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公开(公告)号：US20220352622A1
公开(公告)日：2022-11-03
申请号：US17762749
申请日：2019-12-27
Applicant: Intel Corporation
Inventor： Debabani CHOUDHURY , Jose Rodrigo CAMACHO PEREZ , Shuhei YAMADA , Vida Ilderem BURGER , Bryce D. HORINE , Harry SKINNER
Abstract: Various antennas elements including antennas arrays can support various communication technologies and can be integrated into different components or subcomponents of a vehicle, including various vehicle light assemblies. The vehicular antennas elements include low profile and/or concealed antenna elements that are inconspicuous aesthetically and do not affect or substantially affect vehicle aerodynamics.
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公开(公告)号：US20240021522A1
公开(公告)日：2024-01-18
申请号：US18253945
申请日：2020-12-23
Applicant: Intel Corporation
Inventor： Tolga ACIKALIN , Tae Young YANG , Debabani CHOUDHURY , Shuhei YAMADA , Roya DOOSTNEJAD , Hosein NIKOPOUR , Issy KIPNIS , Oner ORHAN , Mehnaz RAHMAN , Kenneth P. FOUST , Christopher D. HULL , Telesphor KAMGAING , Omkar KARHADE , Stefano PELLERANO , Peter SAGAZIO , Sai VADLAMANI
IPC: H01L23/538 , H01L25/065 , H01L23/00 , H01L23/66 , H01L23/498 , H01Q1/22
CPC classification number: H01L23/5381 , H01L25/0652 , H01L24/16 , H01L23/66 , H01L23/49822 , H01Q1/2283 , H01L24/81 , H01L2924/14222 , H01L2924/1431 , H01L2223/6677 , H01L2223/6616 , H01L2223/6655 , H01L2224/16235 , H01L2224/16146
Abstract: Various devices, systems, and/or methods perform wireless chip to chip high speed data transmission. Strategies for such transmission include use of improved microbump antennas, wireless chip to chip interconnects, precoding and decoding strategies, channel design to achieve spatial multiplexing gain in line of sight transmissions, open cavity chip design for improved transmission, and/or mixed signal channel equalization.
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公开(公告)号：US20220353650A1
公开(公告)日：2022-11-03
申请号：US17535697
申请日：2021-11-26
Applicant: Intel Corporation
Inventor： Carlos ALDANA , Biljana BADIC , Dave CAVALCANTI , Debabani CHOUDHURY , Christian DREWES , Jong-Kae FWU , Bertram GUNZELMANN , Nageen HIMAYAT , Ingolf KARLS , Duncan KITCHIN , Markus Dominik MUECK , Bernhard RAAF , Domagoj SIPRAK , Harry SKINNER , Christopher STOBART , Shilpa TALWAR , Zhibin YU
IPC: H04W4/40 , H04W4/80 , H04W8/00 , H04W28/22 , H04W36/00 , H04W36/08 , H04W48/16 , H04W72/04 , H04W12/069
Abstract: Disclosed herein is a communication device for vehicular radio communications. The communication device includes one or more processors configured to identify a plurality of vehicular communication devices that form a cluster of cooperating vehicular communication devices. The one or more processors also determine channel resource allocations for the plurality of vehicular communication devices that includes channel resources allocated for a first vehicular radio communication technology and channel resources allocated for a second vehicular radio communication technology. The one or more processors also transmit the channel resource allocation to the plurality of vehicular communication devices.
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公开(公告)号：US20220337282A1
公开(公告)日：2022-10-20
申请号：US17763208
申请日：2019-12-24
Applicant: Intel Corporation
Inventor： Jose Rodrigo CAMACHO PEREZ , Debabani CHOUDHURY , Timo Sakari HUUSARI , Seong-Youp John SUH , Shuhei YAMADA
Abstract: A radio frequency front end and an antenna front end may be separated from one another to maintain close proximity between a low noise amplifier and an antenna while achieving improved thermal regulation of a power amplifier. The radio frequency front end antenna front end may include a duplexing system that enables operation with a single electrical cable. Furthermore, where it is desired to transmit a radiofrequency signal via a waveguide, a flexible waveguide may be constructed with a distributed capacitance between waveguide protrusions.
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