公开(公告)号：US20180166294A1

公开(公告)日：2018-06-14

申请号：US15377635

申请日：2016-12-13

Applicant: Intel Corporation

Inventor： Zheng Zhou ,  Yi Li ,  Tao Wu ,  Nikhil Sharma

IPC: H01L21/3105 ,  H01L21/683 ,  H01L21/56 ,  H05B3/22

CPC classification number: H05B3/22 ,  H01L21/31058 ,  H01L21/4846 ,  H01L23/498 ,  H01L2021/607 ,  H05B2203/033

Abstract: Embodiments herein relate to methods and apparatus to achieve substantially uniform package thickness after forming a buildup layer on a package substrate of an integrated circuit. Some embodiments include applying a resin to the buildup layer to form a resin layer on top of at least a portion of the buildup layer and substantially evening out the surface formed by the resin layer. Some embodiments include vibrating a hot press onto the top surface of the buildup layer and vibrating the hot press in an ultrasonic and/or a scrubbing motion. Other embodiments may be described and/or claimed.