公开(公告)号：US20230229594A1

公开(公告)日：2023-07-20

申请号：US18092278

申请日：2022-12-31

Applicant: Intel Corporation

Inventor： Kai CHENG ,  Divya GUPTA ,  Nikethan Shivanand BALIGAR ,  Vivek GARG ,  Aurelio RODRIGUEZ ECHEVARRIA ,  Russell J. WUNDERLICH

IPC: G06F12/0804 ,  G11C5/14

CPC classification number: G06F12/0804 ,  G11C5/141

Abstract: A system detects a powerdown event, such as a power loss event, and performs a flush of volatile memory to persistent memory during a powerdown sequence. The system includes an energy backup device to power the system during the powerdown sequence. The system is configurable with optional settings that configure the powerdown sequence specific to a type of the energy backup device.

公开(公告)号：US20250076954A1

公开(公告)日：2025-03-06

申请号：US18883276

申请日：2024-09-12

Applicant: Intel Corporation

Inventor： Vivek GARG ,  Ankush VARMA ,  Krishnakanth SISTLA ,  Nikhil GUPTA ,  Nikethan Shivanand BALIGAR ,  Stephen WANG ,  Nilanjan PALIT ,  Timothy Yee-Kwong KAM ,  Adwait PURANDARE ,  Ujjwal GUPTA ,  Stanley CHEN ,  Dorit SHAPIRA ,  Shruthi VENUGOPAL ,  Suresh CHEMUDUPATI ,  Rupal PARIKH ,  Eric DEHAEMER ,  Pavithra SAMPATH ,  Phani Kumar KANDULA ,  Yogesh BANSAL ,  Dean MULLA ,  Michael TULANOWSKI ,  Stephen Paul HAAKE ,  Andrew HERDRICH ,  Ripan DAS ,  Nazar Syed HAIDER ,  Aman SEWANI

IPC: G06F1/28 ,  G06F1/30 ,  G06F13/20

Abstract: Hierarchical Power Management (HPM) architecture considers the limits of scaling on a power management controller, the autonomy at each die, and provides a unified view of the package to a platform. At a simplest level, HPM architecture has a supervisor and one or more supervisee power management units (PMUs) that communicate via at least two different communication fabrics. Each PMU can behave as a supervisor for a number of supervisee PMUs in a particular domain. HPM addresses these needs for products that comprise a collection of dice with varying levels of power and thermal management capabilities and needs. HPM serves as a unified mechanism than can span collection of dice of varying capability and function, which together form a traditional system-on-chip (SoC). HPM provides a basis for managing power and thermals across a diverse set of dice.