公开(公告)号：US20240332322A1

公开(公告)日：2024-10-03

申请号：US18129407

申请日：2023-03-31

申请人： Intel Corporation

发明人： Srinivasan Raman ,  Brandon C. Marin ,  Srinivas Venkata Ramanuja Pietambaram ,  Gang Duan ,  Suddhasattwa Nad ,  Kripa Chauhan

IPC分类号： H01L27/13 ,  H01L21/84 ,  H01L23/482 ,  H01L25/16 ,  H01L25/18 ,  H01L29/66 ,  H01L29/772

CPC分类号： H01L27/13 ,  H01L21/84 ,  H01L23/482 ,  H01L25/16 ,  H01L25/18 ,  H01L29/66409 ,  H01L29/772

摘要： An electronic device and associated methods are disclosed. In one example, the electronic device includes an electronic package substrate including a glass core layer and a regulator circuit. A first portion of the circuit components of the regulator circuit is embedded in the glass core layer and a second portion of the circuit components of the regulator circuit is formed on a surface of the glass core layer.

公开(公告)号：US20240113047A1

公开(公告)日：2024-04-04

申请号：US17957225

申请日：2022-09-30

申请人： Intel Corporation

发明人： Srinivasan Raman ,  Brandon C. Marin ,  Suddhasattwa Nad ,  Gang Duan ,  Benjamin Duong ,  Srinivas Venkata Ramanuja Pietambaram ,  Kripa Chauhan

IPC分类号： H01L23/64

CPC分类号： H01L23/647 ,  H01L21/31105

摘要： Various embodiments disclosed relate to embedded components in glass core layers for semiconductor assemblies. The present disclosure includes a semiconductor assembly with a glass core having one or more cavities and a component embedded into the glass core at the one or more cavities portion, the component at least partially embedded in the glass core, and a semiconductor die attached to the substrate.