公开(公告)号：US20210120703A1

公开(公告)日：2021-04-22

申请号：US17134368

申请日：2020-12-26

Applicant: Intel Corporation

Inventor： Prabhakar SUBRAHMANYAM ,  Arun KRISHNAMOORTHY ,  Victor POLYANKO ,  Ying-Feng PANG ,  Yi XIA ,  Pooya TADAYON ,  Muhammad AHMAD ,  Rahima K. MOHAMMED

IPC: H05K7/20

Abstract: An apparatus is described. The apparatus includes a liquid cooling system having multiple heat-exchangers and multiple valves. The multiple valves are to enable/disable participation of individual ones of the heat-exchangers within the liquid cooling system. The apparatus includes an information keeping device to store information that correlates a number of the multiple heat exchangers to be enabled to realize one or more semiconductor chips' target temperature for a power consumption of the one or more semiconductor chips for a plurality of combinations of target temperature and power consumption. The controller is coupled to the liquid cooling system and the information keeping device to dynamically determine during runtime of a system having the one or more semiconductor chips an appropriate number of the multiple heat exchangers to enable to realize a particular target temperature for the one or more semiconductor chips for a particular power consumption of the one or more semiconductor chips, and, update the information in the information keeping device with a new correlation that correlates the appropriate number with the particular target temperature and particular power consumption

公开(公告)号：US20230420338A1

公开(公告)日：2023-12-28

申请号：US18034133

申请日：2021-03-06

Applicant: Intel Corporation

Inventor： Prabhakar SUBRAHMANYAM ,  Tong Wa CHAO ,  Ying-Feng PANG ,  Yi XIA ,  Rahima K. MOHAMMED ,  Victor P. POLYANKO ,  Ridvan A. SAHAN ,  Guangying ZHANG ,  Guoliang YING ,  Chuanlou WANG ,  Jun LU ,  Liguang DU ,  Peng WEI ,  Xiang QUE

IPC: H01L23/473 ,  G06F1/20 ,  H01L23/367

CPC classification number: H01L23/473 ,  G06F1/206 ,  H01L23/3672 ,  G06F2200/201

Abstract: Techniques for heat sinks and cold plates for compute systems are disclosed. In one embodiment, a heat sink includes two sub-heat sinks that are mechanically connected but thermally isolated. The two sub-heat sinks can independently cool different dies on the same integrated circuit component. In another embodiment, a system includes an integrated circuit component that is cooled by a first water block and a second water block. The first water block forms a loop with a gap in it, and the second water block has a pedestal that extends through the gap in the first water block to contact the integrated circuit component. The first water block and the second water block can independently cool different dies on the same integrated circuit component.