公开(公告)号：US20220196507A1

公开(公告)日：2022-06-23

申请号：US17133554

申请日：2020-12-23

申请人： Intel Corporation

发明人： Prabhakar SUBRAHMANYAM ,  Yi XIA ,  Ying-Feng PANG ,  Victor POLYANKO ,  Mark BIANCO ,  Bijoyraj SAHU ,  Minh T.D. LE ,  Carlos ALVIZO FLORES ,  Javier AVALOS GARCIA ,  Adriana LOPEZ INIGUEZ ,  Luz Karine SANDOVAL GRANADOS ,  Michael BERKTOLD ,  Damion SEARLS ,  Jin YANG ,  David SHIA ,  Samer MELHEM ,  Jeffrey Ryan CONNER ,  Hemant DESAI ,  John RAATZ ,  Richard DISCHLER ,  Bergen ANDERSON ,  Eric W. BUDDRIUS ,  Kenan ARIK ,  Barrett M. FANEUF ,  Lianchang DU ,  Yuehong FAN ,  Shengzhen ZHANG ,  Yuyang XIA ,  Jun ZHANG ,  Yuan Li ,  Catharina BIBER ,  Kristin L. WELDON ,  Brendan T. PAVELEK

IPC分类号： G01M3/04 ,  G01M3/16 ,  G01M3/20 ,  H05K7/20

摘要： An apparatus is described. The apparatus includes a cover to enclose a junction between respective ends of first and second fluidic conduits. The first and second fluidic conduits transport a coolant fluid within an electronic system. The apparatus also includes a leak detection device to be located within a region that is enclosed by the cover when the junction is enclosed by the cover. The leak detection device is to detect a leak of the coolant fluid at the junction when the junction is enclosed by the cover. The first and second fluidic conduits extend outside the cover when the junction is enclosed by the cover. Another apparatus is also described. The other apparatus includes a leak detection device to detect a leak of coolant fluid from a specific component or junction in a liquid cooling system of an electronic system.