公开(公告)号：US20190393118A1

公开(公告)日：2019-12-26

申请号：US16016399

申请日：2018-06-22

Applicant: Intel Corporation

Inventor： Brandon M. RAWLINGS ,  Feras EID ,  Kelly LOFGREEN

IPC: H01L23/367 ,  H01L23/42 ,  H01L23/00 ,  H01L21/52 ,  H01L25/065

Abstract: A package is disclosed. The package includes a substrate, a die on the substrate, an integrated heat spreader on the substrate that encloses the die, the integrated heat spreader including a hole that extends through the integrated heat spreader, an air permeable adhesive contacting the integrated heat spreader and forming a cavity underneath the integrated heat spreader, and a liquid metal thermal interface material filling the cavity. A sealant plugs the hole that extends through the integrated heat spreader.

公开(公告)号：US20200098661A1

公开(公告)日：2020-03-26

申请号：US16139401

申请日：2018-09-24

Applicant: Intel Corporation

Inventor： Kelly LOFGREEN ,  Chia-Pin CHIU ,  Joseph PETRINI ,  Edvin CETEGEN ,  Betsegaw GEBREHIWOT ,  Feras EID

IPC: H01L23/373 ,  H01L23/00 ,  H01L23/367

Abstract: Embodiments include an electronic system and methods of forming an electronic system. In an embodiment, the electronic system may include a package substrate and a die coupled to the package substrate. In an embodiment, the electronic system may also include an integrated heat spreader (IHS) that is coupled to the package substrate. In an embodiment the electronic system may further comprise a thermal interface pad between the IHS and the die. In an embodiment the die is thermally coupled to the IHS by a liquid metal thermal interface material (TIM) that contacts the thermal interface pad.

公开(公告)号：US20240175917A1

公开(公告)日：2024-05-30

申请号：US18071399

申请日：2022-11-29

Applicant: Intel Corporation

Inventor： Ruben NUNEZ BLANCO ,  Christopher ACKERMAN ,  Paul DIGLIO ,  Varun NARAYAN ,  Craig YOST ,  Jensen STENBERG ,  Kelly LOFGREEN ,  Joseph PETRINI ,  Sami ALELYANI

IPC: G01R31/28 ,  H01L23/467

CPC classification number: G01R31/2877 ,  G01R31/2863 ,  H01L23/467

Abstract: This disclosure describes systems, methods, and devices related to preventing water leakage from jet impingement applied to an integrated circuit under test. An integrated circuit testing apparatus for applying jet impingement to an integrated circuit may include an impingement chamber in contact with an integrated circuit being tested, the impingement chamber comprising water associated with cooling the integrated circuit; and an actuator-driven thermal management block including an air inlet configured to direct a flow of air into an immediate test environment for the integrated circuit to generate a positive pressure differential with respect to the water in the impingement chamber to prevent leakage of the water from the impingement chamber.

公开(公告)号：US20200098664A1

公开(公告)日：2020-03-26

申请号：US16142366

申请日：2018-09-26

Applicant: Intel Corporation

Inventor： Krishna Vasanth VALAVALA ,  Kelly LOFGREEN ,  Chandra-Mohan JHA

IPC: H01L23/38 ,  H01L25/065 ,  H01L23/367 ,  H01L21/48

Abstract: Embodiments herein relate to systems, apparatuses, processing, and techniques related to a first heat-conducting plate to be thermally coupled to a first heat source, a thermoelectric cooler (TEC) thermally coupled to the first plate, a second heat-conducting plate thermally coupled to the TEC and to be thermally coupled to a second heat source where the TEC is to at least partially thermally isolate the first plate from the second plate to reduce heat transfer from the first plate to the second plate.