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1.
公开(公告)号:US10579125B2
公开(公告)日:2020-03-03
申请号:US15055578
申请日:2016-02-27
Applicant: Intel Corporation
Inventor: Daniel J. Ragland , Pavithra Sampath , Kirk Pfaender , Kahraman D. Akdemir , Ariel Gur
Abstract: An integrated circuit of an aspect includes a power control unit having an interface to receive an indication that one or more instructions of a first type are to be performed by a core. The power control unit also has logic to control a maximum clock frequency for the core based on the indication that the instructions of the first type are to be performed by the core.
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2.
公开(公告)号:US11216409B2
公开(公告)日:2022-01-04
申请号:US17025992
申请日:2020-09-18
Applicant: Intel Corporation
Inventor: Daniel J. Ragland , Guy M. Therien , Kirk Pfaender
IPC: G06F15/78 , G06F1/18 , G06F1/3206 , G06F1/3234 , G06F1/3296 , G06F1/26 , G06F9/4401
Abstract: Apparatuses, methods and storage medium for providing access from outside a multicore processor System on Chip (SoC) are disclosed herein. In embodiments, an SoC may include a memory to store a plurality of embedded values correspondingly associated with a plurality of architecturally identical cores. Each embedded value may indicate a default voltage for a respective one of the plurality of architecturally identical cores. In embodiments, an apparatus may include one or more processors, devices, and/or circuitry to provide access from outside the multicore processor SoC to individually configure voltages of the plurality of architecturally identical cores to values that are different than the values of the default voltages. Other embodiments may be described and/or claimed.
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3.
公开(公告)号:US10013392B2
公开(公告)日:2018-07-03
申请号:US15007021
申请日:2016-01-26
Applicant: Intel Corporation
Inventor: Daniel J. Ragland , Guy M. Therien , Kirk Pfaender
IPC: G06F15/78 , G06F1/18 , G06F1/32 , G06F1/26 , G06F9/4401
CPC classification number: G06F15/7807 , G06F1/189 , G06F1/26 , G06F1/266 , G06F1/3206 , G06F1/3243 , G06F1/3296 , G06F9/4403 , G06F9/4405 , Y02D10/152 , Y02D10/172
Abstract: Apparatuses, methods and storage medium for providing access from outside a multicore processor System on Chip (SoC) are disclosed herein. In embodiments, an SoC may include a memory to store a plurality of embedded values correspondingly associated with a plurality of architecturally identical cores. Each embedded value may indicate a default voltage for a respective one of the plurality of architecturally identical cores. In embodiments, an apparatus may include one or more processors, devices, and/or circuitry to provide access from outside the multicore processor SoC to individually configure voltages of the plurality of architecturally identical cores to values that are different than the values of the default voltages. Other embodiments may be described and/or claimed.
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4.
公开(公告)号:US11892969B2
公开(公告)日:2024-02-06
申请号:US17556755
申请日:2021-12-20
Applicant: Intel Corporation
Inventor: Daniel J. Ragland , Guy M. Therien , Kirk Pfaender
IPC: G06F15/78 , G06F1/18 , G06F1/3206 , G06F1/3234 , G06F1/3296 , G06F1/26 , G06F9/4401
CPC classification number: G06F15/7807 , G06F1/189 , G06F1/3206 , G06F1/3243 , G06F1/3296 , G06F1/26 , G06F1/266 , G06F9/4403 , G06F9/4405 , Y02D10/00
Abstract: Apparatuses, methods and storage medium for providing access from outside a multicore processor System on Chip (SoC) are disclosed herein. In embodiments, an SoC may include a memory to store a plurality of embedded values correspondingly associated with a plurality of architecturally identical cores. Each embedded value may indicate a default voltage for a respective one of the plurality of architecturally identical cores. In embodiments, an apparatus may include one or more processors, devices, and/or circuitry to provide access from outside the multicore processor SoC to individually configure voltages of the plurality of architecturally identical cores to values that are different than the values of the default voltages. Other embodiments may be described and/or claimed.
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5.
公开(公告)号:US10783110B2
公开(公告)日:2020-09-22
申请号:US16026691
申请日:2018-07-03
Applicant: Intel Corporation
Inventor: Daniel J. Ragland , Guy M. Therien , Kirk Pfaender
IPC: G06F15/78 , G06F1/18 , G06F1/3206 , G06F1/3234 , G06F1/3296 , G06F1/26 , G06F9/4401
Abstract: Apparatuses, methods and storage medium for providing access from outside a multicore processor System on Chip (SoC) are disclosed herein. In embodiments, an SoC may include a memory to store a plurality of embedded values correspondingly associated with a plurality of architecturally identical cores. Each embedded value may indicate a default voltage for a respective one of the plurality of architecturally identical cores. In embodiments, an apparatus may include one or more processors, devices, and/or circuitry to provide access from outside the multicore processor SoC to individually configure voltages of the plurality of architecturally identical cores to values that are different than the values of the default voltages. Other embodiments may be described and/or claimed.
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