公开(公告)号：US20030102555A1

公开(公告)日：2003-06-05

申请号：US10006292

申请日：2001-12-03

Applicant: Intel Corporation

Inventor： P. R. Patel ,  Chee-Yee Chung ,  Daivd G. Figueroa ,  Robert L. Sankman ,  Yuan-Liang Li ,  Hong Xie ,  William P. Pinello

IPC: H01L021/44 ,  H01L021/48 ,  H01L021/50 ,  H01L021/8234 ,  H01L023/34 ,  H01L023/24 ,  H01L023/22

CPC classification number: H01L24/81 ,  H01L23/50 ,  H01L2224/16225 ,  H01L2224/16265 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19103 ,  H01L2924/19104 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/00

Abstract: To provide high-speed, low inductance capacitive decoupling, an integrated circuit (IC) package includes capacitors positioned within the mounting region between a die and an IC package substrate. A variety of types and sizes of capacitors and substrates can be employed in a variety of geometrical arrangements. In some embodiments, capacitors are sandwiched between die terminals or bumps and the substrate conductors or pads, while in other embodiments, capacitors are positioned between bar-type conductors on the surface of the IC package substrate. Methods of fabrication, as well as application of the package to an electronic assembly and to an electronic system, are also described.

Abstract translation: 为了提供高速，低电感电容去耦，集成电路（IC）封装包括位于管芯和IC封装衬底之间的安装区域内的电容器。 各种类型和尺寸的电容器和基板可以用于各种几何布置。 在一些实施例中，电容器夹在裸片端子或凸起之间以及衬底导体或衬垫之间，而在其它实施例中，电容器位于IC封装衬底的表面上的棒状导体之间。 还描述了制造方法以及将包装应用于电子组件和电子系统。

公开(公告)号：US20040135240A1

公开(公告)日：2004-07-15

申请号：US10744316

申请日：2003-12-22

Applicant: INTEL CORPORATION

Inventor： Hong Xie ,  Debendra Mallik

IPC: H01L023/02

CPC classification number: H01L23/16 ,  H01L2224/16225 ,  H01L2924/19105 ,  H05K1/0231 ,  H05K1/0271 ,  H05K3/284 ,  H05K2201/2009

Abstract: A molded stiffener for a package substrate is presented. The stiffener includes a molded portion. The molded portion is molded of an electrically nonconductive molding compound. A plurality of capacitors are embedded in the molded portion. The capacitors are constructed and arranged to be electrically connected to the package substrate. As such, power delivery performance is improved, and mechanical strength is added to the substrate.