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Patent Agency Ranking
公开(公告)号：US11114020B2
公开(公告)日：2021-09-07
申请号：US16329529
申请日：2016-10-01
Applicant: Intel Corporation
Inventor： Kunjal Parikh , Dong Yeung Kwak , Prakash Radhakrishnan , Peter Chang
Abstract: A mobile computing device comprising a Light Emitting Diode (LED) display; including a display panel and a substrate, and two or more controller integrated circuits mounted (ICs) mounted on the substrate to directly drive a serial interface into the display panel.
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公开(公告)号：US10217729B2
公开(公告)日：2019-02-26
申请号：US15283102
申请日：2016-09-30
Applicant: Intel Corporation
Inventor： Khaled Ahmed , Kunjal ShyamKumar Parikh , Peter Chang
IPC: H01L25/13 , H01L25/075 , H01L21/683 , H01L23/00 , H01L25/00
Abstract: Embodiments of the invention include systems and methods for transferring micro LEDs. In an embodiment, the system for transferring micro LEDs, may include a donor substrate bank that is capable of supporting a plurality of donor substrates on which a plurality of micro LEDs are formed. In an embodiment, the donor substrate bank is moveable in the X, Y, and Z directions. In an embodiment, the system may also include a host substrate table that is capable of supporting a host substrate. The host substrate may include a plurality of segments. In an embodiment, the host substrate table is moveable in the X, Y, and Z directions. Embodiments of the invention may also include an array of macro transfer heads. In an embodiment, each macro transfer head may include a plurality of micro transfer heads.
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公开(公告)号：US09859249B2
公开(公告)日：2018-01-02
申请号：US14778111
申请日：2014-12-03
Applicant: Intel Corporation
Inventor： Peter Chang , Michael Mayberry
CPC classification number: H01L24/94 , H01L23/48 , H01L23/58 , H01L24/08 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/80 , H01L24/81 , H01L24/83 , H01L24/95 , H01L25/50 , H01L2224/0401 , H01L2224/08145 , H01L2224/08225 , H01L2224/13023 , H01L2224/131 , H01L2224/13109 , H01L2224/13144 , H01L2224/16145 , H01L2224/16227 , H01L2224/32145 , H01L2224/32227 , H01L2224/80006 , H01L2224/81005 , H01L2224/8114 , H01L2224/81801 , H01L2224/8385 , H01L2224/94 , H01L2224/97 , H01L2225/06513 , H01L2924/10157 , H01L2924/15159 , H01L2224/11 , H01L2924/01079 , H01L2924/0105 , H01L2224/81 , H01L2224/80 , H01L2924/014 , H01L2924/00014 , H01L2224/83
Abstract: Some example forms relate a method of fabricating an electronic package. The method includes attaching a source wafer that includes micro devices to a target wafer. The method further includes removing a portion of the source wafer from the target wafer to form an electronic package. The micro devices remain on the target wafer when the source wafer is removed from target wafer. The method may further include performing post processing on the electronic package that is formed after the source wafer is removed from the target wafer. In some forms of the method, some of the micro devices remain on the source wafer when the source wafer is removed from target wafer.
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公开(公告)号：US09595581B2
公开(公告)日：2017-03-14
申请号：US14789856
申请日：2015-07-01
Applicant: Intel Corporation
Inventor： Kelin J. Kuhn , Seiyon Kim , Rafael Rios , Stephen M. Cea , Martin D. Giles , Annalisa Cappellani , Titash Rakshit , Peter Chang , Willy Rachmady
IPC: H01L29/06 , H01L29/10 , H01L29/423 , H01L29/78 , H01L29/165 , H01L29/16 , H01L27/12 , H01L27/092 , B82Y10/00 , H01L21/762 , H01L29/417 , H01L29/66 , H01L29/775 , H01L29/786
CPC classification number: H01L29/0673 , B82Y10/00 , H01L21/76224 , H01L27/0922 , H01L27/1203 , H01L29/0676 , H01L29/1033 , H01L29/16 , H01L29/165 , H01L29/41733 , H01L29/42392 , H01L29/66439 , H01L29/66742 , H01L29/66795 , H01L29/775 , H01L29/7848 , H01L29/785 , H01L29/78618 , H01L29/78654 , H01L29/78684 , H01L29/78696
Abstract: Methods of forming microelectronic structures are described. Embodiments of those methods include forming a nanowire device comprising a substrate comprising source/drain structures adjacent to spacers, and nanowire channel structures disposed between the spacers, wherein the nanowire channel structures are vertically stacked above each other.
Abstract translation: 描述形成微电子结构的方法。 这些方法的实施例包括形成纳米线装置，其包括基板，该基板包括与间隔物相邻的源极/漏极结构，以及设置在间隔物之间的纳米线通道结构，其中纳米线通道结构在彼此之上垂直堆叠。
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公开(公告)号：US20160358885A1
公开(公告)日：2016-12-08
申请号：US14778111
申请日：2014-12-03
Applicant: Intel Corporation
Inventor： Peter Chang , Michael Mayberry
CPC classification number: H01L24/94 , H01L23/48 , H01L23/58 , H01L24/08 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/80 , H01L24/81 , H01L24/83 , H01L24/95 , H01L25/50 , H01L2224/0401 , H01L2224/08145 , H01L2224/08225 , H01L2224/13023 , H01L2224/131 , H01L2224/13109 , H01L2224/13144 , H01L2224/16145 , H01L2224/16227 , H01L2224/32145 , H01L2224/32227 , H01L2224/80006 , H01L2224/81005 , H01L2224/8114 , H01L2224/81801 , H01L2224/8385 , H01L2224/94 , H01L2224/97 , H01L2225/06513 , H01L2924/10157 , H01L2924/15159 , H01L2224/11 , H01L2924/01079 , H01L2924/0105 , H01L2224/81 , H01L2224/80 , H01L2924/014 , H01L2924/00014 , H01L2224/83
Abstract: Some example forms relate a method of fabricating an electronic package. The method includes attaching a source wafer that includes micro devices to a target wafer. The method further includes removing a portion of the source wafer from the target wafer to form an electronic package. The micro devices remain on the target wafer when the source wafer is removed from target wafer. The method may further include performing post processing on the electronic package that is formed after the source wafer is removed from the target wafer. In some forms of the method, some of the micro devices remain on the source wafer when the source wafer is removed from target wafer.
Abstract translation: 一些示例性形式涉及制造电子封装的方法。 该方法包括将包括微器件的源晶片附接到目标晶片。 该方法还包括从目标晶片去除源晶片的一部分以形成电子封装。 当源晶片从目标晶片移除时，微器件保留在目标晶片上。 该方法还可以包括对源晶片从目标晶片上移除之后形成的电子封装进行后处理。 在该方法的一些形式中，当源晶片从目标晶片移除时，一些微器件保留在源晶片上。
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