公开(公告)号：US20250076954A1

公开(公告)日：2025-03-06

申请号：US18883276

申请日：2024-09-12

Applicant: Intel Corporation

Inventor： Vivek GARG ,  Ankush VARMA ,  Krishnakanth SISTLA ,  Nikhil GUPTA ,  Nikethan Shivanand BALIGAR ,  Stephen WANG ,  Nilanjan PALIT ,  Timothy Yee-Kwong KAM ,  Adwait PURANDARE ,  Ujjwal GUPTA ,  Stanley CHEN ,  Dorit SHAPIRA ,  Shruthi VENUGOPAL ,  Suresh CHEMUDUPATI ,  Rupal PARIKH ,  Eric DEHAEMER ,  Pavithra SAMPATH ,  Phani Kumar KANDULA ,  Yogesh BANSAL ,  Dean MULLA ,  Michael TULANOWSKI ,  Stephen Paul HAAKE ,  Andrew HERDRICH ,  Ripan DAS ,  Nazar Syed HAIDER ,  Aman SEWANI

IPC: G06F1/28 ,  G06F1/30 ,  G06F13/20

Abstract: Hierarchical Power Management (HPM) architecture considers the limits of scaling on a power management controller, the autonomy at each die, and provides a unified view of the package to a platform. At a simplest level, HPM architecture has a supervisor and one or more supervisee power management units (PMUs) that communicate via at least two different communication fabrics. Each PMU can behave as a supervisor for a number of supervisee PMUs in a particular domain. HPM addresses these needs for products that comprise a collection of dice with varying levels of power and thermal management capabilities and needs. HPM serves as a unified mechanism than can span collection of dice of varying capability and function, which together form a traditional system-on-chip (SoC). HPM provides a basis for managing power and thermals across a diverse set of dice.

公开(公告)号：US20210191490A1

公开(公告)日：2021-06-24

申请号：US17191564

申请日：2021-03-03

Applicant: Intel Corporation

Inventor： Phani Kumar KANDULA ,  Eric J. DEHAEMER ,  Dorit SHAPIRA ,  Ramkumar NAGAPPAN ,  Vivek GARG ,  Fuat KECELI ,  Mani PRAKASH ,  David C. HOLCOMB ,  Horthense D. TAMDEM ,  Olivier FRANZA ,  Vjekoslav SVILAN

IPC: G06F1/324

Abstract: Methods and apparatus for balancing power between discrete components, such as processing units (e.g., CPUs) and accelerators in a compute node or platform. Power consumption of the compute platform is monitored to detect for conditions under which a threshold (e.g., power supply capacity threshold) is exceeded. In response, the operating frequencies of a processing unit and/or other platform components such as accelerators, are adjusted to reduce the power consumption of the platform to return below the threshold. Power limit biasing hints (scaling weights) are provided to platform components, along with a power violation index, which are used to adjust the operating frequencies of the platform components. Optionally, a processing unit can calculate the power violation index and the scaling weights and directly control the frequencies of itself and platform components. Embodiments of multi-socket platforms are also provided.

公开(公告)号：US20200225724A1

公开(公告)日：2020-07-16

申请号：US16833008

申请日：2020-03-27

Applicant: Intel Corporation

Inventor： Chris MACNAMARA ,  John J. BROWNE ,  Tomasz KANTECKI ,  David HUNT ,  Anatoly BURAKOV ,  Srihari MAKINENI ,  Nikhil GUPTA ,  Ankush VARMA ,  Dorit SHAPIRA ,  Vasudevan SRINIVASAN ,  Bryan T. BUTTERS ,  Shrikant M. SHAH

IPC: G06F1/324 ,  G06F1/3296 ,  G06F9/50 ,  G06F1/20

Abstract: Examples herein relate to assigning, by a system agent of a central processing unit (CPU), an operating frequency to a core group based priority level of the core group while avoiding throttling of the system agent. Avoiding throttling of the system agent can include maintaining a minimum performance level of the system agent. A minimum performance level of the system agent can be based on a minimum operating frequency. Assigning, by a system agent of a central processing unit, an operating frequency to a core group based priority level of the core group while avoiding throttling of the system agent can avoid a thermal limit of the CPU. Avoiding thermal limit of the CPU can include adjusting the operating frequency to the core group to avoid performance indicators of the CPU. A performance indicator can indicate CPU utilization corresponds to Thermal Design Point (TDP).