公开(公告)号：US20160358885A1

公开(公告)日：2016-12-08

申请号：US14778111

申请日：2014-12-03

Applicant: Intel Corporation

Inventor： Peter Chang ,  Michael Mayberry

IPC: H01L23/00 ,  H01L25/00

CPC classification number: H01L24/94 ,  H01L23/48 ,  H01L23/58 ,  H01L24/08 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/80 ,  H01L24/81 ,  H01L24/83 ,  H01L24/95 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/08145 ,  H01L2224/08225 ,  H01L2224/13023 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13144 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32227 ,  H01L2224/80006 ,  H01L2224/81005 ,  H01L2224/8114 ,  H01L2224/81801 ,  H01L2224/8385 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2924/10157 ,  H01L2924/15159 ,  H01L2224/11 ,  H01L2924/01079 ,  H01L2924/0105 ,  H01L2224/81 ,  H01L2224/80 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/83

Abstract: Some example forms relate a method of fabricating an electronic package. The method includes attaching a source wafer that includes micro devices to a target wafer. The method further includes removing a portion of the source wafer from the target wafer to form an electronic package. The micro devices remain on the target wafer when the source wafer is removed from target wafer. The method may further include performing post processing on the electronic package that is formed after the source wafer is removed from the target wafer. In some forms of the method, some of the micro devices remain on the source wafer when the source wafer is removed from target wafer.

Abstract translation: 一些示例性形式涉及制造电子封装的方法。 该方法包括将包括微器件的源晶片附接到目标晶片。 该方法还包括从目标晶片去除源晶片的一部分以形成电子封装。 当源晶片从目标晶片移除时，微器件保留在目标晶片上。 该方法还可以包括对源晶片从目标晶片上移除之后形成的电子封装进行后处理。 在该方法的一些形式中，当源晶片从目标晶片移除时，一些微器件保留在源晶片上。

公开(公告)号：US09859249B2

公开(公告)日：2018-01-02

申请号：US14778111

申请日：2014-12-03

Applicant: Intel Corporation

Inventor： Peter Chang ,  Michael Mayberry

IPC: H01L21/00 ,  H01L23/00 ,  H01L23/48 ,  H01L23/58 ,  H01L25/00

CPC classification number: H01L24/94 ,  H01L23/48 ,  H01L23/58 ,  H01L24/08 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/80 ,  H01L24/81 ,  H01L24/83 ,  H01L24/95 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/08145 ,  H01L2224/08225 ,  H01L2224/13023 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13144 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32227 ,  H01L2224/80006 ,  H01L2224/81005 ,  H01L2224/8114 ,  H01L2224/81801 ,  H01L2224/8385 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2924/10157 ,  H01L2924/15159 ,  H01L2224/11 ,  H01L2924/01079 ,  H01L2924/0105 ,  H01L2224/81 ,  H01L2224/80 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/83

Abstract: Some example forms relate a method of fabricating an electronic package. The method includes attaching a source wafer that includes micro devices to a target wafer. The method further includes removing a portion of the source wafer from the target wafer to form an electronic package. The micro devices remain on the target wafer when the source wafer is removed from target wafer. The method may further include performing post processing on the electronic package that is formed after the source wafer is removed from the target wafer. In some forms of the method, some of the micro devices remain on the source wafer when the source wafer is removed from target wafer.