公开(公告)号：US20240021522A1

公开(公告)日：2024-01-18

申请号：US18253945

申请日：2020-12-23

Applicant: Intel Corporation

Inventor： Tolga ACIKALIN ,  Tae Young YANG ,  Debabani CHOUDHURY ,  Shuhei YAMADA ,  Roya DOOSTNEJAD ,  Hosein NIKOPOUR ,  Issy KIPNIS ,  Oner ORHAN ,  Mehnaz RAHMAN ,  Kenneth P. FOUST ,  Christopher D. HULL ,  Telesphor KAMGAING ,  Omkar KARHADE ,  Stefano PELLERANO ,  Peter SAGAZIO ,  Sai VADLAMANI

IPC: H01L23/538 ,  H01L25/065 ,  H01L23/00 ,  H01L23/66 ,  H01L23/498 ,  H01Q1/22

CPC classification number: H01L23/5381 ,  H01L25/0652 ,  H01L24/16 ,  H01L23/66 ,  H01L23/49822 ,  H01Q1/2283 ,  H01L24/81 ,  H01L2924/14222 ,  H01L2924/1431 ,  H01L2223/6677 ,  H01L2223/6616 ,  H01L2223/6655 ,  H01L2224/16235 ,  H01L2224/16146

Abstract: Various devices, systems, and/or methods perform wireless chip to chip high speed data transmission. Strategies for such transmission include use of improved microbump antennas, wireless chip to chip interconnects, precoding and decoding strategies, channel design to achieve spatial multiplexing gain in line of sight transmissions, open cavity chip design for improved transmission, and/or mixed signal channel equalization.