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公开(公告)号:US20180166294A1
公开(公告)日:2018-06-14
申请号:US15377635
申请日:2016-12-13
Applicant: Intel Corporation
Inventor: Zheng Zhou , Yi Li , Tao Wu , Nikhil Sharma
IPC: H01L21/3105 , H01L21/683 , H01L21/56 , H05B3/22
CPC classification number: H05B3/22 , H01L21/31058 , H01L21/4846 , H01L23/498 , H01L2021/607 , H05B2203/033
Abstract: Embodiments herein relate to methods and apparatus to achieve substantially uniform package thickness after forming a buildup layer on a package substrate of an integrated circuit. Some embodiments include applying a resin to the buildup layer to form a resin layer on top of at least a portion of the buildup layer and substantially evening out the surface formed by the resin layer. Some embodiments include vibrating a hot press onto the top surface of the buildup layer and vibrating the hot press in an ultrasonic and/or a scrubbing motion. Other embodiments may be described and/or claimed.