利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

8 条记录 (耗时 0.018 秒)

    Integrated circuit thermal throttling with workload adapted thermal sensor maximum temperature
    1.
    发明授权
    Integrated circuit thermal throttling with workload adapted thermal sensor maximum temperature 有权

    公开(公告)号：US10712789B2

    公开(公告)日：2020-07-14

    申请号：US14975356

    申请日：2015-12-18

    申请人： Intel Corporation

    发明人： Ameya Limaye

    IPC分类号： G06F1/32 ,  G06F1/20 ,  G06F1/324

    摘要： A method and apparatus for integrated circuit (IC) thermal throttling is described. In one embodiment, the apparatus comprises a plurality of thermal sensors, each of the plurality of thermal sensors being located in an area in the IC to record a die temperature at a location in its associated area; and a thermal controller coupled to the plurality of thermal sensors to perform thermal throttling of the IC to reduce the temperature of the IC in response to the die temperature recorded by any one temperature sensors of the plurality of thermal sensors being greater than an individual temperature threshold for said any one temperature sensor, the individual temperature threshold for each temperature sensor being based on a maximum temperature allowed for the area in the IC in which said each thermal sensor is located and power supplied to a plurality of areas of the IC.

    Computing system with a thermal interface comprising magnetic particles
    2.
    发明授权
    Computing system with a thermal interface comprising magnetic particles 有权

    公开(公告)号：US10181432B2

    公开(公告)日：2019-01-15

    申请号：US15461033

    申请日：2017-03-16

    申请人： Intel Corporation

    发明人： Ameya Limaye ,  Shubhada H. Sahasrabudhe ,  Nachiket R. Raravikar

    IPC分类号： H01L23/34 ,  H01L23/367 ,  H01L23/373 ,  H01L21/48 ,  H01L23/00

    摘要： Embodiments of the present disclosure provide techniques and configurations for a computing system with a thermal interface having magnetic particles. In some embodiments, the computing system may include a first part, a second part, and a thermal interface to couple the first and second parts. The thermal interface may comprise a thermal interface material having magnetic particles that are aligned in a defined direction relative to a surface of the first or second part, to provide desired thermal conductivity between the first and second parts. The defined direction of alignment of magnetic particles may comprise an alignment of the particles substantially perpendicularly to the surface of the first or second part. Other embodiments may be described and/or claimed.

    Flexible integrated heat spreader
    3.
    发明授权
    Flexible integrated heat spreader 有权

    公开(公告)号：US10177066B2

    公开(公告)日：2019-01-08

    申请号：US15447559

    申请日：2017-03-02

    申请人： INTEL CORPORATION

    发明人： Ameya Limaye ,  Shubhada Sahasrabudhe

    IPC分类号： H01L23/36 ,  H01L23/00 ,  H01L23/31 ,  H01L25/065 ,  H01L25/07 ,  H01L23/367 ,  H01L25/04 ,  H01L21/48

    摘要： A thermal management solution may be provided for a microelectronic system including a flexible integrated heat spreader, wherein the flexible integrated heat spreader may comprise a plurality of thermally conductive structures having a flexible thermally conductive film attached to and extending between each of the plurality of thermally conductive structures. The flexible integrated heat spreader may be incorporated into multi-chip package by providing a microelectronic substrate having a plurality of microelectronic devices attached thereto and by thermally contacting each of the plurality of thermally conductive structures of the flexible integrated heat spreader to its respective microelectronic device on the microelectronic substrate.

    COLD PLATE WITH INTEGRATED VAPOR CHAMBER
    5.
    发明申请
    COLD PLATE WITH INTEGRATED VAPOR CHAMBER 有权

    公开(公告)号：US20210320048A1

    公开(公告)日：2021-10-14

    申请号：US17357792

    申请日：2021-06-24

    申请人： Intel Corporation

    发明人： Ameya Limaye ,  Evan A. Chenelly

    IPC分类号： H01L23/427 ,  H01L23/473 ,  H01L25/065 ,  H01L25/10

    摘要： A cold plate with an integrated vapor chamber allows for improved temperature equalization across integrated circuit dies in an integrated circuit component. The cold plate comprises a first chamber and a vapor chamber that share a common inner wall. The cold plate is attached to an integrated circuit component positioned adjacent to the vapor chamber. Heat generated by integrated circuit dies is transferred to the vapor chamber where it is absorbed by a two-phase working fluid as latent heat. Heat is removed from the vapor chamber by a cooling liquid flowing through the cold plate absorbing heat ejected from the working fluid as it condenses. The heated cooling liquid exits the cold plate at a fluid outlet. Cold plates with integrated vapor chambers can be used to equalize temperatures across multiple integrated circuit components in a similar fashion.

    INTEGRATED CIRCUIT THERMAL THROTTLING WITH WORKLOAD ADAPTED THERMAL SENSOR MAXIMUM TEMPERATURE
    6.
    发明申请
    INTEGRATED CIRCUIT THERMAL THROTTLING WITH WORKLOAD ADAPTED THERMAL SENSOR MAXIMUM TEMPERATURE 审中-公开

    公开(公告)号：US20170177044A1

    公开(公告)日：2017-06-22

    申请号：US14975356

    申请日：2015-12-18

    申请人： Intel Corporation

    发明人： Ameya Limaye

    IPC分类号： G06F1/20

    CPC分类号： G06F1/206 ,  G06F1/203 ,  G06F1/324 ,  Y02D10/126

    摘要： A method and apparatus for integrated circuit (IC) thermal throttling is described. In one embodiment, the apparatus comprises a plurality of thermal sensors, each of the plurality of thermal sensors being located in an area in the IC to record a die temperature at a location in its associated area; and a thermal controller coupled to the plurality of thermal sensors to perform thermal throttling of the IC to reduce the temperature of the IC in response to the die temperature recorded by any one temperature sensors of the plurality of thermal sensors being greater than an individual temperature threshold for said any one temperature sensor, the individual temperature threshold for each temperature sensor being based on a maximum temperature allowed for the area in the IC in which said each thermal sensor is located and power supplied to a plurality of areas of the IC.

    Integrated circuit thermal throttling with workload adapted thermal sensor maximum temperature
    7.
    发明授权
    Integrated circuit thermal throttling with workload adapted thermal sensor maximum temperature 有权

    公开(公告)号：US11320877B2

    公开(公告)日：2022-05-03

    申请号：US16926402

    申请日：2020-07-10

    申请人： Intel Corporation

    发明人： Ameya Limaye

    IPC分类号： G06F1/32 ,  G06F1/20 ,  G06F1/324

    摘要： A method and apparatus for integrated circuit (IC) thermal throttling is described. In one embodiment, the apparatus comprises a plurality of thermal sensors, each of the plurality of thermal sensors being located in an area in the IC to record a die temperature at a location in its associated area; and a thermal controller coupled to the plurality of thermal sensors to perform thermal throttling of the IC to reduce the temperature of the IC in response to the die temperature recorded by any one temperature sensors of the plurality of thermal sensors being greater than an individual temperature threshold for said any one temperature sensor, the individual temperature threshold for each temperature sensor being based on a maximum temperature allowed for the area in the IC in which said each thermal sensor is located and power supplied to a plurality of areas of the IC.