公开(公告)号：US20210125897A1

公开(公告)日：2021-04-29

申请号：US16665621

申请日：2019-10-28

Applicant: Intel Corporation

Inventor： Krishna Vasanth VALAVALA ,  Ravindranath V. MAHAJAN ,  Chandra Mohan JHA

IPC: H01L23/38 ,  H01L23/42 ,  H01L23/367 ,  H01L23/10 ,  H01L23/00 ,  H01L21/48 ,  H01L25/065

Abstract: Embodiments include a semiconductor package with a thermoelectric cooler (TEC), a method to form such semiconductor package, and a semiconductor packaged system. The semiconductor package includes a die with a plurality of backend layers on a package substrate. The backend layers couple the die to the package substrate. The semiconductor package includes the TEC in the backend layers of the die. The TEC includes a plurality of N-type layers, a plurality of P-type layers, and first and second conductive layers. The first conductive layer is directly coupled to outer regions of bottom surfaces of the N-type and P-type layers, and the second conductive layer is directly coupled to inner regions of top surfaces of the N-type and P-type layers. The first conductive layer has a width greater than a width of the second conductive layer. The N-type and P-type layers are directly disposed between the first and second conductive layers.

公开(公告)号：US20230100576A1

公开(公告)日：2023-03-30

申请号：US17478450

申请日：2021-09-17

Applicant: Intel Corporation

Inventor： Andrew COLLINS ,  Srinivas V. PIETAMBARAM ,  Jianyong XIE ,  Krishna Vasanth VALAVALA

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K3/42

Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques directed to bridges having a glass core, where the bridges may include one or more thick traces and one or more thin traces, where the thin traces are layered closer to a surface of the glass core, and the thick traces are layered further away from the glass core. During operation, the thin traces may be used to transmit signals between the coupled dies, and the thick traces may be used to transmit power between the coupled dies. During manufacture, the rigidity and highly planner surface of the glass core may enable thinner traces closer to the surface of the glass core to be placed with greater precision resulting in increased overall quality and robustness of transmitted signals. Other embodiments may be described and/or claimed.

公开(公告)号：US20200098664A1

公开(公告)日：2020-03-26

申请号：US16142366

申请日：2018-09-26

Applicant: Intel Corporation

Inventor： Krishna Vasanth VALAVALA ,  Kelly LOFGREEN ,  Chandra-Mohan JHA

IPC: H01L23/38 ,  H01L25/065 ,  H01L23/367 ,  H01L21/48

Abstract: Embodiments herein relate to systems, apparatuses, processing, and techniques related to a first heat-conducting plate to be thermally coupled to a first heat source, a thermoelectric cooler (TEC) thermally coupled to the first plate, a second heat-conducting plate thermally coupled to the TEC and to be thermally coupled to a second heat source where the TEC is to at least partially thermally isolate the first plate from the second plate to reduce heat transfer from the first plate to the second plate.