公开(公告)号：US20250076954A1

公开(公告)日：2025-03-06

申请号：US18883276

申请日：2024-09-12

Applicant: Intel Corporation

Inventor： Vivek GARG ,  Ankush VARMA ,  Krishnakanth SISTLA ,  Nikhil GUPTA ,  Nikethan Shivanand BALIGAR ,  Stephen WANG ,  Nilanjan PALIT ,  Timothy Yee-Kwong KAM ,  Adwait PURANDARE ,  Ujjwal GUPTA ,  Stanley CHEN ,  Dorit SHAPIRA ,  Shruthi VENUGOPAL ,  Suresh CHEMUDUPATI ,  Rupal PARIKH ,  Eric DEHAEMER ,  Pavithra SAMPATH ,  Phani Kumar KANDULA ,  Yogesh BANSAL ,  Dean MULLA ,  Michael TULANOWSKI ,  Stephen Paul HAAKE ,  Andrew HERDRICH ,  Ripan DAS ,  Nazar Syed HAIDER ,  Aman SEWANI

IPC: G06F1/28 ,  G06F1/30 ,  G06F13/20

Abstract: Hierarchical Power Management (HPM) architecture considers the limits of scaling on a power management controller, the autonomy at each die, and provides a unified view of the package to a platform. At a simplest level, HPM architecture has a supervisor and one or more supervisee power management units (PMUs) that communicate via at least two different communication fabrics. Each PMU can behave as a supervisor for a number of supervisee PMUs in a particular domain. HPM addresses these needs for products that comprise a collection of dice with varying levels of power and thermal management capabilities and needs. HPM serves as a unified mechanism than can span collection of dice of varying capability and function, which together form a traditional system-on-chip (SoC). HPM provides a basis for managing power and thermals across a diverse set of dice.