公开(公告)号：US20200294938A1

公开(公告)日：2020-09-17

申请号：US16353164

申请日：2019-03-14

Applicant: Intel Corporation

Inventor： Rahul JAIN ,  Kyu-Oh LEE ,  Islam A. SALAMA ,  Amruthavalli P. ALUR ,  Wei-Lun K. JEN ,  Yongki MIN ,  Sheng C. LI

IPC: H01L23/64 ,  H01L23/498 ,  H01L49/02 ,  H01L23/538

Abstract: Embodiments include semiconductor packages. A semiconductor package includes a plurality of build-up layers and a plurality of conductive layers in the build-up layers. The conductive layers include a first conductive layer and a second conductive layer. The first conductive layer is over the second conductive layer and build-up layers, where a first via couples the first and second conductive layers. The semiconductor package also includes a thin film capacitor (TFC) in the build-up layers, where a second via couples the TFC to the first conductive layer, and the second via has a thickness less than a thickness of the first via. The first conductive layer may be first level interconnects. The build-up layers may be dielectrics. The TFC may include a first electrode, a second electrode, and a dielectric. The first electrode may be over the second electrode, and the dielectric may be between the first and second electrodes.

公开(公告)号：US20200005983A1

公开(公告)日：2020-01-02

申请号：US16024718

申请日：2018-06-29

Applicant: Intel Corporation

Inventor： Malavarayan SANKARASUBRAMANIAN ,  Yongki MIN ,  Anne AUGUSTINE ,  Kaladhar RADHAKRISHNAN ,  Taylor GAINES ,  Ziyin LIN

IPC: H01F27/02 ,  H01F1/42 ,  H01F41/00 ,  H01F1/01 ,  H01L25/16 ,  H01L21/48 ,  H01F27/29

Abstract: Embodiments herein relate to a magnetic encapsulant composite, comprising a mixture of a first material that is a soft magnetic filler, a second material that is a polymer matrix, and a third material that is a process ingredient. The magnetic encapsulant composite may then encapsulate or partially encapsulate a magnetic inductor coupled to a substrate to increase the inductance of the magnetic inductor and/or to strengthen the substrate to which the magnetic inductor and the composite are coupled.

公开(公告)号：US20200013533A1

公开(公告)日：2020-01-09

申请号：US16026401

申请日：2018-07-03

Applicant: Intel Corporation

Inventor： Malavarayan SANKARASUBRAMANIAN ,  Anne AUGUSTINE ,  Yongki MIN ,  Kaladhar RADHAKRISHNAN

IPC: H01F17/04 ,  H01L23/00 ,  H01F27/28

Abstract: A microelectronics package, comprising a substrate that comprises a dielectric and an inductor component comprising one or more wires within a magnetic core over the dielectric. The inductor component is bonded to the substrate by one or more solder joints. A solder mask is between the inductor component and the dielectric. The one or more solder joints are surrounded by the solder mask, and wherein the solder mask comprises a magnetic material.