公开(公告)号：US20230197537A1

公开(公告)日：2023-06-22

申请号：US17644801

申请日：2021-12-17

Applicant: Intel Corporation

Inventor： Richard GEIGER ,  Klaus HEROLD ,  Harald GOSSNER ,  Martin OSTERMAYR ,  Georgios PANAGOPOULOS ,  Johannes RAUH ,  Joachim SINGER ,  Thomas WAGNER

IPC: H01L21/66 ,  H01L23/48

CPC classification number: H01L22/32 ,  H01L23/481

Abstract: A semiconductor structure is provided. The semiconductor structure includes a plurality of transistors arranged at a front side of a semiconductor substrate and a test structure located at the front side of the semiconductor substrate. Further, the semiconductor structure comprises a first electrically conductive connection extending from the test structure through the semiconductor substrate to a backside test pad arranged at a backside of the semiconductor substrate.