公开(公告)号：US11385689B2

公开(公告)日：2022-07-12

申请号：US16343741

申请日：2016-10-26

Applicant: INTEL CORPORATION

Inventor： Jawad B. Khan ,  Andrew Warrack Morning-Smith ,  John Hung ,  Michael D. Nelson ,  Craig J. Jahne

IPC: G06F1/18 ,  F21V8/00 ,  G06F1/20 ,  H05K1/02 ,  H05K1/18 ,  H05K7/14 ,  H05K7/20

Abstract: An integrated electronic card front EMI cage and latch is described that is suitable for use in a data storage system. In an example a latch module for an electronic component housing has a latch housing having an arm with an attachment point to fasten the latch housing to an end of the housing and an EMI cage having a front body and a plurality of fingers extending from the front body, the front body being held to the end of the housing by the latch housing and the fingers being configured to be outside an exterior of the housing on at least two sides of the housing to block electromagnetic interference from passing along the at least two sides of the housing.

公开(公告)号：US20190304870A1

公开(公告)日：2019-10-03

申请号：US15942270

申请日：2018-03-30

Applicant: Intel Corporation

Inventor： Thomas Boyd ,  Ming-Chen Chang ,  Evan A. Chenelly ,  Divya Swamy Bandaru ,  Craig J. Jahne ,  Andrew Larson ,  Eric W. Buddrius ,  Eric D. McAfee ,  Mustafa Haswarey ,  Ralph V. Miele ,  Rolf Laido

IPC: H01L23/40 ,  H05K7/14 ,  H01L23/367

Abstract: A microprocessor heat sink fastener assembly, comprising a base to couple to a heat sink a retention nut to be received by a cavity of the base, and a retention clip to be attached to the base and to be cantilevered therefrom. The retention clip is to engage with a latching structure extending from a latching structure of a retention plate.

公开(公告)号：US20190304869A1

公开(公告)日：2019-10-03

申请号：US15942278

申请日：2018-03-30

Applicant: Intel Corporation

Inventor： Andrew Larson ,  Bijoyraj Sahu ,  Craig J. Jahne ,  Eric W. Buddrius ,  Ralph V. Miele

IPC: H01L23/40 ,  F16B33/00 ,  F16B37/14

Abstract: A microprocessor heat sink fastener, comprising a nut comprising a thermoplastic material and fibrous fill particles and a bore extending along an axis of the nut. The bore has internal threads. The internal threads comprise a surface. At least one of the fibrous fill particles has first and second ends extending from the surface into a sub-surface region.

公开(公告)号：US11557529B2

公开(公告)日：2023-01-17

申请号：US15942270

申请日：2018-03-30

Applicant: Intel Corporation

Inventor： Thomas Boyd ,  Ming-Chen Chang ,  Evan A. Chenelly ,  Divya Swamy Bandaru ,  Craig J. Jahne ,  Andrew Larson ,  Eric W. Buddrius ,  Eric D. McAfee ,  Mustafa Haswarey ,  Ralph V. Miele ,  Rolf Laido

IPC: H05K7/14 ,  H01L23/40 ,  H01L23/367

Abstract: A microprocessor heat sink fastener assembly, comprising a base to couple to a heat sink a retention nut to be received by a cavity of the base, and a retention clip to be attached to the base and to be cantilevered therefrom. The retention clip is to engage with a latching structure extending from a latching structure of a retention plate.

公开(公告)号：US11387163B2

公开(公告)日：2022-07-12

申请号：US15942278

申请日：2018-03-30

Applicant: Intel Corporation

Inventor： Andrew Larson ,  Bijoyraj Sahu ,  Craig J. Jahne ,  Eric W. Buddrius ,  Ralph V. Miele

IPC: F16B33/00 ,  F16B37/00 ,  H01L23/40 ,  F16B37/14

Abstract: A microprocessor heat sink fastener, comprising a nut comprising a thermoplastic material and fibrous fill particles and a bore extending along an axis of the nut. The bore has internal threads. The internal threads comprise a surface. At least one of the fibrous fill particles has first and second ends extending from the surface into a sub-surface region.