公开(公告)号：US20230137877A1

公开(公告)日：2023-05-04

申请号：US17517152

申请日：2021-11-02

Applicant: Intel Corporation

Inventor： Bohan SHAN ,  Haobo CHEN ,  Omkar KARHADE ,  Malavarayan SANKARASUBRAMANIAN ,  Dingying XU ,  Gang DUAN ,  Bai NIE ,  Xiaoying GUO ,  Kristof DARMAWIKARTA ,  Hongxia FENG ,  Srinivas PIETAMBARAM ,  Jeremy D. ECTON

IPC: H01L23/00 ,  H01L25/065

Abstract: No-remelt solder joints can eliminate die or substrate movement in downstream reflow processes. In one example, one or more solder joints between two substrates can be formed as full IMC (intermetallic compound) solder joints. In one example, a full IMC solder joint includes a continuous layer (e.g., from the top pad to bottom pad) of intermetallic compounds. In one example, a full IMC joint can be formed by dispensing a no-remelt solder paste on some of the pads of one or both substrates to be bonded together.

公开(公告)号：US20200005983A1

公开(公告)日：2020-01-02

申请号：US16024718

申请日：2018-06-29

Applicant: Intel Corporation

Inventor： Malavarayan SANKARASUBRAMANIAN ,  Yongki MIN ,  Anne AUGUSTINE ,  Kaladhar RADHAKRISHNAN ,  Taylor GAINES ,  Ziyin LIN

IPC: H01F27/02 ,  H01F1/42 ,  H01F41/00 ,  H01F1/01 ,  H01L25/16 ,  H01L21/48 ,  H01F27/29

Abstract: Embodiments herein relate to a magnetic encapsulant composite, comprising a mixture of a first material that is a soft magnetic filler, a second material that is a polymer matrix, and a third material that is a process ingredient. The magnetic encapsulant composite may then encapsulate or partially encapsulate a magnetic inductor coupled to a substrate to increase the inductance of the magnetic inductor and/or to strengthen the substrate to which the magnetic inductor and the composite are coupled.

公开(公告)号：US20200013533A1

公开(公告)日：2020-01-09

申请号：US16026401

申请日：2018-07-03

Applicant: Intel Corporation

Inventor： Malavarayan SANKARASUBRAMANIAN ,  Anne AUGUSTINE ,  Yongki MIN ,  Kaladhar RADHAKRISHNAN

IPC: H01F17/04 ,  H01L23/00 ,  H01F27/28

Abstract: A microelectronics package, comprising a substrate that comprises a dielectric and an inductor component comprising one or more wires within a magnetic core over the dielectric. The inductor component is bonded to the substrate by one or more solder joints. A solder mask is between the inductor component and the dielectric. The one or more solder joints are surrounded by the solder mask, and wherein the solder mask comprises a magnetic material.