plurality of thermally conductive structures having a flexible thermally conductive film attached to and extending between each of the plurality of thermally conductive structures. The flexible integrated heat spreader may be incorporated into multi-chip package by providing a microelectronic substrate having a plurality of microelectronic devices attached thereto and by thermally contacting each of the plurality of thermally conductive structures of the flexible integrated heat spreader to its respective microelectronic device on the microelectronic substrate.

公开(公告)号：US11320877B2

公开(公告)日：2022-05-03

申请号：US16926402

申请日：2020-07-10

Applicant: Intel Corporation

Inventor： Ameya Limaye

IPC: G06F1/32 ,  G06F1/20 ,  G06F1/324

Abstract: A method and apparatus for integrated circuit (IC) thermal throttling is described. In one embodiment, the apparatus comprises a plurality of thermal sensors, each of the plurality of thermal sensors being located in an area in the IC to record a die temperature at a location in its associated area; and a thermal controller coupled to the plurality of thermal sensors to perform thermal throttling of the IC to reduce the temperature of the IC in response to the die temperature recorded by any one temperature sensors of the plurality of thermal sensors being greater than an individual temperature threshold for said any one temperature sensor, the individual temperature threshold for each temperature sensor being based on a maximum temperature allowed for the area in the IC in which said each thermal sensor is located and power supplied to a plurality of areas of the IC.

公开(公告)号：US20180254234A1

公开(公告)日：2018-09-06

申请号：US15447559

申请日：2017-03-02

Applicant: INTEL CORPORATION

Inventor： Ameya Limaye ,  Shubhada Sahasrabudhe

IPC: H01L23/367 ,  H01L23/00 ,  H01L25/065 ,  H01L23/31

CPC classification number: H01L23/3675 ,  H01L21/4871 ,  H01L21/4882 ,  H01L23/3121 ,  H01L23/315 ,  H01L23/3164 ,  H01L23/367 ,  H01L24/17 ,  H01L24/32 ,  H01L25/042 ,  H01L25/0652 ,  H01L25/0655 ,  H01L2224/0401 ,  H01L2224/83409 ,  H01L2224/83447

Abstract: A thermal management solution may be provided for a microelectronic system including a flexible integrated heat spreader, wherein the flexible integrated heat spreader may comprise a plurality of thermally conductive structures having a flexible thermally conductive film attached to and extending between each of the plurality of thermally conductive structures. The flexible integrated heat spreader may be incorporated into multi-chip package by providing a microelectronic substrate having a plurality of microelectronic devices attached thereto and by thermally contacting each of the plurality of thermally conductive structures of the flexible integrated heat spreader to its respective microelectronic device on the microelectronic substrate.